AutoPhi V18-Achievement -- Unified Series #776
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
AutoPhi V18-Seed Voxel Processor -- Unified Series #776
AutoPhi V18 Unified 776: 1.53 EFLOPS Exa-class | 3nm | 516773 Qubits | Multi-die unified architecture
Overview
The AutoPhi V18 Unified 776 is a exa-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 3nm process technology. It delivers 1.53 EFLOPS peak performance with 712.041 TOPS AI acceleration across a 1385x1385 voxel grid (1,918,225 total voxels) stacked 182 layers deep (11 stack units of 18). Quantum subsystem: 516,773 qubits at 99.278% fidelity (error rate <0.722%) with 146,108 QEC-protected logical qubits. Clocked at 7.856 GHz with 2.59 PB/s memory bandwidth over 408 nanophotonic channels. Neuromorphic engine: 12.6M spiking neurons for event-driven AI processing. Power envelope: 7.6 kW with 87% reduction vs 130nm baseline. Integrates 8/9 AutoPhi core technologies. Three-chromosome DNA encoding: 202-bit electron strand, 25 quantum instructions (atomic strand), 14 photon opcodes (light strand). Light-trigger initiated.
Key Specifications
| Performance | 1.53 EFLOPS (Exa-class) |
| Process Node | 3nm |
| Clock Speed | 7.856 GHz |
| AI Acceleration | 712.041 TOPS |
| Quantum Subsystem | 516,773 qubits at 99.278% fidelity (error rate <0.722%) |
| QEC Logical Qubits | 146,108 |
| Memory Bandwidth | 2.59 PB/s |
| Nanophotonic Channels | 408 |
| Neuromorphic Engine | 12.6M spiking neurons |
| Power Envelope | 7.6 kW |
| Power Reduction vs 130nm | 87% |
| Voxel Grid | 1385x1385 (1918225 voxels, 182 layers, 11 stack units of 18) |
| Compute Type | Full CPU + max-GPU + full-DPU |
| Form Factor | Datacenter card |
| LED Power Recycling | 90% |
| EM Cooling Efficiency | 93.1% (zero moving parts) |
| Quantum Battery Layers | 13 |
| DNA Encoding | 202-bit electron strand, 25 quantum instructions, 14 photon opcodes |
| Instruction Set | Red=ADD, Blue=SUB, Green=MUL, Yellow=DIV, Cyan=LOAD, Magenta=STORE, White=BRANCH, UV=QGATE, IR=SYNC, Orange=MEASURE, Violet=ENTANGLE, Lime=NEURON, Teal=DMA, Pink=SECURITY |
Target Markets
- Datacenter cards
- cloud computing instances
- national lab deployments
Applications
- Hyperscale AI inference
- quantum error-corrected computation
- multi-tenant cloud quantum
- autonomous fleets
Pricing & Economics
| AES Tier | AES Tier 4 -- Unified ($10M - $50M) |
| IP Valuation | $21.60B |
| AES COGS | $15.54M |
| AES Sell Price | $62.16M |
| Gross Margin | 75% |
| Revenue Multiple | 30x |
| 5-Year Revenue Projection | $1.86B |
| ROI | 300% |
| Warranty & Support | 7-year enterprise; 24x7 priority; dedicated team |
Manufacturing & Fabrication
| Foundry | TSMC N3 / Samsung 3GAE |
| PDK | 3nm PDK (NDA) |
| EDA Flow | Commercial (Synopsys/Cadence) + GAA/EUV |
| Readiness | Architecture Ready -- Awaiting 3nm NDA/PDK |
Manufacturing Steps
- Obtain TSMC N3 or Samsung 3GAE PDK under NDA
- Synthesize with GAA-aware flow
- P&R -> DRC/LVS with 3nm decks
- Package per FOUNDRY_STANDARDS.md
- Submit via foundry portal
Deliverables
- GDSII (mask layout)
- LEF (library exchange)
- DEF (design exchange)
- Gate-level netlist (Verilog)
- DRC report
- LVS report
- FOUNDRY_HANDOFF_SIMPLE.txt
- RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
- Synthesis scripts
- P&R configurations
- Manufacturing documentation
- Performance projections
RTL Design Files
autophi_light_cpu_core.vautophi_quantum_cpu_core.vautophi_hybrid_cpu_top.v