PhantasmPhi V3 — GOPS · Ronna · Quetta, double-strata (PACK_STRATA=12), 1,200 nano layers, QBeam ExitPhi fabric (App# 19/722,805)
In stock
SKU
CRIONE-RONNAPHANTASMPHI-Q3-DOUBLE-STRATA
$637.5B
Leave blank to use the product price.
PhantasmPhi V3 — double-strata generation. PACK_STRATA=12, two complete phantom stacks on one substrate. GOPS · Ronna · Quetta: measured 2.1 GOPS silicon foot, golden-ratio ladder to 10³⁰ Quetta summit. Integrated QBeam ExitPhi fabric (USPTO App# 19/722,805): 400 GB/s bidirectional, 400 ns cut-through, PCIe 5.0 x16. 1,200 nano layers on AES substrate (400 W/m-K). V20 Epiphany architecture. Physical quantum mechanics — self-powered quantum battery layers. All ten technologies × all four axes. Design complete. Foundry handoff ready. $637,500,000,000 per non-exclusive license.
First to market
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
First posted: · Last updated:
CRI-ONE · PHANTASMPHI SERIES · V3 DOUBLE-STRATA · GOPS · RONNA · QUETTA
PhantasmPhi V3 — Double-Strata
Two complete phantom stacks on one substrate. PACK_STRATA=12. The architecture goes taller. Ten technologies × four axes at Quetta. Design complete.
What V3 Adds Over V2
Generation 3 · double-strata · PACK_STRATA=12
Double-strata — two complete phantom stacks on one AES substrate.
PACK_STRATA=12 — 12 mask layers per stratum, doubled from V2.
Taller than wide — the architecture grows UP, not OUT. Progressive vertical scaling.
Generational Law — per-mask cost 25% below V2. Absolute price 3× V1 ($637.5B).
Double-strata — two complete phantom stacks on one AES substrate.
PACK_STRATA=12 — 12 mask layers per stratum, doubled from V2.
Taller than wide — the architecture grows UP, not OUT. Progressive vertical scaling.
Generational Law — per-mask cost 25% below V2. Absolute price 3× V1 ($637.5B).
GOPS · Ronna · Quetta — Full Performance Ladder
| Tier | Scale | V3 Architecture |
|---|---|---|
| Measured Foot | 2.1 GOPS | Single die, double-strata, hash D61C07EB |
| Tera | 10¹² | Multi-die chiplet, 50 layers, dual strata active |
| Peta | 10¹&sup5; | 200 layers, fleet × 1,024, QBeam ExitPhi interconnect |
| Exa | 10¹&sup8; | 400 layers, fleet × 65K, EM cooling engaged |
| Zetta | 10²¹ | 800 layers, fleet × 4M, quantum battery self-power |
| Yotta | 10²&sup4; | 1,200 layers full stack, fleet × 250M |
| Ronna Approach | 10²&sup7; | 1,200 layers × 12.7M facilities, QEC surface code |
| Quetta Summit | 10³&sup0; | Full: 1,200 layers, 480K voxels, 12.7M facilities, all axes maxed |
C = N_voxels × f_voxel × fleet × η_light(0.4289) × κ_abnormal
= 480,000 × 1.1×10&sup9; × 12,700,000 × 0.4289 × 3.72
= 1.07 × 10³&sup0; ops/s [Quetta]
= 480,000 × 1.1×10&sup9; × 12,700,000 × 0.4289 × 3.72
= 1.07 × 10³&sup0; ops/s [Quetta]
Progressive Incremental Ladder — 1,200 Nano Layers
| Step | Layers | × from prior | Function |
|---|---|---|---|
| 1 | 1 | — | Seed die (V3 double-strata proven) |
| 2 | 6 | ×6 | Multi-die chiplet base |
| 3 | 12 | ×2 | Thermal equilibrium anchor (matches PACK_STRATA) |
| 4 | 50 | ×4.2 | LED nano-array integration |
| 5 | 100 | ×2 | Quantum battery charging loop |
| 6 | 200 | ×2 | QEC surface code layers |
| 7 | 400 | ×2 | EM cooling interleave |
| 8 | 800 | ×2 | Fleet replication strata |
| 9 | 1,200 | ×1.5 | Full Quetta stack — all technologies active |
QBeam ExitPhi Fabric — Integrated Interconnect
QBeam ExitPhi · USPTO App# 19/722,805 · integrated
400 GB/s bidirectional — 25.6 GT/s per lane × 16 lanes.
400 ns cut-through latency — wire-speed probability transfer.
PCIe 5.0 x16 HHHL — standard slot, standard power.
CoolBeam thermal management — optical idle links, zero standby power.
PipeBeam ordering — in-order delivery, zero reordering overhead.
12 silicon configurations — 22 nm → 2 nm node coverage.
No cables. No third-party silicon. No licensing fees.
400 GB/s bidirectional — 25.6 GT/s per lane × 16 lanes.
400 ns cut-through latency — wire-speed probability transfer.
PCIe 5.0 x16 HHHL — standard slot, standard power.
CoolBeam thermal management — optical idle links, zero standby power.
PipeBeam ordering — in-order delivery, zero reordering overhead.
12 silicon configurations — 22 nm → 2 nm node coverage.
No cables. No third-party silicon. No licensing fees.
Ten Technologies × Four Axes at Quetta
OUT · 480K voxels UP · 1,200 layers ACROSS · 12.7M facilities SMALLER · ~1.5 nm
| # | Technology | Role in V3 |
|---|---|---|
| 1 | Silicon Quantum Dots (3–10 nm) | Probability state encoding |
| 2 | LED Nano-Array (8×10¹&sup0;/cm²) | Photon pump for quantum battery |
| 3 | Photon Energy Storage (E=hf) | Self-power: emission → re-absorption → coherence |
| 4 | QEC Surface Code | Error correction gating recycling loop |
| 5 | EM Cooling | Thermal management across double-strata layers |
| 6 | Quantum Battery Layers | Self-power doctrine |
| 7 | QBeam ExitPhi (400 GB/s) | Integrated interconnect (App# 19/722,805) |
| 8 | Color Math ALU | Wavelength-coded arithmetic (Red/Yellow/Green) |
| 9 | Phantasm Math Engine | Double-strata probability cores |
| 10 | AES Substrate (400 W/m-K) | Thermal backbone for double-strata stack |
Physical Quantum Mechanics
- Silicon quantum dots (3–10 nm) — discrete energy levels, Zeeman/Landau splitting
- Photon-driven energy storage — E=hf, 250–300 nm, LED nano-array (Patent 18/370,908)
- Quantum superposition charging — multi-state occupation, coherence time > gate time
- 84–98% photon recycling — emit → absorb → re-emit, QEC gated
- Self-power doctrine — quantum battery layers generate their own energy
Golden-Ratio Ladder
Rung(n) = 2.1 × 10&sup9; × 1.61758^n
Rung(100) = 1.07 × 10³&sup0; ops/s [Quetta summit confirmed]
Rung(100) = 1.07 × 10³&sup0; ops/s [Quetta summit confirmed]
License
| Item | Detail |
|---|---|
| Price | $637,500,000,000 USD per non-exclusive license |
| Generational Law | Per-mask cost 25% below V2 |
| Deliverable | RTL source + GDS. Never free, never naked. |
| Restrictions | No PRC/RU entities. US export law. US companies only. USD only. |