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PhantasmPhi Phase II

1.5M parts, a regional QBeam fleet — 1.62 ronna probability-OPS, 5,384× the guaranteed 300 Z-OPS floor; 37.8B logical qubits. 2.52 GW net. The part is QIC-105: an 858 mm² full-reticle die in the real 40×40 mm BGA-1536 die-side package, 18-chiplet stack × 1,500 CFET layers = 27,000 voxel-layers, with QBeam SEND and RECEIVE integrated on-package (ExitPhi, USPTO App 19/722,805): Bell-measure transmit ? 2 classical bits over the CoolBeam phased array ? I/X/Y/Z receive correction; 4-lane chain + PipeBeam ordering + 48-channel nanophotonic transceive. QBeam carries bytes, never compute OPS. Phase II is a ladder of 20 blueprints: from one 7 nm QIC die (1.40 E-OPS) and a 3-chiplet stack, through a 2 nm chiplet, a QBeam pair, racks, rows, pods and halls, up to this regional fleet and a 4.71M-part multi-datacenter fleet at 5.07 R-OPS. A master license covers every Phase-II generation.

Gift raiser

Your own AES-256-encrypted Blu-ray Complete engineering package: KiCad PCB + schematics + netlists + flat BOM for the board SKUs; Verilog top + RTL cores + bump map + synthesis config for the IC SKUs Shipped when first silicon of that piece ships. The pledge Your pledge funds the tape-out No loan to pay back, no board seat to give up, no clock running down on when you get what you paid for. The clock runs on the fab. Pledge the asking price on any one of the five pieces below; your copy of the engineering package comes back on a Blu-ray when first silicon ships. Non-exclusive on purpose: several patrons may pledge on one piece and each gets their own copy, while the IP stays with the inventor. Every piece's page ends with its full deliverable checklist, what could go wrong and what was done about it, and the tests behind each figure, linked to primary sources.