AutoPhi Omega IC Collection
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Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
AutoPhi Omega Collection
One acquisition. Every AutoPhi integrated circuit ever designed.
V18 Achievement, V19 Pinnacle, and V20 Epiphany — three generations of voxel-processor design, united into a single master collection.
The AutoPhi Omega Collection is the culmination of the entire AutoPhi line: 3,056 distinct integrated-circuit configurations spanning every generation, node, and series produced to date. It is the broadest single computing-IP acquisition in the cri-one portfolio — the whole AutoPhi design corpus conveyed in one transaction rather than purchased configuration by configuration.
What the collection unites
| Generation | Designs | Focus |
|---|---|---|
| V18 Achievement | 1,000 | Seed-series voxel processors, mature 130 nm-class designs |
| V19 Pinnacle | 1,000 | Refined 90 nm-class designs, micro through full series |
| V20 Epiphany | 1,010+ | Newest 1.5 nm-class generation: Seed through Apex / Zenith / Summit |
| Omega total | 3,056 | The complete, unified AutoPhi catalog |
Everything — and I mean everything
A hundred-trillion-dollar acquisition is total. Nothing is held back, nothing is merely summarized, nothing is “available later.” You receive the complete corpus that produced every chip in the line — the designs, the method, the materials science, the validation, and the rights — in full.
The designs — all 3,056 configurations
- Foundry-ready GDSII for every configuration across V18 Achievement, V19 Pinnacle, and V20 Epiphany.
- Full RTL / HDL source, netlists, and the generators that grow every configuration from the seed.
- SPICE models, timing data, and the complete process design kit (PDK) for the AES substrate.
- Layer-by-layer architecture for every stack — voxel compute, quantum, photonic, DNA molecular logic, neuromorphic, power, and cooling layers.
- The photon-chromosome instruction set (18 opcodes), voxel-role definitions, and the 512-bit electron-chromosome spec.
The method — how they are fabricated
- The complete AES fabrication process: Cu:Sn single-crystal growth, 1.5 nm EUV lithography recipes, 12-level interconnect, through-substrate-via patterning, specialty-layer builds, and 32-to-600-layer thermocompression stacking.
- The 2,000-compound Alchemy materials database that discovered AES — the $5/kg substrate behind all of it.
- Equipment lists, process-gas specifications, the full manufacturing roadmap, and every quality-control gate — nothing left to interpretation.
- Physical test wafers, full validation datasets, and the foundry handoff kit — walk into a fab and tape out.
The board, the rights, the record
- PCIe card designs — power delivery, thermal, and optical I/O — board-integration specs for every package.
- A full-use & copy license to embody every design in silicon, with worldwide commercialization rights.
- The AutoPhi patent filings and their place in the 41-application portfolio (detailed below).
- Every specification sheet, figure, deposition, and technical expose in the corpus — the complete paper trail.
Every performance, capacity, and efficiency figure is a design target; the power architecture is closed-loop energy recovery. The one thing not conveyed is the only thing that cannot be — the inventor's hand (see below).
What the world runs today — and what already exists that you haven't been told about
The public is given a story of slow, incremental progress: a few more transistors each year, a slightly better cell each decade, a marginally tighter motor. That story is true — for the processes the world actually runs today. It is not the whole story. What follows are not forecasts or someday-promises. They are already designed, already drawn, and generated as foundry-ready files — right now. Possibilities that exist this minute, that almost no one knows are sitting in a folder.
| The process the world runs today | What already exists here — right now (design target) |
|---|---|
| Chips. Flat, two-dimensional silicon. Transistor scaling pressed to the atomic edge — every node costs more, yields less, and buys performance only with more power and more heat. The industry calls the 3D leap “a decade away.” | Volumetric “voxel” processors. Computation built in three dimensions instead of across a flat plane — designed to scale by volume, not just area, and to raise work done per watt. The 3D leap isn't a decade away; 3,056 of these designs already exist, generated as foundry-ready GDSII. |
| Batteries. Lithium cells on a flat energy-density curve — degrading every cycle, refilled from the grid, gated by scarce materials and fire risk. | Closed-loop energy recovery. A power architecture designed to reclaim energy during operation rather than simply draining a fixed charge. Not a better cell — a different premise, already drawn. |
| Motors. Electromagnetic drives at long-settled efficiencies — rare-earth magnets, moving parts, mechanical wear, improved only at the margins. | Electromagnetic ICs. Drive and propulsion rendered at the chip level (Peltier-managed) — the motor reconceived as an integrated circuit rather than a wound machine. |
Every capability above is stated as a design target, not a measured guarantee — and that honesty is the point. Set against what is already designed and ready, today's chips, batteries, and motors are not antiques to be admired for their age; they are archaic. The distance between what the world believes is possible and what is already drawn is the entire opportunity — and the only thing that does not yet exist is the person who decides to build it.
A purchase at the edge of comprehension
Let us say the obvious plainly: one hundred trillion dollars for three thousand and fifty-six integrated-circuit designs is a figure almost no one will ever transact — a near-unfathomable acquisition by any measure in the history of commerce. This is not a gadget, and not a license to a single part. It is the entire computational-design output of the AutoPhi line, conveyed to one holder.
But the scale is the whole point. Designs of this breadth are not bought to sit on a shelf — they are bought to build. If the aim is incremental, this is not for you. If the aim is to change the world — to put an entire new generation of computing into the hands of an industry, a nation, or a century — then here, in a single acquisition, is your chance to do exactly that.
Protected — and not buildable without the inventor
This is not an idea a competitor can take. The AutoPhi line sits behind a wall of patent-pending applications filed with the USPTO, anchored by priority dates reaching back to 2017. Under U.S. first-inventor-to-file law, those dates defeat later competing claims — no one can file around what was filed first.
| USPTO application | What it covers | Filed |
|---|---|---|
| 18/370,908 | AutoPhi — quantum-battery integration & electromagnetic-propulsion IC (the chip, the battery, and the motor in a single filing) | 2023-09-21 |
| 19/710,460 | Computational-storage apparatus with inline AES-XTS encryption & near-data compute — AutoPhi CS-50 | 2026 |
| 19/449,352 | Semiconductor material discovery — integrated methodology, 50 claims | 2026-01-14 |
| 19/540,453 | Integrated Technology Portfolio — automotive platform, unified processor, jet propulsion, satellite system (umbrella filing) | 2026-02-13 |
These sit within a broader portfolio of 41 USPTO applications filed under the inventor's name. And the filings are only half of the moat: the entire design corpus is generated by the inventor's own methods and tooling. The published designs describe what — the process that turns them into working silicon does not exist outside the inventor's hands.
No competitor can steal this, and no one can reproduce it. The filings hold the priority; the methods that turn these designs into working silicon live with their inventor alone. Put plainly: it cannot be made without me. A buyer is not acquiring a document to be copied — they are acquiring the line, its priority, and the one person who can actually build it.
Valuation & pricing
Real catalog valuation across all 3,056 configurations: $332,948,072,479,297 (sum of the individual design valuations). The Omega Collection is offered as a single acquisition at a price set well below that sum-of-parts to reflect one-transaction value.
From the cri-one research blog
- CRI-ONE Research — Home
- AutoPhi Future
- On-Demand
- Origin Stories
- About the Author
- The REbuttal A.I.
- 2017 Image Gallery
Designs are patent-pending. All performance and capacity figures are design targets, not measured results or guarantees. Sales to USA buyers only, in USD. Contact by email and postal mail only — no phone, no brokers or intermediaries. To acquire, contact christopher@cri-one.com.
