40-autophi-bga256

Description

AutoPhi BGA Library — 40-autophi-bga256 Source-of-Truth Package (SKU 2069)

Inventor / Licensor: Christopher Gabriel Brown, Lawrenceville, GA, USA. Patent posture: patent pending; method-claim filing in preparation covering the AutoPhi BGA package family, the two-phase interposer escape router, the dog-bone blind-via relocation technique, and the beat-grid via-collision mitigation. Coverage scope to be confirmed prior to engagement. All rights to seek additional patent protection are expressly reserved by the inventor. Underlying inventor corpus © 2017–2026 Christopher Gabriel Brown is referenced for provenance only and is not part of the distribution. Status: Release v1 frozen — canonical pinmap completion 256/256 (100%) on AUTOPHI_BGA256 and 1,536/1,536 (100%) on AUTOPHI_BGA1536, with the intermediate ladder (AUTOPHI_BGA576, AUTOPHI_BGA900, AUTOPHI_BGA1156) assigned and validating (0 TBD, BGA_LIBRARY_VALIDATE: PASS ). Board projects 35-autophi-quantum-pcie5 and 39-autophi-pcie5 consume these artifacts with schematic sync and KiCad CLI netlist export both reporting exit_code=0 .

Overview

Product 40 ( 40-autophi-bga256 ) is the dedicated source-of-truth project for AutoPhi BGA component definitions . It is the single upstream from which every board project in the AutoPhi portfolio pulls its custom ball-grid-array symbols, footprints, and pinmaps. It owns the AutoPhi BGA library end-to-end: the KiCad footprint files ( libs/footprints/AutoPhi.pretty/ ), the KiCad schematic symbols ( libs/symbols/ ), the pinmap CSV tables ( pinmaps/ ), the Python pipeline that regenerates each of those from the others ( scripts/ ), the governance rules that stop board projects from forking them ( docs/LIBRARY_GOVERNANCE.md ), and a full interposer PCB ( interposer/ ) that proves the largest package in the family (BGA-1536, 95 × 90 mm, 2.0 mm pitch) is actually routable on real HDI stackup with real vendor rules.

The deliverable spans the full 92 mm mechanical envelope of the AutoPhi package family — from the 20 × 20 mm BGA-256 seed footprint on the small end, through the 32 mm-body BGA-576 / BGA-900 and 38 mm-body BGA-1156 mid-range, up to the 95 × 90 mm BGA-1536 flagship. The library is not a paper specification: every symbol was generated by script from its pinmap, every pinmap was walked back to its footprint's pad geometry, and every geometry step is reproducible from a single PowerShell one-liner ( rebuild_provisional_seed.ps1 ) and validated by validate_bga_library.py . When the buyer wants to add a new AutoPhi BGA, the change control rule in LIBRARY_GOVERNANCE.md says all five artifacts (footprint, template pinmap, working pinmap, symbol, catalog row) land in the same commit — and the scripts here are what generate four of the five.

What separates this package from a generic KiCad BGA library is the interposer escape work . The interposer/ directory carries a complete KiCad 8 PCB ( autophi-1536-interposer.kicad_pcb , 5.3 MB) that fans out the BGA-1536 flagship at 2.0 mm board-side pitch to a 0.8 mm die-side pad grid across a 12-copper HDI stackup. Every via geometry, every clearance, every routing failure, and every one of the nine errors-worth-not-repeating is recorded in ESCAPE-THEORY.md with the measurements that produced them, the wrong predictions that preceded them, and the two-phase router ( escape_router_v3.py , 30 kB) that resolves them. The result is a 956-of-960 signal balls given a legal via layer with dog-bone blind-via relocation applied on 92 of 96 colliding sites — the four unroutable balls are called out by name.

AUTOPHI_BGA256 256 (16 × 16) 20 × 20 mm 1.0 mm Small / entry seed 256/256 — 100% canonical (Release v1)

AUTOPHI_BGA576 576 (24 × 24) 32 × 32 mm 1.27 mm Intermediate ladder Assigned — 0 TBD (validate PASS)

AUTOPHI_BGA900 900 (30 × 30) 32 × 32 mm 1.0 mm Intermediate ladder — canonical die home (29.0 mm span inside 32 mm body) Assigned — 0 TBD (validate PASS)

AUTOPHI_BGA1156 1,156 (34 × 34) 38 × 38 mm 1.0 mm Intermediate ladder Assigned — 0 TBD (validate PASS)

AUTOPHI_BGA1536 1,536 (48 × 32) 95 × 90 mm (board-side; die-side 37.60 × 24.80 mm) 2.0 mm (board), 0.8 mm (die) Flagship / V19-Pinnacle class 1,536/1,536 — 100% canonical (Release v1)

Ratio invariance across the family (assigned). Every AutoPhi BGA in the catalog uses the same 25.0% / 12.5% / 62.5% ball-role split for GND / POWER / signal, and every power ball has an adjacent GND return (measured 112/112 on the BGA-900). Differential pairs sit on horizontally adjacent balls in the same row, HSIO is placed on the outer rings for short escape routes, and MGMT is in the middle band with POWER / GND on a checkerboard through the core. The ratios were read off the BGA-256 and BGA-1536 assignments rather than chosen freely, so the whole ladder is dimensionally self-consistent.

AutoPhi Single Zetta reference (die stack) 5 mm, 36 × 36 mm per layer, 500 layers Special reference (informational)

Semiconductor Method Discovery 15 reference 10 mm chip, 32 mm square, 32 stacked layers Special reference (informational)

Power Policy (Conservative v1)

Assumed IC power model Hybrid — internal battery capability present, external input still required

Battery-related signal semantics INTERNAL_BATTERY (internal source), EXT_POWER_IN (required external), BAT_MGMT (control / monitor / protection)

Policy tag in pinmap notes power-policy-v1: hybrid internal battery + external input required; 75W max board input

Applied via scripts/apply_power_policy.py , scripts/finalize_power_rails.py , scripts/normalize_pinmap_notes.py

AUTOPHI_BGA256 — Detailed Pinmap Domain Layout

The BGA-256 pinmap is the seed for the entire family and uses a 16 × 16 grid across rows A–T (I, O, Q, S skipped per JEDEC BGA convention) and columns 1–16. Every one of the sixteen rows is seeded with the same domain template so that any board project can route it without surprises:

Rows seeded: A, B, C, D, E, F, G, H, J, K, L, M, N, P, R, T (16 rows, 256 balls total). Seed tag: domain-seed-v1 . Name-promotion tag: canonical-name-seed-v1 . Power-rail finalization tag: power-rail-seed-v1 / power-domain-normalize-v1 . Post-promotion completion is 100% assigned across the whole 256-ball array in the frozen v1 release.

Symbol / Footprint / Pinmap Alignment

The BGA library is treated as a strict source-of-truth pipeline. Every symbol is regenerated from a pinmap that was in turn generated from footprint pads, so drift between the three is measurable and refused by the validator:

Step Script Input Output

1. Generate template pinmap generate_bga_pinmap_template.py .kicad_mod footprint pads *_pinmap_template.csv

2. Normalize starter placeholders normalize_pinmap_placeholders.py *_pinmap_starter.csv *_pinmap_working.csv

3. Seed domain rows seed_ab_domains.py *_pinmap_working.csv , row list, seed tag Domain-tagged pinmap

4. Promote provisional names promote_provisional_signals.py Pinmap with TBD_MGMT_* / TBD_HSIO_* Canonical net names

5. Finalize power rails finalize_power_rails.py Pinmap with voltage-domain placeholders Named power rails (VDD_CORE, VDD_IO, VSS, VDDQ, VTT, VREF, VDDP)

6. Normalize notes normalize_pinmap_notes.py Multi-tag pinmap De-duplicated note strings

7. Generate KiCad symbol generate_bga_symbol_from_pinmap.py Working pinmap + footprint reference libs/symbols/AutoPhi_BGA_working.kicad_sym

8. Validate alignment validate_bga_library.py All four artifacts + LIB_ID footprint BGA_LIBRARY_VALIDATE: PASS

9. Report completion pinmap_completion_report.py Working pinmap Non-TBD coverage % + logical completion %

One-command reproducible rebuild: the entire seed-to-symbol path is scripted in scripts/rebuild_provisional_seed.ps1 with -Rows "A,B,C,D,E,F,G,H,J,K,L,M,N,P,R,T" and -SeedTag "domain-seed-v1" . It normalizes, seeds, promotes provisional names, regenerates the symbol, prints the completion report, and drops a timestamped checkpoint into pinmaps/checkpoints/ .

Interposer — What Actually Constrains BGA Escape

The interposer/ directory carries a fully-populated KiCad PCB ( autophi-1536-interposer.kicad_pcb ) that fans out the flagship BGA-1536 across a 12-copper HDI stackup. Every number in the accompanying ESCAPE-THEORY.md was measured on the board file or derived from its geometry, including the wrong predictions that preceded each measurement:

Fan-out mapping Pure 2.5× radial scaling: die pad (i,j) → board pad (i,j), same array, bigger pitch

Stackup (12 copper) TOP, GND1, SIG1, SIG2, PWR1, SIG3, SIG4, PWR2, SIG5, SIG6, GND2, BOTTOM

A ball landing on signal layer k needs two vias: a microvia spanning TOP→ k (crossing k signal layers) and a blind via spanning k →BOTTOM (crossing N − k +1). The sum is N +1 for every k — the layer choice cancels:

960 balls × 7 = 6,720 barrel-layer crossings ÷ 6 = 1,120 via keepouts per signal layer, invariant under any assignment . Measured layer load on the full run came out 160 / 159 / 159 / 160 / 159 / 159 — exactly 960 ÷ 6. Doubling stackup from 6 to 12 signal layers buys 7% because the load scales as ( N +1)/ N . Layer balancing is still worth doing because it balances trace congestion (measured: failures fell from 56 to 37 on a 250-ball sample when layer choice went from shallow-first to least-loaded-first) — but not via congestion.

Identical. Trace pitch is not what is choking the escape; via placement is.

Result 3 — The Two Grids Beat Against Each Other

0.8 mm die and 2.0 mm board on a shared origin, ratio 2.5 — not an integer. The grids drift in and out of phase. 240 board pads land within 0.50 mm of a die pad; closest pair 0.283 mm. At that distance a 0.20 mm microvia pad and a 0.40 mm blind via pad physically overlap — no clearance rule reaches it. All 36 tested translations of the BGA grid (0 to 1.0 mm in 0.2 mm steps, both axes) were worse than or equal to the design as drawn. The board is already at the optimum offset. The collision is an ordering constraint, not a wall: microvia (TOP→ L ) and blind via ( L′ →BOTTOM) miss whenever L is shallower than L′ .

Result 4 — Dog-Bone the Blind Vias

Stop putting the via in the pad. Offset it, and join the two with a short neck on BOTTOM. Applied to the board: 92 of 96 colliding blind vias relocated, 89 of them needing only 0.25 mm, max 0.60 mm. Four had nowhere legal to go. DRC unchanged — no new violations.

• A via is a barrel, not a point. SetLayerPair(TOP, SIG5) puts copper on SIG1–SIG4 as well. Modelling only the landing layer produced shorts through four layers.
• The binding clearance is the netclass, not the board minimum. 0.200 mm, not min_clearance 0.075. Channels sized off the floor route cleanly and then fail DRC.
• Vias collide on layers the router never draws on. A die pad 0.283 mm from a board pad meets it on PWR1 — a plane layer. Via feasibility must be checked across all twelve copper layers.
• Moving a via invalidates its zone antipad. Refill before saving or every barrel shorts to the plane it crosses.
• Clearing traces does not clear via layer pairs. After a wipe, 451 unrouted balls still had microvias parked at TOP–SIG6 while the model had reserved only TOP–SIG1: 199 shorts. Collapse unrouted vias to the span actually reserved.
• Reserve the guaranteed barrel, never the worst case. Reserving TOP–SIG6 for every waiting ball blocks all six layers at all 1,536 die pads simultaneously and leaves single-cell channels. Reserve TOP–SIG1 for microvias and SIG6–BOTTOM for blind vias: those are certain.
• Never block a diagonal by its bounding box. SIG1 read as 64% occupied when the true figure was 13%. Rasterise the swept area.
• Keep keepout radii fractional. A diagonal blocked at an integer 5 cells (0.25 mm) where 5.5 (0.275 mm) is required leaks half a cell — 35 clearance violations, all between 0.177 and 0.187 mm.
• Check new geometry against traces, not just pads and vias. Three separate scripts, same omission each time.

Library generation generate_bga_footprint_grid.py Parametric KiCad footprint generator; profiles: v19_default , zetta_ref , smd15_ref , bga576_ref , bga900_ref , bga1156_ref

generate_bga_pinmap_template.py Walks footprint pads, emits per-ball CSV template

generate_bga_symbol_from_pinmap.py Regenerates KiCad symbol from working pinmap + footprint LIB_ID

Pinmap operations normalize_pinmap_placeholders.py Cleans starter unconnected-(…) noise into normalized empty rows

finalize_power_rails.py Names voltage-domain placeholders (VDD_CORE, VDD_IO, VSS, VDDQ, VTT, VREF, VDDP)

Validation validate_bga_library.py Cross-checks pinmap + symbol + footprint + LIB_ID alignment, emits PASS/FAIL

interposer_stackup.py , interposer_stackup_v2.py , interposer_stackup_v3.py Three generations of the 12-copper HDI stackup definition

Escape routing escape_theory.py Derives the invariant and rule-binding table from the board

escape_ring.py , escape_ring_offset.py , escape_ring_v2.py Three generations of ring-by-ring escape router

escape_router_v3.py (30 kB) Two-phase router: --all re-routes all 16 rings, --why explains failures, --clear= overrides netclass for experiments

Freerouting freeroute_interposer.py Exports DSN and drives external FreeRouting for full auto-route

fix_rail_via_padstacks.py Post-FreeRouting padstack cleanup for rail vias

Rendering render_escape.py Flat false-colour views: --zoom for dog-bones, --full for whole board

Catalog / export build_magento_series_draft.py Builds consolidated Magento draft CSV (34 board rows + BGA library rows)

autophi-1536-interposer.kicad_pcb 5.29 MB Live KiCad PCB (12-copper HDI, 1,536 pads two-sided)

28 ×  .bak-* incremental backups — Named prestack , predie , previa , preplanevia , preescape , prebotrail , prering0 … prering5rect , prering2v2 , prering3v2 , predogbone , prev3 , prepurgeplanetracks , preU1VIP — every routing checkpoint preserved

25 ×  drc-*.rpt — Complete DRC snapshot per routing generation: drc-baseline.rpt , drc-ring0.rpt , drc-ring1-off+.rpt , drc-ring1-rect.rpt , drc-ring2-{rect,v2,LR-v2,UD-v2}.rpt , drc-ring3-{rect,LR-v2,UD-v2}.rpt , drc-ring4-rect.rpt , drc-ring5-rect.rpt , drc-after-padstack.rpt , drc-relax.rpt , drc-dogbone.rpt , drc-v3-r0-15.rpt , drc-v3-r4-15.rpt , drc-v3-r15-15.rpt , drc-postpurge-*.rpt , drc-bundle.rpt , interposer-drc.rpt , interposer-escape.drc.rpt

35-autophi-quantum-pcie5 AUTOPHI_BGA1536 (override) PASS PASS ( validate_schematics.py ) PASS ( exit_code=0 )

39-autophi-pcie5 AUTOPHI_BGA1536 (U16 override) PASS (regenerated) N/A PASS ( exit_code=0 )

Board projects consume artifacts from this package rather than defining BGA data ad hoc. Change control refuses forks: the LIBRARY_GOVERNANCE.md rule states any new AutoPhi BGA requires all five artifacts (footprint, template pinmap, working pinmap, symbol, catalog row) landing in the same change set. Commodity components (R, C, L, FB, standard connectors, stable vendor IC footprints) remain reused from standard KiCad libraries — the "own AutoPhi, borrow commodity" rule.

docs/BGA_CATALOG.md Canonical catalog: confirmed entries, planned entries, update rule, placement anchor

docs/BOARD_SERIES_STATUS.md Cross-project sync checkpoint (35 / 39) with Release v1 baseline

docs/CANONICAL_DIMENSIONS_MATRIX.md Product-line dimension matrix (V19 Pinnacle, V18, V20 Epiphany, Zetta, SMD-15) with conflict map

docs/RELEASE_V1.md Frozen v1 baseline: completion status, included artifacts, seeding tags, consumption rule

docs/legacy-source-notes.md Roots reviewed for reusable BGA work (18, 21, 24, 26, 28, 30) and decision to seed from 35/39

docs/AUTOPHI_BGA256_unit1.svg SVG technical drawing of the BGA-256 unit (815 KB)

PRIOR_ART_LED_RECYCLING.md Third-party prior-art scan for LED power-recycling element inherited from nine-tech AutoPhi architecture

PLAYBOOK.md Internal engagement playbook (identity, hook lines, reply patterns, status gaps)

exports/magento_import_series_draft.csv 776 KB Consolidated 34-board-row + BGA-library-row Magento import draft

exports/route-progress-test.png 102 KB Route-progress test render

exports/route-progress/ , exports/route-progress-v2/ — Route-progress animation frame directories

Prior-Art Reference (Not Owned by Licensor)

The 40-autophi-bga256 package inherits the LED Power Recycling element from the nine-tech AutoPhi architecture. Three third-party patents represent the most relevant prior art in that specific slice and are documented in PRIOR_ART_LED_RECYCLING.md for research completeness — not as licensor-owned IP:

Publication Title Relevance

US 2012/0305059 A1 Photon recycling in an optoelectronic device Broadest LED-recycle blocker

US 4,775,876 Photon recycling light emitting diode Foundational mechanism

US 2002/0170591 A1 On-chip solar cells in a common substrate Closest on-chip emit + harvest art

Defensible angle: the BGA-256 package + the integrated nine-tech AutoPhi stack is the patentable target, not the LED-recycle slice taken in isolation.

.py 43 (43 Python scripts across library, pinmap, interposer, escape routing, rendering, catalog)

libs/footprints/AutoPhi.pretty/ 12 KiCad footprint modules: BGA-256_20x20mm_P1.0mm.kicad_mod , BGA-576_32x32mm_P1.27mm.kicad_mod , BGA-900_32x32mm_P1.0mm.kicad_mod , BGA-1156_38x38mm_P1.0mm.kicad_mod , BGA-1536_95x90mm_P2.0mm.kicad_mod , plus profile-specific variants

libs/symbols/ 6 KiCad schematic symbol libraries: AutoPhi_BGA.kicad_sym , AutoPhi_BGA_working.kicad_sym , AutoPhi_BGA576_working.kicad_sym , AutoPhi_BGA900_working.kicad_sym , AutoPhi_BGA1156_working.kicad_sym , AutoPhi_BGA1536_working.kicad_sym

pinmaps/ 15 CSV pinmap files (template + working for 5 packages, plus starter and backups), _remap_pinmaps.py , _sync_pinmap_from_schematic.py , checkpoints/ , worksets/

scripts/ 43 Python scripts + rebuild_provisional_seed.ps1 PowerShell wrapper (library gen, pinmap ops, validation, interposer build, escape routing, FreeRouting drive, rendering, Magento export)

interposer/ Complete KiCad interposer PCB (5.29 MB), tier-1 and tier-2 variants, 3D exports (STEP/GLB/WRL), Specctra DSN, FreeRouting session file, 25 DRC reports, 28 timestamped incremental backups, isometric render, ESCAPE-THEORY.md , _renders/ frame directory

docs/ 9 governance / status / release / prior-art documents plus the AUTOPHI_BGA256_unit1.svg technical drawing (815 KB)

exports/ Consolidated Magento import draft CSV (776 KB), route-progress test render, route-progress frame directories (v1 and v2)

sales-pitches/ Product-card metadata ( _PRODUCT_CARD.md ), long-form storefront HTML ( _STORE_PRODUCT_DESCRIPTION.html ), vault delivery instructions ( _VAULT_DELIVERY_INSTRUCTIONS.html )

sources/from-39/ Traceability link back to seed source project 39-autophi-pcie5

Root files README.md , MANIFEST.json , CHANGELOG.md , CITATION.cff , CONTACT_INFO.txt , LICENSE , PLAYBOOK.md , PRIOR_ART_LED_RECYCLING.md

How this is delivered

This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.

Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.

© 2026 Christopher Gabriel Brown. All rights reserved.

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