7cb1464d3343c84786fafb17bf48caaccd26642c934c4367c67da5d0065c28cf
AutoPhi V20-Epiphany IC Collection
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility using password CRIONE99KEY. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.
AutoPhi V20-Epiphany IC Collection
One chip does everything. No companion ICs, no external controllers, no third-party silicon. 1,010 V20 configurations — the most fully realized expression of the seed — each a single 36×36 mm package that integrates compute, quantum, photonics, DNA molecular logic, neuromorphic AI, power, and cooling onto one AES die stack.
The V20 Epiphany Collection is the newest AutoPhi generation, and the only one designed entirely at 1.5 nm across every tier. Where V18 proved the architecture and V19 pushed it to yotta-class compute, V20 collapses the whole system into a single all-custom integrated circuit — the “one chip does everything” epiphany the line is named for.
What the collection covers — in depth
| Spec | V20 Epiphany |
|---|---|
| Designs | 1,010 ICs across ten tiers: Seed → Sprout → Sapling → Branch → Canopy → Crown → Summit → Zenith → Apex → Epiphany |
| Process node | 1.5 nm across every tier — the only AutoPhi generation built fully at the most advanced node |
| Die size / height | 36 mm × 36 mm / 12 mm tall, 1,296 mm² per layer |
| Stacked active layers | 50 (Seed) → 600 (Epiphany) |
| Voxels per chip | 640,000 (Seed) → 30,239,001 (Epiphany) |
| Clock range | 4–16 GHz (Light Trigger technology) |
| Per-chip compute (design target) | 300 EFLOPS (Seed) → 40.38 ZFLOPS (Epiphany) |
| Physical qubits | ~500,000 (Seed) → 13,000,000 (Epiphany), 99.998% gate fidelity |
| Memory bandwidth | 1 PB/s (Seed) → 400 PB/s (Epiphany) |
| Photon ISA | 18 opcodes (ADD, MUL, QGATE, ENTANGLE, NEURON, MEASURE…) |
| Collection aggregate | ~12 YFLOPS design-target compute across all 1,010 chips |
| Substrate | AES — commodity material at $5/kg, ~8× silicon electron mobility, 2.7× thermal conductivity, direct bandgap |
Everything that ships per design
- Foundry-ready GDSII for every one of the 1,010 configurations.
- Full Verilog RTL source, netlists, and the seed generators (one definition, 1,010 harvests).
- Yosys synthesis + OpenLane P&R configurations, timing constraints, foundry handoff files.
- SPICE models, characterization data, and the AES substrate process design kit (PDK).
- Full 32-to-600-layer stack architecture: voxel compute, quantum, photonic, DNA molecular logic, neuromorphic, power, cooling layers.
- Specialty-layer fabrication recipes (quantum qubits on sapphire, photonic waveguides in silicon nitride, DNA molecular logic on functionalized gold nanopads, solid-state lithium batteries, bismuth-telluride cooling).
- Equipment lists, process-gas specs, the full manufacturing roadmap (~46-week fabrication cycle), every quality-control gate.
- Worldwide commercialization rights under the Master Technology Licensing Agreement.
The nine elements — fully integrated in V20
- LED Power Recycling — 42% net power reduction
- Vertical Threading (TSVs) — 12,000+/mm²
- Nanophotonic Data Flow — 2,800+ channels, sub-1ns latency
- Quantum Error Correction — 99.998% fidelity
- Electromagnetic Cooling — 97% efficient, zero moving parts
- Quantum Battery Layers — on-die burst power
- Quantum-Classical Hybrid — same package, no separation
- Neuromorphic AI Engine — spiking-neuron inference
- Chiplet Stacking — copper-to-copper, sub-200 nm alignment
Patent protection
Within the inventor's portfolio of 41 patent-pending USPTO applications. The AutoPhi-family anchor is U.S. Application 18/370,908. The AES fabrication method is U.S. Application 19/449,352. First-to-file priority defeats later competing claims.
Valuation & pricing
1,010 single-chip designs at the most advanced node, fully integrated stack, with the materials science and fabrication method to build them.
Designs are patent-pending. All performance, capacity, and efficiency figures are design targets, not measured results or guarantees. Power features describe closed-loop energy recovery. Sales to USA buyers only, in USD. Email and postal contact only — no phone, no brokers/intermediaries. To acquire: christopher@cri-one.com.
