AutoPhi V18-Achievement IC Collection
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
AutoPhi V18-Achievement IC Collection
1,000 integrated circuit designs spanning 10 tiers from Seed (130nm) to Acquisition (1.5nm). Light CPU (Color Mathematics) + Quantum CPU architecture. Each IC includes RTL, synthesis scripts, foundry handoff files. Tiered pricing from $333 to multi-trillion-dollar opportunity[1]. Process nodes: 130nm down to 1.5nm. .
© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.
Extended catalog & full narrative — AutoPhi V18-Achievement Collection
The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.
Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility using password CRIONE99KEY. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.
AutoPhi V18-Achievement IC Collection
This is where the line begins.
1,000 integrated-circuit designs. The architecture every later AutoPhi generation descends from.
Mature 130 nm-class silicon, ten tiers, foundry-ready — the seed corpus.
The V18 Achievement Collection is the foundation of the AutoPhi line: 1,000 distinct voxel-processor designs across ten performance tiers, from the entry Seed class up through the Acquisition flagship. Every later generation — V19 Pinnacle, V20 Epiphany — descends from this architecture. Acquiring V18 is acquiring the trunk of the tree.
What the collection covers — in depth
| Spec | V18 Achievement |
|---|---|
| Designs | 1,000 ICs across ten tiers (Seed → Sprout → Sapling → Branch → Canopy → Crown → Summit → Zenith → Apex → Acquisition) |
| Process nodes | 130 nm-class entry through 1.5 nm at the Acquisition tier |
| Architecture | Light CPU using color-mathematics ALUs (18 photon opcodes) + Quantum CPU with the foundational 16-instruction quantum gate set |
| Per-chip compute range | ~1 PFLOPS (entry) to 9.90 ZFLOPS at the Acquisition flagship (APV18-AQC-1000-1.5NM) |
| Collection aggregate | ~515 ZFLOPS design-target compute across all 1,000 chips |
| Electron chromosome | 512-bit instruction width — the original |
| Substrate | AES — commodity material at /kg, ~8× silicon electron mobility, direct bandgap |
Everything that ships per design
- Foundry-ready GDSII for every one of the 1,000 configurations.
- Full Verilog RTL source, netlists, and the generators that grow each tier from the seed spec.
- Yosys synthesis automation and OpenLane place-and-route configurations.
- Timing constraints, SDC files, and physical-verification decks.
- SPICE models, characterization data, and the AES substrate process design kit (PDK).
- Layer-by-layer architecture for every voxel stack.
- Worldwide commercialization rights under the Master Technology Licensing Agreement.
The nine elements — present in V18, refined in later generations
- LED Power Recycling
- Vertical Threading (TSVs)
- Nanophotonic Data Flow
- Quantum Error Correction
- Electromagnetic Cooling
- Quantum Battery Layers
- Quantum-Classical Hybrid
- Neuromorphic AI Engine
- Chiplet Stacking
Why V18 matters
Foundations rarely look like crowning achievements until you look at what was built on them. V18 is the mature, ten-tier, 1,000-design corpus that proved the seed architecture: voxel compute, the photon-chromosome ISA, the AES substrate, the nine-element power-and-cooling stack. Every claim later generations make starts here. A buyer acquiring V18 specifically is acquiring the architectural origin point — the layer underneath the pinnacle.
Patent protection
Sits within a portfolio of 41 patent-pending USPTO applications filed under the inventor's name. The AutoPhi-family anchor is U.S. Application 18/370,908 (AutoPhi — quantum-battery integration & electromagnetic-propulsion IC, filed 2023-09-21). The AES substrate method is U.S. Application 19/449,352. First-to-file priority defeats later competing claims.
Valuation & pricing
One thousand designs at the foundational tier of a fully patent-pending line, with the materials science and fabrication method to build them.
Designs are patent-pending. All performance and capacity figures are design targets, not measured results or guarantees. Power features describe closed-loop energy recovery. Sales to USA buyers only, in USD. Email and postal contact only — no phone, no brokers/intermediaries. To acquire: christopher@cri-one.com.