AutoPhi V18-Achievement -- Unified Series #762

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SKU
APV18-UNI-0762-3NM
$15.1M

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Multi-die unified architecture — 884.35 PFLOPS, 427k qubits, 3 nm, self-sufficient at 15.5 W. 8/9 core technologies. Complete manufacturing package (GDSII, netlists, foundry handoff). Build it at TSMC N3 / Samsung 3GAE. Own the SKU line. Patent-pending. — Unified Series #762
First to market

Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.

First posted: · Last updated:
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AutoPhi V18-Seed Voxel Processor -- Unified Series #762

AutoPhi V18 Unified 762: 884.35 PFLOPS Peta-class | 3nm | 427153 Qubits | Multi-die unified architecture

Overview

The AutoPhi V18 Unified 762 is a peta-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 3nm process technology. It delivers 884.35 PFLOPS peak performance with 558.191 TOPS AI acceleration across a 1289x1289 voxel grid (1,661,521 total voxels) stacked 170 layers deep (10 stack units of 18). Quantum subsystem: 427,153 qubits at 99.127% fidelity (error rate <0.873%) with 118,974 QEC-protected logical qubits. Clocked at 6.847 GHz with 1.90 PB/s memory bandwidth over 360 nanophotonic channels. Neuromorphic engine: 8.9M spiking neurons for event-driven AI processing. Power envelope: 6.1 kW with 87% reduction vs 130nm baseline. Integrates 8/9 AutoPhi core technologies. Three-chromosome DNA encoding: 190-bit electron strand, 24 quantum instructions (atomic strand), 14 photon opcodes (light strand). Light-trigger initiated.

Key Specifications

Performance884.35 PFLOPS (Peta-class)
Process Node3nm
Clock Speed6.847 GHz
AI Acceleration558.191 TOPS
Quantum Subsystem427,153 qubits at 99.127% fidelity (error rate <0.873%)
QEC Logical Qubits118,974
Memory Bandwidth1.90 PB/s
Nanophotonic Channels360
Neuromorphic Engine8.9M spiking neurons
Power Envelope6.1 kW
Power Reduction vs 130nm87%
Voxel Grid1289x1289 (1661521 voxels, 170 layers, 10 stack units of 18)
Compute TypeFull CPU + max-GPU + full-DPU
Form FactorDatacenter card
LED Power Recycling90%
EM Cooling Efficiency92.3% (zero moving parts)
Quantum Battery Layers12
DNA Encoding190-bit electron strand, 24 quantum instructions, 14 photon opcodes
Instruction SetRed=ADD, Blue=SUB, Green=MUL, Yellow=DIV, Cyan=LOAD, Magenta=STORE, White=BRANCH, UV=QGATE, IR=SYNC, Orange=MEASURE, Violet=ENTANGLE, Lime=NEURON, Teal=DMA, Pink=SECURITY

Target Markets

  • Datacenter cards
  • cloud computing instances
  • national lab deployments

Applications

  • Hyperscale AI inference
  • quantum error-corrected computation
  • multi-tenant cloud quantum
  • autonomous fleets

Pricing & Economics

AES TierAES Tier 4 -- Unified ($10M - $50M)
IP Valuation$15.92B
AES COGS$15.09M
AES Sell Price$60.34M
Gross Margin75%
Revenue Multiple30x
5-Year Revenue Projection$1.81B
ROI300%
Warranty & Support7-year enterprise; 24x7 priority; dedicated team

Manufacturing & Fabrication

FoundryTSMC N3 / Samsung 3GAE
PDK3nm PDK (NDA)
EDA FlowCommercial (Synopsys/Cadence) + GAA/EUV
ReadinessArchitecture Ready -- Awaiting 3nm NDA/PDK

Manufacturing Steps

  1. Obtain TSMC N3 or Samsung 3GAE PDK under NDA
  2. Synthesize with GAA-aware flow
  3. P&R -> DRC/LVS with 3nm decks
  4. Package per FOUNDRY_STANDARDS.md
  5. Submit via foundry portal

Deliverables

  • GDSII (mask layout)
  • LEF (library exchange)
  • DEF (design exchange)
  • Gate-level netlist (Verilog)
  • DRC report
  • LVS report
  • FOUNDRY_HANDOFF_SIMPLE.txt
  • RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
  • Synthesis scripts
  • P&R configurations
  • Manufacturing documentation
  • Performance projections

RTL Design Files

  • autophi_light_cpu_core.v
  • autophi_quantum_cpu_core.v
  • autophi_hybrid_cpu_top.v
AutoPhi V18 Seed 762 AutoPhi V18 — Seed #762 Class Peta-class FLOPS 884.35 PFLOPS Node 3nm Clock 6.847 GHz AI Accel 558.191 TOPS Qubits 427.2K Fidelity 127% Mem BW N/A Price $15.9B Power 6.1 kW Voxels 1289x1289 (521 total) Layers 170 Form Datacenter card Compute Full CPU + max-GPU + full-DPU Foundry TSMC N3 / Samsung 3GAE AES Tier 4
United States sales only · USD only · Phone +1 770-776-7023, email & postal mail · Email: crioneaka@outlook.com · 1341 Wellington Cove, Lawrenceville, GA 30043-5255, USA