AutoPhi V18-Achievement -- Unified Series #818
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
AutoPhi V18-Seed Voxel Processor -- Unified Series #818
Multi-die unified architecture — multi-die on a single substrate — 911k physical qubits, 7.93 EFLOPS in one package. The first tier where you rack it up like a conventional accelerator.
Why this is worth what it costs
Nobody else sells working quantum-classical silicon on these terms. What you are paying for is 15+ years of hybrid quantum-classical R&D, publicly documented since 2010, patent-filed since 2012 — plus the finished mask set.
Competing quantum offerings arrive as a chip surrounded by a companion stack: separate memory controller, PCIe retimer, error-correction ASIC, security co-processor. This die integrates multiple core technologies onto one substrate — including LED power recycling and EM cooling with zero moving parts. Your board design loses parts, your power budget shrinks, and your bring-up time drops from years to months.
Real specifications
- 7.93 EFLOPS Exa-class peak throughput, 1477.996 TOPS AI acceleration
- 911k physical qubits at 99.732% gate fidelity
- 1714x1714 voxel grid (2937796 voxels), 221-layer stack
- Full CPU + max-GPU + full-DPU, Datacenter card form factor
- 10.883 GHz clock
- Fabricated at TSMC N3 / Samsung 3GAE, 3 nm node
What it is actually for
Target markets: Datacenter cards, cloud computing instances, national lab deployments.
Applications: Hyperscale AI inference, quantum error-corrected computation, multi-tenant cloud quantum, autonomous fleets.
Readiness: Architecture Ready — Awaiting 3nm NDA/PDK.
What ships in the license
- GDSII mask layout, foundry-ready
- Gate-level Verilog netlist
- Full RTL: light-CPU core, quantum-CPU core, hybrid top
- LEF / DEF library exchange files
- Synthesis, P&R, DRC/LVS scripts with passing reports
- FOUNDRY_HANDOFF_SIMPLE.txt — everything the fab needs to schedule the mask
- Performance projection sheet and manufacturing documentation
What you own after the sale
The mask set. Fab it at your foundry. Own the wafers.
The SKU line. Name it, price it, distribute it your way.
Derivative rights. Spin variants at other nodes without coming back to CRI-ONE.
Exclusive license for this implementation. No one else can ship this specific die — anywhere in the world — while you hold the license.
Priority-date defense
The foundational AutoPhi architecture is publicly documented from 2010 (Internet Archive) and patent-filed from 2012 (USPTO), under CRI-ONE’s name and independently verifiable. No prior art can invalidate the claims that come with your license.
Fab it where you already build
TSMC N3 / Samsung 3GAE. Standard commercial EDA flow (Synopsys / Cadence). Drops into the 3 nm PDK under NDA — no new tape-out tooling required.
© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.
Extended catalog & full narrative — AutoPhi V18-Seed Voxel Processor -- Unified Series #818
The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.
Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility using password CRIONE99KEY. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.
AutoPhi V18 Unified 818 - Exa-class Quantum-Classical Hybrid Processor
AutoPhi V18 Unified 818: 7.93 EFLOPS Exa-class | 3nm | 911349 Qubits | Multi-die unified architecture
Overview
The AutoPhi V18 Unified 818 is a exa-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 3nm process technology. It delivers 7.93 EFLOPS peak performance with 1477.996 TOPS AI acceleration across a 1714x1714 voxel grid (2,937,796 total voxels) stacked 221 layers deep (13 stack units of 18). Quantum subsystem: 911,349 qubits at 99.732% fidelity (error rate <0.268%) with 269,162 QEC-protected logical qubits. Clocked at 10.883 GHz with 6.54 PB/s memory bandwidth over 593 nanophotonic channels. Neuromorphic engine: 35.6M spiking neurons for event-driven AI processing. Power envelope: 18.9 W with 87% reduction vs 130nm baseline. Integrates 9/9 AutoPhi core technologies. Three-chromosome DNA encoding: 240-bit electron strand, 30 quantum instructions (atomic strand), 15 photon opcodes (light strand). Light-trigger initiated.
Performance Specifications
| Performance Class | Exa-class |
| Peak FLOPS | 7.93 EFLOPS |
| AI Acceleration (TOPS) | 1477.996 |
| Clock Speed | 10.883 GHz |
| Process Node | 3nm |
| Node Performance vs 130nm | 85.0x |
| Voxel Grid | 1714x1714 (2937796 voxels) |
| Stack Layers | 221 layers / 13 units of 18 |
| Memory Bandwidth | 6.54 PB/s |
| Nanophotonic Channels | 593 |
| TSVs/mm2 | 5360 |
| Power Envelope | 18.9 W |
| Power Reduction vs 130nm | 87% |
| Area Reduction vs 130nm | 91% |
| Compute Role | Full CPU + max-GPU + full-DPU |
Quantum Subsystem
| Physical Qubits | 911349 |
| Logical Qubits (QEC) | 269162 |
| Fidelity | 99.732% |
| Error Rate | <0.268% |
Neuromorphic & AI
| Neuromorphic Neurons | 35.6M |
| TOPS | 1477.996 |
| Thermal Zones | 26 |
18-Seed Voxel DNA Architecture
- Electron Chromosome: 240-bit instruction width
- Atomic Chromosome: 30 quantum gate types
- Photon Chromosome: 15 optical opcodes
- Light Trigger: Single-photon computation initiation
- Encoding: DNA-style compact replicable 3-strand chromosomes
9 Core Technologies (9/9 Active)
- LED Power Recycling: Yes (eff: 90.0%)
- Vertical Threading: Yes
- Chiplet Stacking: Yes
- Nanophotonic Data Flow: Yes
- Quantum Error Correction: Yes
- Electromagnetic Cooling: Yes (eff: 95.3%)
- Quantum Battery Layers: Yes (14 layers)
- Quantum-Classical Hybrid: Yes
- Neuromorphic AI Engine: Yes
Valuation & Pricing (AES)
| IP Valuation | multi-billion-dollar opportunity[1] |
| AES COGS | |
| AES Sell Price | |
| Gross Margin | 75% |
| 5-Year Revenue Projection | multi-billion-dollar opportunity[1] |
| ROI | 300%% |
Foundry Handoff
| Foundry | TSMC N3 / Samsung 3GAE |
| PDK | 3nm PDK (NDA) |
| EDA Flow | Commercial (Synopsys/Cadence) + GAA/EUV |
| Status | Architecture Ready -- Awaiting 3nm NDA/PDK |
| RTL Files | autophi_light_cpu_core.v; autophi_quantum_cpu_core.v; autophi_hybrid_cpu_top.v |
Submission Steps: 1. Obtain TSMC N3 or Samsung 3GAE PDK under NDA. 2. Synthesize with GAA-aware flow. 3. P&R -> DRC/LVS with 3nm decks. 4. Package per FOUNDRY_STANDARDS.md. 5. Submit via foundry portal.
Deliverables: GDSII (mask layout); LEF (library exchange); DEF (design exchange); Gate-level netlist (Verilog); DRC report; LVS report; FOUNDRY_HANDOFF_SIMPLE.txt; RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v); Synthesis scripts; P&R configurations; Manufacturing documentation; Performance projections
Competitive Position
8011.2x NVIDIA H100 FLOPS | 1675.9x H100 memory BW | +quantum +photonic +neuromorphic
FLOPS vs H100: 8011.2096x | BW vs H100: 1675.9067x
Target Market
Datacenter cards; cloud computing instances; national lab deployments
Recommended Applications
Hyperscale AI inference; quantum error-corrected computation; multi-tenant cloud quantum; autonomous fleets
Warranty & Support
7-year enterprise; 24x7 priority; dedicated team
Patent Protection & Intellectual Property
| Patent Status | Patent Pending — AutoPhi Architecture (all novel elements) |
| LED Recycle-Powered System | Patents 3561, 2876, 1026 |
| Electromagnetic Cooling System | Patents 1096, 1097, 1098 |
| 18-Seed Voxel DNA Architecture | Patent Pending |
| Photon Chromosome Encoding | Patent Pending |
| Quantum-Classical Hybrid Integration | Patent Pending |
| IP Owner | Christopher Gabriel Brown / AutoPhi / CRI-ONE |
| Patent Lineage | 96-333 deposition catalog (1755+ filings) |
All architectural elements, voxel designs, chromosome encodings, and integration methods are protected intellectual property. Unauthorized reproduction, reverse engineering, or derivative works are prohibited.
Intent to Profit & Commercial Terms
| Commercial Intent | This product is offered for commercial sale with intent to profit |
| IP Valuation | multi-billion-dollar opportunity[1] |
| AES COGS (Actual Cost) | |
| AES Sell Price | |
| Gross Margin | 75% |
| 5-Year Revenue Projection | multi-billion-dollar opportunity[1] |
| ROI | 300%% |
| Licensing Model | Per-unit sale; contact for volume licensing, OEM, or foundry partnership terms |
| Distribution Rights | Buyer receives design files + foundry handoff package. No resale without written agreement. |
| Monopoly Prevention | Maximum 10 units per buyer per tier to ensure market access |
Seller: Christopher Gabriel Brown / AutoPhi / CRI-ONE
Contact for licensing, OEM, or volume terms: cri-one.com/store/contact