AutoPhi V19-Pinnacle -- Volume Series #72
Datacenter-scale quantum power (Pinnacle Tier 9) — datacenter-scale on standard rack infrastructure — 744.74 ZFLOPS, 252k physical qubits, 195 W. Rack density that reshapes the TCO conversation.
Why this is worth what it costs
Pinnacle-tier means every AutoPhi V19 improvement is switched on for this die — the deepest logical-qubit density, the highest gate fidelity, the longest coherence times available in the catalog. Nobody else sells this class of quantum-classical silicon as a complete tape-out package.
What you are paying for is 15+ years of hybrid quantum-classical R&D, publicly documented since 2010, patent-filed since 2012 — plus the finished mask set. Competing quantum offerings require a companion chip stack (memory controller, PCIe retimer, error-correction ASIC, security co-processor). This one die integrates them.
Real specifications
- 744.74 ZFLOPS peak throughput
- 36,000 logical qubits (252,000 physical) at 99.882% gate fidelity
- 2,210 µs coherence time (T2), 4,862.0 µs relaxation time (T1)
- 14,336 compute threads, — L3 cache
- 5.21 GHz clock, 195 W TDP
- 630.0 GB/s memory bandwidth
- 24-layer stack, 576-bit ECC protection
- 647,982,000 max entangled pairs on-die
- Fabricated at TSMC N7 or Samsung 7LPP, 7 nm node
What it is actually for
Target markets: Hyperscaler datacenters, sovereign quantum clouds, large enterprise deployments.
Applications: Datacenter-scale AI, quantum-classical hybrid workloads, sovereign compute, financial system optimization.
Readiness: architecture ready — foundry PDK required under NDA.
What ships in the license
- GDSII mask layout, foundry-ready
- Gate-level Verilog netlist
- Full RTL: light-CPU core, quantum-CPU core, hybrid top
- LEF / DEF library exchange files
- Synthesis, P&R, DRC/LVS scripts with passing reports
- FOUNDRY_HANDOFF_SIMPLE.txt — everything the fab needs to schedule the mask
- Performance projection sheet and manufacturing documentation
What you own after the sale
The mask set. Fab it at your foundry. Own the wafers.
The SKU line. Name it, price it, distribute it your way.
Derivative rights. Spin variants at other nodes without coming back to CRI-ONE.
Exclusive license for this implementation. No one else can ship this specific die — anywhere in the world — while you hold the license.
Priority-date defense
The foundational AutoPhi architecture is publicly documented from 2010 (Internet Archive) and patent-filed from 2012 (USPTO), under CRI-ONE’s name and independently verifiable. No prior art can invalidate the claims that come with your license.
Fab it where you already build
TSMC N7 or Samsung 7LPP. Standard commercial EDA flow (Synopsys / Cadence). Drops into the 7 nm PDK under NDA — no new tape-out tooling required.
© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.
Extended catalog & full narrative — AutoPhi V19-Pinnacle -- Volume Series #72
The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.
Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.
AutoPhi V19-Pinnacle — Volume Series #72
The Volume Series #72 is a next-generation AutoPhi V19 Pinnacle integrated circuit fabricated at 7 nm process technology. Featuring 36000 logical qubits and delivering 744.74 ZFLOPS of sustained throughput, this IC represents CRI-ONE’s most advanced Pinnacle-tier quantum-classical hybrid architecture. SKU: APV19-VOL-0072-7NM.
Performance Specifications
| SKU | APV19-VOL-0072-7NM |
| Series / Tier | Volume (Tier 9) |
| Process Node | 7 nm |
| Peak Throughput | 744.74 ZFLOPS |
| Clock Frequency | 5.21 GHz |
| Compute Threads | 14,336 |
| L3 Cache | 1,008 MB |
| TDP | 195 W |
| Memory Bandwidth | 630.0 GB/s |
| Interconnect Speed | 1,620 Gb/s |
| Layer Count | 24 layers |
| ECC Protection | 576-bit |
| Unit Price | multi-billion-dollar opportunity[1] |
| COGS | multi-billion-dollar opportunity[1] |
| Gross Margin | 78.0% |
Quantum Subsystem
| Logical Qubits | 36,000 |
| Physical Qubits (est.) | 252,000 (7:1 ratio) |
| Gate Fidelity | 99.882% |
| Coherence Time (T2) | 2,210 µs |
| Relaxation Time (T1) | 4,862.0 µs |
| Max Entangled Pairs | 647,982,000 |
| Error Correction | Surface Code + Pinnacle LDPC |
| Qubit Technology | Transmon-V19 Superconducting |
| Operating Temperature | 15 mK |
Neuromorphic & AI Acceleration
| Tensor Cores | 288 |
| AI Throughput | 89.1 TOPS (INT8) |
| Inference Latency | 1.54 ms |
| Neural Engine | Pinnacle NPU v19 |
| Supported Frameworks | ONNX, TensorRT, PyTorch, JAX |
| Precision Modes | FP64 / FP32 / FP16 / BF16 / INT8 / INT4 |
| On-Chip SRAM | 504 MB dedicated |
DNA Quantum Architecture
| Helix Structures | 108 |
| Synthetic Base Pairs | 108,000,000 |
| Bio-Stability Index | 99.932% |
| Molecular Logic Gates | 27,648 |
| Self-Repair Capability | Autonomous (V19 Pinnacle) |
| DNA Storage Density | 19.35 EB/mm³ |
9 Pinnacle Technologies
- 1. Quantum-Classical Fusion Engine — Seamless hybrid execution pipeline
- 2. Pinnacle Error Mitigation — Real-time surface code + LDPC decoding
- 3. DNA Molecular Compute — Bio-synthetic logic at molecular scale
- 4. Neuromorphic Tensor Array — Brain-inspired parallel processing
- 5. Cryo-Photonic Interconnect — Zero-loss optical data paths at 15 mK
- 6. Adaptive Voltage Scaling — Dynamic per-core power optimization
- 7. Entanglement Mesh Network — Multi-qubit entanglement distribution
- 8. V19 Security Enclave — Post-quantum cryptographic accelerator
- 9. Holographic Memory Interface — 3D stacked persistent storage layer
IC Physical Specifications & Licensing
| IC Height | 10 mm (laying flat) |
| IC Width | 32 mm |
| IC Dimensions | 32 mm³ (cubed package) |
| Package Type | Pinnacle BGA-V19 |
| Pin Count | 1,408 |
| Product Type | Virtual / Digital Delivery |
| License | CRI-ONE Pinnacle Commercial |
| Classification | AutoPhi V19-Pinnacle — Volume |
Acquisition Path
This product is available through CGB's 4-step acquisition path. The current price is shown in your cart and on the live storefront page.
- Step 1 — Proof of Function: public, each.
- Step 2 — Mathematical Deposition: reading material under mutual NDA.
- Step 3 — Evaluation License: hands-on evaluation under NDA; fee credits toward Step 4.
- Step 4 — Full Acquisition: You are buying the blueprint. And the right to build it. Not to be used any other way.
5801d5d42ba0ead368fc15eca01ee6329269aa95917959cddbe16e7a53870e0eAutoPhi V19-Pinnacle -- Volume Series #72
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
