Pick a ball count — 256, 900 or 1536 — and you get the whole PCIe 5.0 accelerator platform for your silicon as source files: the BGA footprint and symbol, the routed reference board, the interposer stack, and the Python tooling that built it all. Drop your die on U16, hand it to your fab.
Every board here is a PCIe 5.0 carrier for AutoPhi's own quantum silicon — the V18 Seed series, the V18 AQC catalog (1,000+ parts at 1.5 nm), and the APM Modern generations. Pick the board that matches the AutoPhi chip you're integrating.
| Board | Package | AutoPhi Quantum Chips that drop onto this footprint |
|---|---|---|
| BGA-256 APV19-BGA-0256-V1 |
16×16 balls at 1.8 mm, 30×30 mm body |
V18-Seed Voxel Processor (APV18-SEE-XXXX-130NM) — Kilo & Mega class, 130 nm, 1–16 qubits. The evaluation-tier carrier: prototype an AutoPhi seed core, run photonic circuit validation, ship a lab-class demo. Also carries the APM01‑E Edge Core (14 nm, 42 mm², 8 PFLOPS) and APM01‑N Spike Core (neuromorphic, 16 PetaSynOPS). |
| BGA-900 APV19-BGA-0900-V1 |
30×30 balls at 0.8 mm, 26×26 mm body |
V18 AQC Quantum Chip mid-tier (APV18-AQC-XXXX-1.5NM) — the middle band of AutoPhi's 1,000-part quantum catalog at 1.5 nm. Also lands the APM01 Scale Core (CPU, 110 mm², 48 PFLOPS), Nexus Core (DPU, 95 mm²) and Vision Core (130 mm², 210 PFLOPS). Room for 16–32 SerDes lanes plus quantum interconnect. |
| BGA-1536 APV19-BGA-1536-V1 |
48×32 balls at 0.8 mm, 40×40 mm die‑side 95×90 mm mount side |
Flagship AutoPhi silicon — the full-fat AQC parts at the top of the catalog and the biggest APM01 dies: REV Core (GPU, 220 mm², 380 PFLOPS), Train Core (280 mm², 620 PFLOPS FP16/BF16/FP8), Lingua Core (LLM engine, 250 mm², 520 PFLOPS), and the Qubit Core (100 mm², 32 PFLOPS + 256 qubits, QEC). Sized for 64+ SerDes lanes, dual QSFP28 optics, and a dense management fabric. |
All nine Ultimate Technologies — LED Power Recycling, Vertical Threading, Chiplet Stacking, Nanophotonic Data Flow, Quantum Error Correction, Electromagnetic Cooling, Quantum Battery Layers, Quantum-Classical Hybrid, and the Neuromorphic AI Engine — are integrated on-die on every APM chip that lands on these carriers.
Bank allocation on each board is a starting map (HSIO on outer rings, planes in the core). The pinmap CSV in each design bundle is the source of truth for the specific AutoPhi part you're landing.
Browse AutoPhi collections → Find your AutoPhi Quantum Chip →
87 projects, and every one of them has a full engineering sheet — what it is, how the thing actually works stage by stage, what ships in the box, and, plainly stated, what still needs solving before anyone could build it. Hover any sheet to magnify it and read the real detail, or click straight through to the project itself.
Nothing here is dressed up. Every sheet carries a panel called “Problems Out Loud” that states the constraints still in the way — the bus current that actually limits a drive, the yield question behind a 500-layer stack, the trials that have not been run. Where a design is only a concept, its sheet says so in the same breath as the claim. Prices come straight from the live catalogue, so what you read on a sheet is what the project actually sells for.
Engineering blueprints — 87 projects
Live vector SVG. All 87 sheets as one PDF batch — $3.00, instant download. No use sold — a copy of the product summary only. Get all 87 sheets — $3.00These words are a tag cloud - the bigger the word, the more it connects across our projects. Pick any word that catches your eye and start exploring.