ScopePhi Performance IC Blueprint
Special Price
$437,500,000,000.00
Regular Price
$1,750,000,000,000.00
In stock
SKU
SCOPEPHI-PERF-IC
Complete design package for the ScopePhi Performance (QIC-106) die: ~20 Z-OPS per die, two reticles edge-stitched (CoWoS-L / EMIB-T), 1,716 mm2 die, 7x the per-die compute of ScopePhi.
ScopePhi Performance IC Blueprint
Two reticles stitched edge-to-edge into a single die, ~7× the per-die compute of the one-reticle ScopePhi.
Spec:
- 1,716 mm² die (two 858 mm² reticles stitched on-wafer)
- Stitching via TSMC CoWoS-L or Intel EMIB-T (production-grade today)
- Doubles the voxel count and the ball count from ScopePhi
- ~20 Z-OPS per die
- Same EMIC + Normal Resonance architecture, scaled
Deliverable: AES-256-encrypted Blu-ray with the stitched tape-out package when first silicon ships — two-reticle top integration, stitching bridge nets, scaled interposer, scaled carrier board, foundry-ready submission package.
Non-exclusive on purpose: multiple patrons may pledge; each receives their own copy; the IP, package program and routing pipeline stay with the inventor. Patent pending: USPTO 19/835,210.
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