Extended catalog & full narrative — Write* Engineering-Package Acquisition

The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.

Write* Engineering-Package Acquisition — You Become the Write* Vendor

Full acquisition of commercialization rights. You get everything, own everything, control everything. Chris steps aside; you become the Write* platform vendor for the world.

What You're Acquiring

All Six Sub-Blueprints (Editable Formats)

• Writer (KiCad 10 source, firmware source, mechanical CAD)
• Blank (chemistry recipes, process parameters, vendor lists)
• Dicer (KiCad 10 source, firmware source, calibration procedures)
• Package (M + H schematics, mechanical CAD, assembly procedures)
• Chassis (KiCad 10 source, firmware source, thermal analysis)
• Library (SDK source, 5 reference IC designs, .wpprog format spec)

Design Documentation (65+ Files)

Every specification, every note, every design decision. Total: ~2500 pages of technical content, all editable.

Manufacturing Know-How

• Chris's actual notes from prototyping and production
• Vendor relationships (introductions to Chris's suppliers)
• Process troubleshooting guides (what went wrong, how it was fixed)
• Yield optimization data

Chris's Consulting Time

• 8 weeks embedded with your team for technical handoff
• On-site (travel expenses reimbursed) or remote (your choice)
• Documented handoff plan tailored to your team's structure
• Ongoing consulting available at /hr after the 8-week embed

Rights You Acquire

• Unlimited manufacture + distribution (USA + international)
• Right to modify designs and create derivative variants
• Right to sell the business to a subsequent buyer (you're the vendor now)

Restrictions

• US law compliance: ITAR, EAR, and other US export controls apply (Chris will help navigate)
• No moral rights waiver: Chris retains the right to be credited as original inventor in academic/technical contexts
• No compete with Chris directly: Chris retains right to operate other unrelated invention businesses (CRI-ONE, Uni*, Aero*, etc.) that are separate from Write*

Fulfillment Process

1. Purchase: Order placed via cri-one.com store or direct invoice (for wire transfer preference)
2. Term Sheet: Chris sends detailed acquisition agreement PDF (typically 15-25 pages) within 5 business days
3. Buyer review: Your legal counsel reviews (typically 2-4 weeks; Chris available for negotiation on non-essential terms)
4. Signing: DocuSign or wet ink signature
5. Payment: Wire transfer or escrow (Chris's preference: escrow for buyer protection)
6. Delivery: Secure download (encrypted zip, key delivered separately) + physical shipment of any hard-copy materials
7. Handoff: 8-week embedded consulting begins

Financing Available

is a significant purchase. Options:

• Milestone-based Term Sheet: 20% at signing, 30% at 90 days, 30% at 180 days, 20% at 12 months (subject to milestones met)
• Wire transfer with escrow: Standard commercial escrow arrangement
• Financing partners: Chris can introduce you to boutique investment banks specializing in acquisitions of this size

Why ?

Rough valuation basis:

• Sunk cost: ~3 years of Chris's full-time inventor work (~-1M at consulting rates)
• Comparable acquisitions: Small semiconductor platform deals typically -50M
• Revenue potential: Estimated -500M/year at commercial scale (based on maker/prosumer/enterprise markets)
• Strategic value: Home chip fabrication is a category-defining technology

The price is negotiable. Chris will consider serious offers.

Post-Acquisition

You now own Write*. Chris steps aside as vendor. Chris remains available as paid consultant (/hr) but you set the roadmap, you own the customer relationships, you decide what Write* becomes.

Portfolio conversation — Write* (Project 57) + Write* Devices (Project 58)

These two product families are one continuous story in two chapters, not unrelated store listings. Write* (Project 57) is the kitchen-table fabrication layer: Writer ? Blank ? Dicer ? PKG ? Chassis ? Library makes replaceable Write* dies at the bench. Write* Devices / WPD (Project 58) is the deployment layer for those same dies: the V2 inset package (carried forward from WRITEPHI-PKG and cut geometry from WRITEPHI-DICER) drops into pinned sockets on a reference PCIe 5.0 card, where Windows-facing CSD and ACCEL personas plus on-card firmware turn a homemade die into a plug-and-play host peripheral.

If you are buying on this page, you are in the make chapter. An OEM or power user who completes the 57 pipeline and wants volume-manufacturable packaging plus a Windows card stack continues in the run chapter — browse Write* Devices (WPD) on the same store. Neither family requires the other to be useful alone; together they describe the full path from blank substrate to installed Windows accelerator.

Fulfillment: Instant download after checkout. SHA-256 checksum published for integrity verification.

Region: USA-only (nginx geoblocking enforced). International buyers: contact us for special licensing.

Currency: USD only. Sub- via standard checkout (Stripe). Over : Term Sheet financing available.

Support: crioneaka@outlook.com | Christopher Gabriel Brown, Inventor | 24-48hr response.

Chris's philosophy: Every design engineered by hand. If it's specced, it works. If it has limits, we say so.

© 2026 Christopher Gabriel Brown · cri-one.com