AutoPhi V19-Pinnacle -- Volume Series #85

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APV19-VOL-0085-7NM
$118.8B

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Datacenter-scale quantum power — 862.79 ZFLOPS, 42k qubits, 7 nm. Complete manufacturing package (GDSII, netlists, foundry handoff). Build it at TSMC N7 / Samsung 7LPP. Own the SKU line. Patent-pending. — Volume Series #85
First to market

Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.

First posted: · Last updated:
Links

AutoPhi V19-Pinnacle -- Volume Series #85

Datacenter-scale quantum power (Pinnacle Tier 9) — datacenter-scale on standard rack infrastructure — 862.79 ZFLOPS, 298k physical qubits, 208 W. Rack density that reshapes the TCO conversation.

Why this is worth what it costs

Pinnacle-tier means every AutoPhi V19 improvement is switched on for this die — the deepest logical-qubit density, the highest gate fidelity, the longest coherence times available in the catalog. Nobody else sells this class of quantum-classical silicon as a complete tape-out package.

What you are paying for is 15+ years of hybrid quantum-classical R&D, publicly documented since 2010, patent-filed since 2012 — plus the finished mask set. Competing quantum offerings require a companion chip stack (memory controller, PCIe retimer, error-correction ASIC, security co-processor). This one die integrates them.

Real specifications

  • 862.79 ZFLOPS peak throughput
  • 42,500 logical qubits (297,500 physical) at 99.895% gate fidelity
  • 2,275 µs coherence time (T2), 5,005.0 µs relaxation time (T1)
  • 16,384 compute threads, — L3 cache
  • 5.27 GHz clock, 208 W TDP
  • 662.5 GB/s memory bandwidth
  • 26-layer stack, 576-bit ECC protection
  • 903,103,750 max entangled pairs on-die
  • Fabricated at TSMC N7 or Samsung 7LPP, 7 nm node

What it is actually for

Target markets: Hyperscaler datacenters, sovereign quantum clouds, large enterprise deployments.

Applications: Datacenter-scale AI, quantum-classical hybrid workloads, sovereign compute, financial system optimization.

Readiness: architecture ready — foundry PDK required under NDA.

What ships in the license

  • GDSII mask layout, foundry-ready
  • Gate-level Verilog netlist
  • Full RTL: light-CPU core, quantum-CPU core, hybrid top
  • LEF / DEF library exchange files
  • Synthesis, P&R, DRC/LVS scripts with passing reports
  • FOUNDRY_HANDOFF_SIMPLE.txt — everything the fab needs to schedule the mask
  • Performance projection sheet and manufacturing documentation

What you own after the sale

The mask set. Fab it at your foundry. Own the wafers.

The SKU line. Name it, price it, distribute it your way.

Derivative rights. Spin variants at other nodes without coming back to CRI-ONE.

Exclusive license for this implementation. No one else can ship this specific die — anywhere in the world — while you hold the license.

Priority-date defense

The foundational AutoPhi architecture is publicly documented from 2010 (Internet Archive) and patent-filed from 2012 (USPTO), under CRI-ONE’s name and independently verifiable. No prior art can invalidate the claims that come with your license.

Fab it where you already build

TSMC N7 or Samsung 7LPP. Standard commercial EDA flow (Synopsys / Cadence). Drops into the 7 nm PDK under NDA — no new tape-out tooling required.

© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.


Extended catalog & full narrative — AutoPhi V19-Pinnacle -- Volume Series #85

The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.

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Downloads immediately on checkout (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility.

AutoPhi V19-Pinnacle — Volume Series #85

The Volume Series #85 is a next-generation AutoPhi V19 Pinnacle integrated circuit fabricated at 7 nm process technology. Featuring 42500 logical qubits and delivering 862.79 ZFLOPS of sustained throughput, this IC represents CRI-ONE’s most advanced Pinnacle-tier quantum-classical hybrid architecture. SKU: APV19-VOL-0085-7NM.

Performance Specifications

SKUAPV19-VOL-0085-7NM
Series / TierVolume (Tier 9)
Process Node7 nm
Peak Throughput862.79 ZFLOPS
Clock Frequency5.27 GHz
Compute Threads16,384
L3 Cache1,224 MB
TDP208 W
Memory Bandwidth662.5 GB/s
Interconnect Speed1,750 Gb/s
Layer Count26 layers
ECC Protection576-bit
Unit Pricemulti-billion-dollar opportunity[1]
COGSmulti-billion-dollar opportunity[1]
Gross Margin79.9%

Quantum Subsystem

Logical Qubits42,500
Physical Qubits (est.)297,500 (7:1 ratio)
Gate Fidelity99.895%
Coherence Time (T2)2,275 µs
Relaxation Time (T1)5,005.0 µs
Max Entangled Pairs903,103,750
Error CorrectionSurface Code + Pinnacle LDPC
Qubit TechnologyTransmon-V19 Superconducting
Operating Temperature15 mK

Neuromorphic & AI Acceleration

Tensor Cores314
AI Throughput96.2 TOPS (INT8)
Inference Latency1.475 ms
Neural EnginePinnacle NPU v19
Supported FrameworksONNX, TensorRT, PyTorch, JAX
Precision ModesFP64 / FP32 / FP16 / BF16 / INT8 / INT4
On-Chip SRAM612 MB dedicated

DNA Quantum Architecture

Helix Structures121
Synthetic Base Pairs121,000,000
Bio-Stability Index99.945%
Molecular Logic Gates30,976
Self-Repair CapabilityAutonomous (V19 Pinnacle)
DNA Storage Density19.35 EB/mm³

9 Pinnacle Technologies

  • 1. Quantum-Classical Fusion Engine — Seamless hybrid execution pipeline
  • 2. Pinnacle Error Mitigation — Real-time surface code + LDPC decoding
  • 3. DNA Molecular Compute — Bio-synthetic logic at molecular scale
  • 4. Neuromorphic Tensor Array — Brain-inspired parallel processing
  • 5. Cryo-Photonic Interconnect — Zero-loss optical data paths at 15 mK
  • 6. Adaptive Voltage Scaling — Dynamic per-core power optimization
  • 7. Entanglement Mesh Network — Multi-qubit entanglement distribution
  • 8. V19 Security Enclave — Post-quantum cryptographic accelerator
  • 9. Holographic Memory Interface — 3D stacked persistent storage layer

IC Physical Specifications & Licensing

IC Height10 mm (laying flat)
IC Width32 mm
IC Dimensions32 mm³ (cubed package)
Package TypePinnacle BGA-V19
Pin Count1,408
Product TypeVirtual / Digital Delivery
LicenseCRI-ONE Pinnacle Commercial
ClassificationAutoPhi V19-Pinnacle — Volume

Acquisition Path

This product is available through CGB's 4-step acquisition path. The current price is shown in your cart and on the live storefront page.

  • Step 1 — Proof of Function: public, each.
  • Step 2 — Mathematical Deposition: reading material under mutual NDA.
  • Step 3 — Evaluation License: hands-on evaluation under NDA; fee credits toward Step 4.
  • Step 4 — Full Acquisition: You are buying the blueprint. And the right to build it. Not to be used any other way.

See the acquisition path overview ?

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