35-autophi-quantum-pcie5
Asset valuation: $5,000,000,000. Inventor: Christopher Gabriel Brown Website: CRI-ONE.COM Date: March 31, 2026 Last edited: 2026-04-24 Complete engineering blueprint for a PCIe 5.0 x16 accelerator card built around the AutoPhi Quantum Battery System IC. 34 I/O bracket variants, custom autorouter wi
A circuit board should come out of the computer the way a page comes out of a printer: you ask, and a finished sheet lands in the tray. This board engine does that for a PCIe 5.0 x16 add-in card. One Python command runs a seven-stage pipeline and returns a fully routed, design-rule-checked card as KiCad 7 files, Gerber and drill data, previews and a bill of materials. Behind it sits a knowledge base built from Texas Instruments reference designs, 453 curated TI articles and the AutoPhi project ecosystem. The Gen 5 numbers are baked in: 32 gigatransfers per second per lane, a 36 decibel loss budget, 85 ohm differential pairs on Megtron 6, twelve-, eight- and six-layer stackups, and the via, clearance and length-matching rules.
At the centre of the card is the AutoPhi Quantum Battery System IC, with a Lattice FPGA on I/O and four retimers carrying the sixteen lanes. It ships with 22 custom KiCad footprints, 34 I/O bracket variants, 10 tier-scaled board configurations and the TI TIDA-00423 Gerber and drill set so a buyer's engineer can cross-validate the output. Option B swaps in a four-port 100GbE QSFP28 signal conditioner. It is for a datacenter operator or board house that wants a Gen 5 card it can send to fabrication, not a slide about one, and for a licensee who wants the engine. The quantum battery IC and its filings stay with the inventor; the buyer walks away with the engine, the reference design and every rule that made it pass.
Description
AutoPhi Quantum PCIe 5.0 Board Engine & Reference Design
Patent Status: Patent pending / granted.
AutoPhi Quantum PCIe 5.0 is a complete, production-grade board-engine package that generates fully routed, DRC-verified PCIe 5.0 ×16 add-in cards from a single Python command. The engine combines a retrieval-augmented generation (RAG) knowledge base — built from Texas Instruments reference designs, 453 curated TI technical articles, and the full AutoPhi project ecosystem — with a seven-stage build pipeline that outputs KiCad 7 PCB files, Gerber/Excellon manufacturing data, SVG previews, and a bill of materials. The package ships with 22 custom KiCad footprints, 34 I/O bracket schematic variants, 10 tier-scaled board configurations, and the complete TI TIDA-00423 reference design Gerber/drill set for cross-validation. Two board topologies are included: Option A (PCIe 5.0 ×16 flagship with DS160PR810 retimers) and Option B (4-port 100GbE QSFP28 signal conditioner based on the TI TIDA-00427 architecture with DS280BR810 linear repeaters).
PCIe 5.0 Electrical Specification
Additional outline constants: bracket tab 4.42 × 6.35 mm; gold-finger extension 3.18 mm; connector width 84.0 mm (×16 edge); key-notch offset 57.15 mm; mounting-hole drill 3.2 mm with 6.0 mm pad.
Also included: 8-layer PCIe 5.0 Compact (0.13 mm dielectric) and 6-layer Basic (0.20 mm dielectric) stackups.
U1 AutoPhi QB SysIC BGA-256 (20.0 × 20.0 mm, 1.0 mm pitch) AutoPhi Quantum Battery System IC — 256 pads, 16 × 16 grid (rows A–T, skip I/O, cols 1–16)
U20 iCE40UP5K QFN-48 (7.0 × 7.0 mm, 0.5 mm pitch) Lattice iCE40 UltraPlus 5K FPGA for I/O management
U21, U22 ADS1115 MSOP-10 (3.0 × 3.0 mm) 16-bit ADC for voltage/current monitoring (8 channels total)
Based on the TI TIDA-00427 architecture (reference document tidubg6.pdf).
U40 DS280BR810 NFBGA-135 (13.0 × 8.0 mm, 0.8 mm pitch) 28 Gbps 8-ch linear repeater, QSFP28 ports 0–1
U43 TPS75725 TO-263-5 (10.16 × 9.85 mm) 1 A fast-transient 2.5 V LDO (DS280BR810 core rail)
U44 MSP430F5529 LQFP-80 (12.0 × 12.0 mm, 0.5 mm pitch) USB MCU — I2C/EEPROM config controller
U45–U52 TPD4E004 USON-6 (1.5 × 1.0 mm) 4-ch ESD arrays — 2 per QSFP28 port (TX + RX), 8 total
The engine includes a curated knowledge base extracted from the complete TI TIDA-00423 reference design. Key data objects:
Object Content
TI_DS80PCI810_CONFIG Retimer pin-mode configuration: EQ Level 0, VOD Level 6 (max linearity), RXDET float, ENSMB disabled (1K to GND), no firmware/I2C host required
TI_BOM_CRITICAL Critical BOM: 4 × DS80PCI810NJY retimers (54-LLP QFN), 2 × LP3878MR-ADJ LDOs (PSOP-8, adj 0.8 A), 128 × 0.22 µF 0201 X5R decoupling caps (Taiyo Yuden LMK063BJ224MP-F), 4 × 10 µF 0603 bulk caps (TDK C1608Y5V0J106Z), 164-pin edge connector (Sullins NWE82DHRN-T9410), 26 × 49.9 Ω 0402 1% termination resistors
TI_COMPLIANCE_RESULTS Tested at 2.5/5.0/8.0 Gbps (Gen 1/2/3), all 11 presets (P0–P10) pass. Best at 8 Gbps: Preset 4 — min eye width 91.087 ps, total jitter 33.913 ps (at 10 −12 ), random jitter RMS 0.464 ps, composite eye height 0.137 V. Link EQ response 200 ns (max allowed 500 ns). BER: zero errors at 10 12 bits. DS80PCI810 transparent to preshoot/de-emphasis (≈0.77 dB delta)
TI_PCIE_PINOUT 164-pin connector: 82 A-side + 82 B-side. Key pins: A1=PRSNT1#, A11=PERST#, A12/A13=REFCLK (diff), B1–B3=+12 V, B4–B7=GND, B8–B10=+3.3 V/+3.3VAUX
TI_LAYOUT_INSIGHTS Original 6-layer board designed in Cadence Allegro 16.6-S019 (Jan 2015). 440 total drill holes: 409 × 10 mil vias, 10 × 39.37 mil connector pins, 19 × 40 mil, 2 × 125 mil mounting holes
TI_LAYOUT_FUNDAMENTALS 41-page TI high-speed layout seminar (slyp173.pdf): FR-4 trace physics (10 nH and 2.0 pF per inch), ground-plane rules, return-current rules, differential routing rules, via spacing ≤ 0.25 cm, decoupling rules, power-plane coupling rules. High-speed threshold: >100 MHz
slyp173 TI High Speed Analog Design Seminar — Section 5 (41 pages, PCB layout fundamentals)
Beyond the 10 bracket profiles, the package includes 34 complete schematic variants spanning every major connector standard:
- Stackup Configuration — selects 6, 8, or 12-layer stackup with correct dielectric, copper weights, and layer assignments
- Board Outline Generation — creates PCI-SIG CEM-compliant polygon with bracket tab, gold-finger extension, connector zone, and mounting holes
- Component Placement — zone-based placement engine positions all ICs, connectors, passives, and mounting hardware
- Trace Routing — priority-ordered routing: differential pairs first (on inner stripline layers), then power buses, then I2C/SPI daisy chains, then general I/O. Uses nearest-neighbour chaining for efficient trace paths
- GND Via Stitching — generates perimeter ground vias (8 mm pitch), IC ring vias (12° pitch, 14 mm radius), and high-speed-adjacent stitching vias (0.75 mm pitch, both sides of each differential pair)
- Copper Zone Filling — generates power and ground copper pours on designated layers
- PCB File Export & Validation — writes KiCad 7 .kicad_pcb file with full netlist, runs integrated DRC (trace widths, diff-pair spacing, via counts, clearances, board bounds), and optionally validates with KiCad CLI
- TRACE_WIDTH — verifies every trace meets its net-type width requirement (within 90% tolerance)
- DIFF_PAIR_SPACING — checks adjacent differential pairs maintain 0.508 mm guard spacing
- VIA_COUNT — ensures PCIe RX pairs do not exceed 2 vias
- CLEARANCE — validates inter-trace clearance on same-layer segments
- BOARD_BOUNDS — confirms all components are within the board outline polygon
- Trace loss = length (inches) × 1.0 dB/inch (Megtron 6 at 16 GHz)
- Via loss = via count × 0.3 dB per transition
- Total must be ≤ 36 dB budget
Project Ecosystem Integration
The RAG knowledge base maps 12 resource projects (technology that feeds the board design) and 22 need projects (applications that use the board). Resource projects include:
- 05-quantum-battery — provides U1 AutoPhi BGA-256 IC: LED Power Recycler (32 zones, 90% efficient), Quantum Battery Controller (20-layer, 1500 Wh, 75 MW burst), EM Cooling (32 thermal zones, 97% efficient), Quantum Execution Unit (16-instruction gate set). AES substrate: 400 W/m·K thermal conductivity, 12,000 cm²/V·s electron mobility
- 23-zetta-flops — defines compute platform context (APM02–APM12, 2026–2063, 28 ZFLOPS per chassis, 10 accelerator types)
- 31-autophi-electromagnetic-ic — 142 IC designs, 3,500 inventions catalog, 13 USPTO patents
- 21-day-one-fabrication — OpenLANE2 RTL-to-GDSII flow (14 nm to 2 nm process nodes)
- 24-parts-future — 1,000+ parts database for BOM sourcing
- 36-wonderphi — local RAG server (Flask/ChromaDB) and universal driver for 142 ICs
autophi_engine/rag/rules.py PCIe 5.0 design rules, material specs, form factors, clearances, loss budget calculator
autophi_engine/rag/stackup.py 6/8/12-layer stackup definitions with KiCad & TI layer mappings
autophi_engine/rag/components.py Complete component library (40+ ICs, connectors, mounting hardware), BGA-256 pin map, footprint bindings, board-readiness checks
autophi_engine/rag/netlist.py Full netlist: 18 net categories, Options A & B, helper functions
autophi_engine/rag/io_configs.py 10 I/O bracket configurations with 13 connector templates and pricing
autophi_engine/rag/ti_knowledge.py TI TIDA-00423 curated knowledge: retimer config, BOM, compliance results, pinout, layout insights, 41-page layout-fundamentals extraction
autophi_engine/rag/project_ecosystem.py 12 resource projects + 22 need projects mapped to I/O configs
autophi_engine/layout/board.py BoardOutline generator: CEM-compliant polygon, connector zone, bracket zone, mounting holes
autophi_engine/layout/router.py Priority-based trace router: diff pairs, power, I2C, SPI, I/O with nearest-neighbour chaining
autophi_engine/layout/via_stitcher.py GND via stitching: perimeter, IC ring, diff-pair-adjacent patterns
The package includes the complete TI TIDA-00423 DS80PCI810 reference design manufacturing data for cross-validation:
- 6-layer Gerber set: 01_TOP, 02_GND1, 03_POWER1, 04_POWER2, 05_GND2, 06_BOTTOM
- Assembly layers: ASSEMBLY_TOP, ASSEMBLY_BOTTOM
- Mask layers: TOP_MASK, BOTTOM_MASK
- Paste layers: TOP_PASTE, BOTTOM_PASTE
- Silk layers: TOP_SILK, BOTTOM_SILK
- Placement layers: PLACE_TOP, PLACE_BOTTOM, PLACE_COMP
- FAB drawing layer
- Drill file: TIDA00423_DS80PCI810_REFERENCE_DESIGN_PCB-1-6.drl
- NC drill log and parameters
- OrCAD schematic: TIDA00423_Schematic.DSN
- KiCad conversion: TIDA00423_DS80PCI810_REFERENCE_DESIGN_PCB.kicad_pcb
- TI reference design PDF: tidrd11.pdf
Also Included
- Complete KiCad footprint master library (kicad-footprints-master) — thousands of standard footprints for BOM extension
- Build snapshot archives (r4_before_powergnd, r10_schematic_pipeline) preserving build-pipeline evolution
- Product image: autophi-v20-product.png
- build_catalog_boards.py and build_tier_boards.py for batch board generation and Magento catalog import
- check_parens.py — parenthesis-balancing validator for generated output files
What Is in the Package
- autophi_engine/ — complete Python board-engine package (5 sub-packages, 20+ modules, RAG knowledge base with 17 TI reference documents and 453-article catalog)
- autophi_engine/footprints/AutoPhi.pretty/ — 22 custom KiCad footprint files (.kicad_mod)
- autophi_engine/rag/ti_references/ — 17 extracted TI documents (.txt) with corresponding table data (.json), plus the full 453-article TI Analog Design Journal catalog
- blueprints/ — 40+ Python scripts for board generation, schematic creation, routing, placement, validation, packaging, and Magento integration
- blueprints/snapshots/ — build-pipeline snapshots (r4 and r10 milestones)
- part/tidc922/ — complete TI TIDA-00423 Gerber, drill, and assembly manufacturing data (20 layer files)
- part/tidrd11.pdf — TI reference design documentation
- TIDA00423_Schematic.DSN — OrCAD schematic source file
- TIDA00423_DS80PCI810_REFERENCE_DESIGN_PCB.kicad_pcb — KiCad-converted reference board
- kicad-footprints-master/ — complete KiCad standard footprint library
- output/schematic_drop/ — product images and packaged output
- build_catalog_boards.py — batch catalog board generator
- build_tier_boards.py — 10-tier board builder with Magento import CSV
- check_parens.py — output file validator
- skidl_autophi_v3_sklib.py — SKiDL library definitions
How this is delivered
This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.
Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.
© 2026 Christopher Gabriel Brown. All rights reserved.
Photo
Footnotes
- Product number 8483.
- Family: autophi pcie cards.
- Purchase: When you buy, you buy the use of that blueprint only.