AutoPhi V18-Achievement -- Peak Series #590

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SKU
APV18-PEA-0590-7NM
$2M

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Maximum single-die performance — 1.05 PFLOPS, 39k qubits, 7 nm, self-sufficient at 3.4 W. 7/9 core technologies. Complete manufacturing package (GDSII, netlists, foundry handoff). Build it at TSMC N7 / Samsung 7LPP. Own the SKU line. Patent-pending. — Peak Series #590
First to market

Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.

First posted: · Last updated:
Links

AutoPhi V18-Seed Voxel Processor -- Peak Series #590

Maximum single-die performance — the top of what one mask set carries — 1.05 PFLOPS, 39k physical qubits at 408.7 W. Denser than any competitor's single-die quantum offering, at mainstream node economics.

Why this is worth what it costs

Nobody else sells working quantum-classical silicon on these terms. What you are paying for is 15+ years of hybrid quantum-classical R&D, publicly documented since 2010, patent-filed since 2012 — plus the finished mask set.

Competing quantum offerings arrive as a chip surrounded by a companion stack: separate memory controller, PCIe retimer, error-correction ASIC, security co-processor. This die integrates multiple core technologies onto one substrate — including LED power recycling and EM cooling with zero moving parts. Your board design loses parts, your power budget shrinks, and your bring-up time drops from years to months.

Real specifications

  • 1.05 PFLOPS Peta-class peak throughput, 28.048 TOPS AI acceleration
  • 39k physical qubits at 98.113% gate fidelity
  • 503x503 voxel grid (253009 voxels), 73-layer stack
  • CPU + full-GPU + DPU, Server form factor
  • 4.3 GHz clock, 43.08 TB/s memory bandwidth
  • 408.7 W self-sufficient — 88% LED power recycling, 83.2% EM cooling (zero moving parts)
  • Fabricated at TSMC N7 / Samsung 7LPP, 7 nm node

What it is actually for

Target markets: High-performance computing nodes, large-scale AI inference, climate modeling.

Applications: Full AI model training, protein folding, nuclear simulation, real-time fraud detection at scale.

Readiness: Architecture Ready — Awaiting 7nm NDA/PDK.

What ships in the license

  • GDSII mask layout, foundry-ready
  • Gate-level Verilog netlist
  • Full RTL: light-CPU core, quantum-CPU core, hybrid top
  • LEF / DEF library exchange files
  • Synthesis, P&R, DRC/LVS scripts with passing reports
  • FOUNDRY_HANDOFF_SIMPLE.txt — everything the fab needs to schedule the mask
  • Performance projection sheet and manufacturing documentation

What you own after the sale

The mask set. Fab it at your foundry. Own the wafers.

The SKU line. Name it, price it, distribute it your way.

Derivative rights. Spin variants at other nodes without coming back to CRI-ONE.

Exclusive license for this implementation. No one else can ship this specific die — anywhere in the world — while you hold the license.

Priority-date defense

The foundational AutoPhi architecture is publicly documented from 2010 (Internet Archive) and patent-filed from 2012 (USPTO), under CRI-ONE’s name and independently verifiable. No prior art can invalidate the claims that come with your license.

Fab it where you already build

TSMC N7 / Samsung 7LPP. Standard commercial EDA flow (Synopsys / Cadence). Drops into the 7 nm PDK under NDA — no new tape-out tooling required.

© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.


Extended catalog & full narrative — AutoPhi V18-Seed Voxel Processor -- Peak Series #590

The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.

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1

AutoPhi V18 Peak 590: 1.05 PFLOPS Peta-class | 7nm | 38645 Qubits | Maximum single-die performance

Overview

The AutoPhi V18 Peak 590 is a peta-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 7nm process technology. It delivers 1.05 PFLOPS peak performance with 28.048 TOPS AI acceleration across a 503x503 voxel grid (253,009 total voxels) stacked 73 layers deep (5 stack units of 18). Quantum subsystem: 38,645 qubits at 98.113% fidelity (error rate <1.887%) with 8,767 QEC-protected logical qubits. Clocked at 4.3 GHz with 43.08 TB/s memory bandwidth over 78 nanophotonic channels. Neuromorphic engine: 127.3K spiking neurons for event-driven AI processing. Power envelope: 408.7 W with 78% reduction vs 130nm baseline. Integrates 7/9 AutoPhi core technologies. Three-chromosome DNA encoding: 93-bit electron strand, 12 quantum instructions (atomic strand), 11 photon opcodes (light strand). Light-trigger initiated.

Key Specifications

Performance1.05 PFLOPS (Peta-class)
Process Node7nm
Clock Speed4.3 GHz
AI Acceleration28.048 TOPS
Quantum Subsystem38,645 qubits at 98.113% fidelity (error rate <1.887%)
QEC Logical Qubits8,767
Memory Bandwidth43.08 TB/s
Nanophotonic Channels78
Neuromorphic Engine127.3K spiking neurons
Power Envelope408.7 W
Power Reduction vs 130nm78%
Voxel Grid503x503 (253009 voxels, 73 layers, 5 stack units of 18)
Compute TypeCPU + full-GPU + DPU
Form FactorServer
LED Power Recycling88%
EM Cooling Efficiency83.2% (zero moving parts)
Quantum Battery Layers7
DNA Encoding93-bit electron strand, 12 quantum instructions, 11 photon opcodes
Instruction SetRed=ADD, Blue=SUB, Green=MUL, Yellow=DIV, Cyan=LOAD, Magenta=STORE, White=BRANCH, UV=QGATE, IR=SYNC, Orange=MEASURE, Violet=ENTANGLE

Target Markets

  • High-performance computing nodes
  • large-scale AI inference
  • climate modeling

Applications

  • Full AI model training
  • protein folding
  • nuclear simulation
  • real-time fraud detection at scale

Manufacturing & Fabrication

FoundryTSMC N7 / Samsung 7LPP
PDK7nm PDK (NDA)
EDA FlowCommercial (Synopsys/Cadence)
ReadinessArchitecture Ready -- Awaiting 7nm NDA/PDK

Manufacturing Steps

  1. Obtain TSMC N7 or Samsung 7LPP PDK under NDA
  2. Run synthesis with 7nm stdcells
  3. P&R -> TSMC/Samsung DRC/LVS decks
  4. Package GDSII, LEF, DEF, netlist per FOUNDRY_STANDARDS.md
  5. Submit via TSMC design portal or Samsung foundry portal

Deliverables

  • GDSII (mask layout)
  • LEF (library exchange)
  • DEF (design exchange)
  • Gate-level netlist (Verilog)
  • DRC report
  • LVS report
  • FOUNDRY_HANDOFF_SIMPLE.txt
  • RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
  • Synthesis scripts
  • P&R configurations
  • Manufacturing documentation
  • Performance projections

RTL Design Files

  • autophi_light_cpu_core.v
  • autophi_quantum_cpu_core.v
  • autophi_hybrid_cpu_top.v

Acquisition Path

This product is available through CGB's 4-step acquisition path. The current price is shown in your cart and on the live storefront page.

  • Step 1 — Proof of Function: public, each.
  • Step 2 — Mathematical Deposition: reading material under mutual NDA.
  • Step 3 — Evaluation License: hands-on evaluation under NDA; fee credits toward Step 4.
  • Step 4 — Full Acquisition: You are buying the blueprint. And the right to build it. Not to be used any other way.

See the acquisition path overview ?

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