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31-autophi-electromagnetic-ic

$43,225,050,000.00

In stock

SKU

2060

AutoPhi Electromagnetic IC: light runs in on a waveguide, a ring of coil ICs fires pull and push in turn and turns the rotor, and electrons flow on the die, animated picture

Asset valuation: $4,400,000,000. Design Author: Christopher Gabriel Brown Address: Lawrenceville, Georgia Email: christopher@cri-one.com Email: christopher@cri-one.com Date: March 2026 31-autophi-electromagnetic-ic = the Electromagnetic IC concept: a quantum-electromagn

For the curious

A chip should not have to choose between thinking and moving. The AutoPhi Electromagnetic IC is a single die where light, magnetism and electron flow are first-class parts of the computation: photons carry the instructions, magnetic fields switch, hold state and make torque, and electrons do the arithmetic. One trigger, three forces, one chip. Add the quantum strand and it becomes the Quantum Electromagnetic IC, QEM-IC: a processor, a motor and a quantum computer on one die.

The instruction set is the Photon Chromosome: wavelength is the opcode, polarization the operand, path the address, intensity the magnitude. A program is a sequence of coloured, polarised, routed laser pulses; the compiler emits a photon schedule, and the light is the instruction. The seed IC is a 20 mm by 20 mm die at 130 nm with 1,290 voxels, 1.29 TFLOPS of FP32 compute, 10.32 INT8 TOPS, 16 qubits and 100 neuromorphic neurons, with 5 nm as the target node. Each voxel carries 192 bits of configuration DNA, so the grid can be reprogrammed and evolved, and Peltier-based electromagnetic cooling runs 32 thermal zones.

Because the same die generates torque, the package lays out ten product families and 10,000 IC arrangements, from ring arrays that turn like a motor to linear strips, precision stages, propulsion and surgical tools, along with the complete Optical Quantum Battery subsystem configured for power export. It is for engineering buyers in motors, robotics, aerospace and precision instruments, at maturity level 4, tape-out and mass-manufacturable, with thirteen-plus USPTO applications filed; the IP stays with the inventor.

Details

Description

Project 31 — AutoPhi Electromagnetic IC (SKU 2060)

Inventor: Christopher Gabriel Brown

Patent Portfolio: 13+ USPTO patent applications filed (17/454,807; 17/454,808; 17/687,656; 18/219,732; 18/370,908; 18/460,559; 18/650,137; 16/948,862; 29/788,287; 29/807,411; 29/839,062; 29/892,202; 63/552,008) plus additional filings 19/031,884; 19/177,547; 19/401,431; 19/403,339; 19/540,453. Grounded in 3,500+ inventions (copyright 2017, Christopher Gabriel Brown).

Maturity Level: 4 — Tape-out / Mass-Manufacturable

Sector: Computing & Semiconductors

Overview

The AutoPhi Electromagnetic IC is a quantum-electromagnetic integrated circuit that computes with light, magnetism, and electron flow as one unified electromagnetic system. The chip is not classical silicon alone — it is an electromagnetic machine where photons carry instructions, magnetic fields move and switch, and electrons execute arithmetic. One trigger, three forces, one chip.

The design package delivers an electromagnetic IC architecture where photonic (light), magnetic (field/torque), and electric (electron) phenomena are first-class computational elements. The Photon Chromosome — encoding (wavelength, polarization, path, intensity) as (opcode, operand, address, magnitude) — becomes the instruction set carried by light through the chip. Electromagnetic switching replaces or augments transistor gates. And when all three forces are harnessed together, the chip does what no classical IC can do alone: it computes and generates torque on the same die.

The upgraded designation is the Quantum Electromagnetic IC (QEM-IC) — a single-die system integrating photonic, magnetic, electric, and quantum computation with actuation. A processor, motor, and quantum computer on one chip.

The Four Strands on One Die

Strand Carrier Role in IC Encoding

Photonic Photon (light) Instruction delivery, data routing, clock Wavelength = opcode, polarization = operand, path = address, intensity = magnitude

Magnetic Magnetic field Switching, torque, state retention Field direction = state, coil current = control, torque = force

Electric Electron Arithmetic, memory, classical logic Voltage = value, current = flow, charge = storage

Quantum Qubit Quantum compute, entanglement, QEC Gate type, qubit mask, phase/angle, classical control

Photon Chromosome — Wavelength Opcode Map

Wavelength (nm) Colour Opcode Operation

620–750 Red ADD Addition

450–495 Blue SUB Subtraction

495–570 Green MUL Multiplication

570–590 Yellow DIV Division

380–450 Violet LOAD Memory load

590–620 Orange STORE Memory store

750–1000 Near-IR BRANCH Conditional branch

1000–1550 Telecom-IR IO External I/O

A program is a sequence of coloured, polarised, routed laser pulses. The compiler outputs a photon schedule. The chip executes it at the speed of light. No separate instruction memory fetch is needed — the light is the instruction.

Base Seed IC Specifications

Parameter Value

Process Node 130 nm (seed); 5 nm (target)

Die Size 20 × 20 mm

Voxels per IC 1,290

Compute per IC 1.29 TFLOPS (FP32)

TOPS per IC (INT8) 10.32 TOPS

Qubits per IC 16 (seed)

Neurons per IC 100 (seed neuromorphic)

AES COGS per IC $20,000

Scaling Formulas

Metric Formula

Array TFLOPS IC_count × 1.29

Array TOPS (AI, INT8) IC_count × 1.29 × 8

Qubits IC_count × 16 (seed; scales with process)

Neurons IC_count × 100 (seed neuromorphic voxels)

Voxel Types for the QEM-IC Die

Voxel Type Function Primary Strand

LIGHT Photonic routing, optical logic, waveguide switching Photonic

MAGNETIC Electromagnetic switching, torque generation, field control Magnetic

ELECTRIC Classical arithmetic, voltage-based logic, charge storage Electric

HYBRID Multi-strand operations combining two or more carrier types All

QUANTUM Qubit hosting, gate execution, entanglement management Quantum

PELTIER Thermoelectric cooling, thermal zone management (Bi 2 Te 3 ) Electric + Magnetic

IO External interface, signal conversion, bus management All

MEMORY Data storage — classical (charge/magnetic) and quantum (qubit state) Electric + Quantum

INTERCONNECT TSV routing, inter-layer communication, photonic bridges Photonic + Electric

BLANK Unprogrammed or reserved — available for reconfiguration None

Each voxel carries three 64-bit chromosomes (Photon, Electron, Atomic) — 192 bits of configuration DNA per voxel — allowing the grid to be programmed, reprogrammed, and evolved.

Nine Integrated Technologies

# Technology Key Metric

1 LED Power Recycling 90% conversion efficiency; 42% net power reduction; on-die GaN micro-LED / micro-PV pairs; photon capture 405–450 nm

2 Vertical Threading 12,000 TSVs/mm²; 125 TB/s aggregate bandwidth; sub-10 μm via pitch

3 Chiplet Stacking Up to 500 layers; 18 chiplets per stack; 3D heterogeneous integration; hybrid Cu-Cu / dielectric bonding

4 Nanophotonic Data Flow 1,400 TB/s aggregate bandwidth; 2,800 photonic channels; zero EMI susceptibility

5 Quantum Error Correction 99.998% gate fidelity; 1,400 logical qubits; surface-code QEC

6 Electromagnetic Cooling (Peltier) 97% cooling efficiency; 32 independently controlled thermal zones; Bi 2 Te 3 thermoelectric; photon-chromosome adaptive control

7 Quantum Battery Layers 20 battery layers; 1,500 Wh total capacity; 75 MW burst discharge; quantum-state energy storage

8 Quantum-Classical Hybrid Interface Seamless qubit-to-electron bridge; measurement + feed-forward; sub-clock-cycle latency; zero protocol overhead

9 Neuromorphic AI Engine 1,000,000+ spiking neurons per system die; 3,200,000,000 neurons at card level; event-driven; near-zero idle power

Ten Product Families — 10,000 IC Arrangements

# Family Motion Type Configs Target Market (Annual)

1 Ring Arrays Rotational torque motors 1,000 $100B+ (electric motors, MEMS)

2 Linear Strips Linear actuators 1,000 $50B+ (actuators, propulsion)

3 Grid Matrices Multi-axis precision stages 1,000 $20B+ (precision stages, metrology)

4 Spiral Arrays Screw motion 1,000 $10B+ (micro-pumps, feeds, drills)

5 Opposing Pairs Servo / bidirectional 1,000 $30B+ (servos, robotics)

6 Stacked Layers Amplified torque 1,000 $80B+ (industrial motors)

7 Hybrid Combos Multi-mode 1,000 $40B+ (robotics, aerospace)

8 Hex Plates Honeycomb high-density 1,000 $15B+ (bio-implants, arrays)

9 Drone / Propulsion Aerospace 1,000 $50B+ (drones, marine, eVTOL)

10 Medical / Precision Surgical, metrology 1,000 $30B+ (surgical, scientific)

Total addressable market across all 10 families: $425B+ annually .

Optical Quantum Battery Subsystem

The package includes the complete Optical Quantum Battery system — the power subsystem of the AutoPhi architecture configured for power export. The system generates more power than it consumes, exporting the surplus. LED nano-charging drives quantum dot arrays, EM cooling reclaims waste heat, and the quantum execution unit manages quantum state operations in the energy cycle. The closed loop recycles energy at 84–98% overall efficiency (verified from AutoPhi Generation 43/44 data).

Quantum Battery Technical Specifications

Parameter Value

Energy Density 0.1–1 MJ/cm³ (100–1,000× lithium-ion)

Charging Time 0.05 seconds to 10 minutes (180–14,400× faster than Li-ion)

Cycle Life > 1,000,000 cycles (500–2,000× longer than Li-ion)

Operating Temperature −40 °C to +85 °C

Optimal Temperature (with cooling) −20 °C to +25 °C

Output Voltage 0.5–5.0 V (adjustable; higher via series)

Output Current 1 mA to 10 A (scalable)

Output Power per Unit 1 mW to 50 W

Overall Efficiency (optical to electrical) 50–75%

LED Charging Efficiency 84–98% (AutoPhi verified)

Self-Recharge Round-Trip Efficiency 84–98%

Extraction Efficiency (stored to electrical) 85–95%

Response Time

Self-Discharge

Safety No fire risk, no explosion risk, no thermal runaway

Manufacturing CMOS-compatible, scalable processes

Quantum Battery Six-Layer Architecture

Layer Function Detail

Optical Input Photon charging Grating couplers, silicon waveguides, photonic crystal cavities; integrated LED nano-arrays at 10 6 –10 12 LEDs/cm²

Magnetic Field Control Quantum state manipulation 0.1–10 T fields; Zeeman effect; Landau level quantisation

Electromagnetic Cooling Active thermal management Peltier effect + adiabatic demagnetisation; extends coherence times 10–75×

Quantum Storage Energy storage in quantum states Silicon quantum dot arrays at 10 6 –10 12 dots/cm²; 0.05–0.5 eV per dot

Electrical Extraction Quantum-to-electrical conversion P-N junctions + quantum tunnelling; 85–95% efficiency; gate electrode control

Control & Interface Intelligent management CMOS electronics; temperature control; thermal management

Quantum Battery Product Series

Model Output Power Voltage Current Capacity Size (mm)

Q-Battery Nano 1–10 mW 0.5–1.0 V 1–10 mA 0.1–1 mJ 5 × 5 × 2

Q-Battery Mini 10–100 mW 1.0–2.0 V 10–50 mA 1–10 mJ 10 × 10 × 3

Q-Battery Standard 100 mW–1 W 2.0–3.7 V 50–270 mA 10–100 mJ 20 × 20 × 5

Q-Battery Plus 1–3 W 3.7–5.0 V 270–600 mA 100 mJ–1 J 30 × 30 × 8

Q-Battery Pro 3–10 W 5.0–12.0 V 600 mA–2 A 1–10 J 50 × 50 × 10

Q-Battery Industrial 10 10–30 W 12–24 V 0.8–2.5 A 10–100 J 80 × 80 × 15

Q-Battery Industrial 30 30–100 W 24–48 V 1.25–4.2 A 100 J–1 kJ 120 × 120 × 20

Q-Battery Grid 100 100–300 W 48–120 V 2–6 A 1–10 kJ 200 × 200 × 30

Q-Battery Grid 300 300 W–1 kW 120–240 V 2.5–10 A 10–100 kJ 300 × 300 × 50

Q-Battery Utility 1k 1–10 kW 240–480 V 4–42 A 100 kJ–1 MJ 500 × 500 × 100

Q-Battery Utility 10k 10–100 kW 480 V–1 kV 21–210 A 1–10 MJ Modular array

Magnetic Motion Generator Subsystem

The package also includes the Magnetic Motion Generator — a spherical battery array system with optimised connections and integrated electromagnetic induction. Patent application 19/401,431 (filed November 26, 2025), titled "Magnetic Motion Generator with Optimized Sphere Battery Configuration and Integrated Electromagnetic Induction System."

Parameter Specification

Outer Batteries 4–24 units (recommended: 8)

Battery Capacity 10–1,000 Ah (recommended: 100 Ah)

Battery Voltage 1.5–48 V (recommended: 12 V)

Connection Resistance 0.001–1.0 Ω (optimal:

Magnetic Field Strength 0.1–5.0 T (recommended: 0.5 T)

Sphere Radius 0.1–2.0 m (recommended: 0.5 m)

System Efficiency 85–98%

Optimal Connection Topology √N (where N = number of outer batteries)

Connection Material High-purity copper (99.9% C11000) or silver

Placement Algorithm Fibonacci sphere for even battery distribution

Operating Temperature −20 °C to +60 °C

Force Calculation

F = B × I × L × N × k — where F = magnetic force (N), B = field strength (T), I = current (A), L = conductor length (m), N = number of batteries, k = efficiency factor (0.1).

Torque Formula (IC-Level)

Torque = N × I × A × B — where N = coil turns per IC, I = current (proportional to photon intensity), A = coil area, B = field strength.

Key Physics Formulas in the Package

Domain Formula Description

Optical E = hf = ℏω = hc/λ Photon energy

Optical Φ = P/(hf) Photon flux (photons/second)

Magnetic ΔE = gμ B B m J Zeeman splitting

Magnetic E n = ℏω c (n + ½) Landau levels

Magnetic f c = eB/(2πm*) Cyclotron frequency

Electrical E = ℏ²π²/(2m*L²) Quantum dot confinement energy

Electrical V oc = (kT/e) ln(I ph /I 0 + 1) P-N junction open-circuit voltage

Electrical T ≈ exp(−2κd) Quantum tunnelling probability

Silicon E g (Si) = 1.12 eV; m* e = 0.19 m e Silicon bandgap and effective mass

System η = η base × (1 − R conn × 10) × (1 + R opt × 0.1) System efficiency (η base = 0.85)

Performance at Scale

System-Level: AQCHS (Full System)

Parameter Specification

TOPS (INT8) 32,768+

Qubits 4,096

Neurons 1,000,000+

Memory Bandwidth 150 TB/s

Peltier Cooling Efficiency 97%

IC Count (system) 3,174 (estimated)

System TFLOPS 4,094.46

Card-Level: REV_H

Parameter Specification

Compute 2.8 ZettaFLOPS

Qubits 9,830,000

Neurons 3,200,000,000

Memory Bandwidth 360 PB/s

Industry Comparison (256-IC Array)

Metric AutoPhi (256 ICs) NVIDIA H100 Ratio

TFLOPS (FP32) 330.24 0.120 (sparse) ~2,752×

TOPS (INT8) 2,641.92 330 ~8×

Qubits 4,096 0 N/A

Neurons 25,600 0 N/A

Photonic Bandwidth Yes No N/A

Peltier Cooling Integrated External N/A

HDL and EDA Deliverables

Artefact File Detail

RTL Source (Verilog) led_power_recycling_circuit.v 16,137 bytes — top-level power IC; 6 retained AutoPhi technologies; 16-instruction quantum gate set; 32 harvester zones; 32 thermal zones

Testbench led_power_recycling_circuit_tb.v 7,524 bytes — verification test vectors

Synthesised Netlist (Verilog) led_power_recycling_synthesized.v 134,537 bytes — Yosys-synthesised gate-level netlist

Synthesised Netlist (JSON) led_power_recycling_synthesized.json 1,357,276 bytes — machine-readable netlist

Timing Constraints timing.sdc 1,627 bytes — target frequency 10 MHz

Physical Constraints physical.xdc 455 bytes — target area

GDSII Layout GEN6_QUANTUM_01141_COMPLETE_64LAYER.gds 64-layer complete layout (0.29 MB)

GDSII Generator GDSII_GENERATOR_STANDALONE_CD.zip 56,083 bytes — standalone generator for mask-ready output

Foundry handoff package version 1.0 (2025-11-28). Target technology: generic CMOS. Efficiency target: 84–98%.

Source Code and Simulation Tools

The package includes 77 Python source files covering:

LED_POWER_RECYCLING_SYNTHESIS.py — synthesis driver for LED power recycling circuit
LED_POWER_RECYCLING_VERIFICATION.py — verification and simulation framework
battery_array_calculator.py — array configuration calculator
optical_quantum_battery_calculator.py — photon energy, quantum charging time, Zeeman splitting, silicon quantum dot, and electrical extraction calculations
alternative_outcome_scenarios.py — performance modelling under different scenarios
add_momentum_cogs.py — cost-of-goods-sold and momentum analysis
bytedesign.py — byte-level IC design tool

Also included: 260 HDL files (Verilog modules), 305 TCL scripts (EDA flow), 126 SDC constraint files, 108 SDF timing files, and 72 Liberty timing library files from OpenLane place-and-route runs.

Documentation and Data

Category Count

Markdown documentation files (.md) 450

Report files (.rpt) 1,768

Data files (.json, .csv) 2,713+ JSON; additional CSV files

Log files (.log) 512

SVG images / blueprints 645

HTML files (pitch decks, product pages) 101

ODF documents 4 (reallight, commons, unique, abnormal blueprints)

PDF documents Multiple (including PIC16F84-T300.pdf, N417 patent PDFs)

Battery configuration datasets 100, 200, and 1,000 configuration sets (JSON + CSV)

Key Documentation Included

ELECTROMAGNETIC_IC_CONCEPT.md — core concept: what an electromagnetic IC is, how it differs from classical silicon, the three forces unified
LIGHT_TRIGGER_IC.md — single-photon initiation, coloured laser semiconductor, cold light microchip, digital optics by coloured micro mirrors
PHOTON_CHROMOSOME_FOR_IC.md — wavelength-opcode, polarisation-operand, path-address, intensity-magnitude encoding and decoding
DEPOSITION_ELECTROMAGNETIC_IC.md — definitive deposition: what this IC is, what it holds, where it points
PELTIER_ELECTROMAGNETIC_COOLING.md — on-die Peltier cooling via photon chromosome, plate ballast as heatsink, self-cooling torque arrays
TORQUE_FROM_IC.md — how the IC generates torque; array shapes (ring, strip, grid, spiral, opposing, stacked); speed and movement control
ELECTROMAGNETIC_IP_INDEX.md — index of electromagnetic inventions from the 3,500+ IP catalogue across 7 categories
QUANTUM_ELECTROMAGNETIC_IC_MASTER.md — definitive QEM-IC document unifying Projects 18 and 31; four strands; DNA-style voxel encoding
NINE_TECHNOLOGIES_INTEGRATED.md — how all 9 AutoPhi Future technologies fold into the EM-IC die across 10 product families
PERFORMANCE_SPECIFICATIONS.md — all 10 product family performance tables; industry comparison; system and card level specs
VALUATION.md — per-IC-arrangement valuation; portfolio value by product family; comparable technology values
1000_IC_ARRANGEMENTS_PLATE_BALLAST.md — 1,000 plate ballast material and geometry configurations
QUANTUM_PHOTON_CHROMOSOME_V2.md — upgraded photon chromosome for quantum operations
Patent specification and filing documents — formal patent specification, patent drawings description, patent filing confirmation, bill of materials, assembly guide, user manual, white paper, commercialisation checklist

OpenLane EDA Runs

Multiple completed OpenLane2 place-and-route runs are included with full output directories, covering synthesis reports, timing analysis across process corners (nom_ff_n40C_1v95, nom_ss_100C_1v60, nom_tt_025C_1v80), latch reports, and SDF timing data. Seed voxel design ( autophi_voxel_blank.v ) with configuration for the SkyWater 130 nm PDK is provided.

Blu-ray Distribution Infrastructure

Build scripts and templates for Blu-ray disc mastering are included ( build_bluray_foundry.py , build_bluray_foundry.bat , build_to_24_bluray_test.bat ), along with disc README templates, manifest generators, and directory structure specifications.

Patent Portfolio Summary

Application Number Type Filing Date

17/454,807 Utility 11/13/2021

17/454,808 Utility 11/13/2021

17/687,656 Utility 03/06/2022

18/219,732 Utility 07/10/2023

18/370,908 Utility 09/21/2023

18/460,559 Utility 09/03/2023

18/650,137 Utility 04/30/2024

16/948,862 Utility 10/02/2020

19/031,884 Utility 01/18/2025

19/177,547 Utility 04/12/2025

19/401,431 Utility 11/26/2025

19/403,339 Utility 11/28/2025

19/540,453 Utility Consolidated (15 inventions)

29/788,287 Design 04/23/2021

29/807,411 Design —

29/839,062 Design 07/13/2022

29/892,202 Design 05/15/2023

63/552,008 Provisional 02/09/2024

Backed by a broader portfolio of 30+ additional historical filings dating from 2012 to the present. The IP itself (patents, inventions, and copyright) is not for sale — what ships is the design package, documentation, source code, and EDA output.

Related AutoPhi Projects Referenced

Project 18 (AutoPhi Future) — voxel-as-cell, photon chromosomes, metal tree; 9 breakthrough technologies
Project 19 (AutoPhi Miracle) — seed voxel flow and Blu-ray foundry packages
Project 02 (AutoPhi Modern) — product consolidation
Project 27 (Scale Ultimate) — voxel die building; electromagnetic voxel types for grid
Project 28 (Complete Unit) — single-chip symmetry; unified electromagnetic compute
Project 01 (Autocar) , 03 (Electric Jet) , 04 (War Satellite) , 14 (Semiconductor Material) — coinciding technology projects

What Is in the Package

Category File Count

Data (.json, .csv, etc.) 2,757

EDA Flow Output (.rpt, .tcl, .sdc, .sdf, .lib, .def, .log) 2,475

Documentation (.md, .txt) 1,215

Other 1,011

Images (.svg, .png, etc.) 658

HDL (.v) 260

Chemistry / Bio (.sdf) 108

Web (.html) 101

Source Code (.py) 77

Documents (.pdf, .docx, .odf) 14

Archives (.zip) 11

Layout (.gds) 1

Total 8,688 files

How this is delivered

This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.

Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.

Photo

Abstract dark textured plate cut into hexagon tiles with copper outlines on a dark background

Footnotes

Product number 8479.
Family: autophi core.
Purchase: When you buy, you buy the use of that blueprint only.

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