ScopePhi Interposer Blueprint
Special Price
$500,000.00
Regular Price
$2,000,000.00
In stock
SKU
SCOPEPHI-INTERPOSER
Complete design package for the ScopePhi Interposer: 28-layer, 94.0 x 62.0 mm, 1,536 die-side pads at 0.8 mm pitch, 1,536 board-side pads at 2.0 mm pitch, Megtron 6 class HDI.
ScopePhi Interposer Blueprint
The 1,536-ball interposer that bonds the ScopePhi die to the ScopePhi Card. 28-layer HDI with 22 signal layers, blind + buried + stacked microvia.
Spec:
- Die side: 1,536 pads, 48×32 array, 0.800 mm pitch, 37.60 × 24.80 mm
- Board side: 1,536 pads, 48×32 array, 2.000 mm pitch, 94.00 × 62.00 mm
- Stackup: TOP, GND1, SIG1–18, PWR1, PWR2, GND2, SIG19–22, BOTTOM
- Microvia 0.20/0.10 mm; blind via 0.40/0.20 mm; 0.075 mm track; 0.125 mm netclass clearance
- 162 of 165 real signal nets routed; last 3 close with manual GUI pass
Deliverable (ships now): Gerbers, Excellon drill, IPC-2581, 3D STEP, pick-and-place, IPC-D-356 netlist, PDF layer book, fab-notes README for Advanced Circuits.
Patent pending: USPTO 19/835,210. Non-exclusive.
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