AutoPhi V18-Achievement -- Peak Series #626
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
AutoPhi V18-Seed Voxel Processor -- Peak Series #626
Maximum single-die performance — the top of what one mask set carries — 4.29 PFLOPS, 65k physical qubits at 730.6 W. Denser than any competitor's single-die quantum offering, at mainstream node economics.
Why this is worth what it costs
Nobody else sells working quantum-classical silicon on these terms. What you are paying for is 15+ years of hybrid quantum-classical R&D, publicly documented since 2010, patent-filed since 2012 — plus the finished mask set.
Competing quantum offerings arrive as a chip surrounded by a companion stack: separate memory controller, PCIe retimer, error-correction ASIC, security co-processor. This die integrates multiple core technologies onto one substrate — including LED power recycling and EM cooling with zero moving parts. Your board design loses parts, your power budget shrinks, and your bring-up time drops from years to months.
Real specifications
- 4.29 PFLOPS Peta-class peak throughput, 52.452 TOPS AI acceleration
- 65k physical qubits at 98.761% gate fidelity
- 618x618 voxel grid (381924 voxels), 88-layer stack
- CPU + full-GPU + DPU, HPC node form factor
- 6.03 GHz clock, 95.21 TB/s memory bandwidth
- 730.6 W self-sufficient — 90% LED power recycling, 85.1% EM cooling (zero moving parts)
- Fabricated at TSMC N7 / Samsung 7LPP, 7 nm node
What it is actually for
Target markets: High-performance computing nodes, large-scale AI inference, climate modeling.
Applications: Full AI model training, protein folding, nuclear simulation, real-time fraud detection at scale.
Readiness: Architecture Ready — Awaiting 7nm NDA/PDK.
What ships in the license
- GDSII mask layout, foundry-ready
- Gate-level Verilog netlist
- Full RTL: light-CPU core, quantum-CPU core, hybrid top
- LEF / DEF library exchange files
- Synthesis, P&R, DRC/LVS scripts with passing reports
- FOUNDRY_HANDOFF_SIMPLE.txt — everything the fab needs to schedule the mask
- Performance projection sheet and manufacturing documentation
What you own after the sale
The mask set. Fab it at your foundry. Own the wafers.
The SKU line. Name it, price it, distribute it your way.
Derivative rights. Spin variants at other nodes without coming back to CRI-ONE.
Exclusive license for this implementation. No one else can ship this specific die — anywhere in the world — while you hold the license.
Priority-date defense
The foundational AutoPhi architecture is publicly documented from 2010 (Internet Archive) and patent-filed from 2012 (USPTO), under CRI-ONE’s name and independently verifiable. No prior art can invalidate the claims that come with your license.
Fab it where you already build
TSMC N7 / Samsung 7LPP. Standard commercial EDA flow (Synopsys / Cadence). Drops into the 7 nm PDK under NDA — no new tape-out tooling required.
© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.
Extended catalog & full narrative — AutoPhi V18-Seed Voxel Processor -- Peak Series #626
The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.
Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility using password CRIONE99KEY. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.
AutoPhi V18 Peak 626: 4.29 PFLOPS Peta-class | 7nm | 64573 Qubits | Maximum single-die performance
Overview
The AutoPhi V18 Peak 626 is a peta-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 7nm process technology. It delivers 4.29 PFLOPS peak performance with 52.452 TOPS AI acceleration across a 618x618 voxel grid (381,924 total voxels) stacked 88 layers deep (5 stack units of 18). Quantum subsystem: 64,573 qubits at 98.761% fidelity (error rate <1.239%) with 15,348 QEC-protected logical qubits. Clocked at 6.03 GHz with 95.21 TB/s memory bandwidth over 107 nanophotonic channels. Neuromorphic engine: 309.9K spiking neurons for event-driven AI processing. Power envelope: 730.6 W with 78% reduction vs 130nm baseline. Integrates 7/9 AutoPhi core technologies. Three-chromosome DNA encoding: 108-bit electron strand, 13 quantum instructions (atomic strand), 12 photon opcodes (light strand). Light-trigger initiated.
Key Specifications
| Performance | 4.29 PFLOPS (Peta-class) |
| Process Node | 7nm |
| Clock Speed | 6.03 GHz |
| AI Acceleration | 52.452 TOPS |
| Quantum Subsystem | 64,573 qubits at 98.761% fidelity (error rate <1.239%) |
| QEC Logical Qubits | 15,348 |
| Memory Bandwidth | 95.21 TB/s |
| Nanophotonic Channels | 107 |
| Neuromorphic Engine | 309.9K spiking neurons |
| Power Envelope | 730.6 W |
| Power Reduction vs 130nm | 78% |
| Voxel Grid | 618x618 (381924 voxels, 88 layers, 5 stack units of 18) |
| Compute Type | CPU + full-GPU + DPU |
| Form Factor | HPC node |
| LED Power Recycling | 90% |
| EM Cooling Efficiency | 85.1% (zero moving parts) |
| Quantum Battery Layers | 8 |
| DNA Encoding | 108-bit electron strand, 13 quantum instructions, 12 photon opcodes |
| Instruction Set | Red=ADD, Blue=SUB, Green=MUL, Yellow=DIV, Cyan=LOAD, Magenta=STORE, White=BRANCH, UV=QGATE, IR=SYNC, Orange=MEASURE, Violet=ENTANGLE, Lime=NEURON |
Target Markets
- High-performance computing nodes
- large-scale AI inference
- climate modeling
Applications
- Full AI model training
- protein folding
- nuclear simulation
- real-time fraud detection at scale
Manufacturing & Fabrication
| Foundry | TSMC N7 / Samsung 7LPP |
| PDK | 7nm PDK (NDA) |
| EDA Flow | Commercial (Synopsys/Cadence) |
| Readiness | Architecture Ready -- Awaiting 7nm NDA/PDK |
Manufacturing Steps
- Obtain TSMC N7 or Samsung 7LPP PDK under NDA
- Run synthesis with 7nm stdcells
- P&R -> TSMC/Samsung DRC/LVS decks
- Package GDSII, LEF, DEF, netlist per FOUNDRY_STANDARDS.md
- Submit via TSMC design portal or Samsung foundry portal
Deliverables
- GDSII (mask layout)
- LEF (library exchange)
- DEF (design exchange)
- Gate-level netlist (Verilog)
- DRC report
- LVS report
- FOUNDRY_HANDOFF_SIMPLE.txt
- RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
- Synthesis scripts
- P&R configurations
- Manufacturing documentation
- Performance projections
RTL Design Files
autophi_light_cpu_core.vautophi_quantum_cpu_core.vautophi_hybrid_cpu_top.v
Acquisition Path
This product is available through CGB's 4-step acquisition path. The current price is shown in your cart and on the live storefront page.
- Step 1 — Proof of Function: public, each.
- Step 2 — Mathematical Deposition: reading material under mutual NDA.
- Step 3 — Evaluation License: hands-on evaluation under NDA.
- Step 4 — Full Acquisition: full transfer of the design package at the price listed above.