ScopePhi IC Blueprint
ScopePhi IC Blueprint
Complete design package for the ScopePhi die, named for the reticle (the chip-fab mask) and the scope crosshair that share the same root word. One shot of the stepper prints the whole die.
Spec:
- 858 mm² full-reticle die, 40×40 mm BGA-1536 package
- 24 chiplets stacked, each 3,000 CFET voxel layers = 72,000 voxel layers
- ~2.9 Z-OPS per die (Z-OPS = 1021 OPS)
- Three-strand compute: quantum + photonic + classical
- Internal quantum battery + 75 W (or more) external supply
- EMIC cooling (patent pending) + Normal Resonance NRS-1 (USPTO 19/829,894)
Deliverable: AES-256-encrypted Blu-ray containing the complete tape-out package when first silicon ships — Verilog top (qic105_top.v), 40+ RTL cores (PCIe bridge, QBeam RX/TX, EMIC control, LED power recycler, hybrid CPU, Phantom SoC, light-trigger, etc.), the 1,536-ball bump map, synthesis flow, and fab-notes for the chosen foundry node.
Non-exclusive on purpose: multiple patrons may pledge; each receives their own copy; the IP, package program and routing pipeline stay with the inventor. Patent pending: USPTO 19/835,210 (umbrella) + 19/722,805 (QBeam).