AutoPhi V18-Achievement -- Peak Series #636

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SKU
APV18-PEA-0636-7NM
$2.1M

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Maximum single-die performance — 6.35 PFLOPS, 74k qubits, 7 nm, self-sufficient at 5.7 W. 7/9 core technologies. Complete manufacturing package (GDSII, netlists, foundry handoff). Build it at TSMC N7 / Samsung 7LPP. Own the SKU line. Patent-pending. — Peak Series #636
First to market

Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.

First posted: · Last updated:
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AutoPhi V18-Seed Voxel Processor -- Peak Series #636

AutoPhi V18 Peak 636: 6.35 PFLOPS Peta-class | 7nm | 74391 Qubits | Maximum single-die performance

Overview

The AutoPhi V18 Peak 636 is a peta-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 7nm process technology. It delivers 6.35 PFLOPS peak performance with 62.413 TOPS AI acceleration across a 654x654 voxel grid (427,716 total voxels) stacked 92 layers deep (6 stack units of 18). Quantum subsystem: 74,391 qubits at 98.941% fidelity (error rate <1.059%) with 17,905 QEC-protected logical qubits. Clocked at 6.511 GHz with 118.67 TB/s memory bandwidth over 117 nanophotonic channels. Neuromorphic engine: 396.8K spiking neurons for event-driven AI processing. Power envelope: 858.5 W with 78% reduction vs 130nm baseline. Integrates 7/9 AutoPhi core technologies. Three-chromosome DNA encoding: 113-bit electron strand, 14 quantum instructions (atomic strand), 12 photon opcodes (light strand). Light-trigger initiated.

Key Specifications

Performance6.35 PFLOPS (Peta-class)
Process Node7nm
Clock Speed6.511 GHz
AI Acceleration62.413 TOPS
Quantum Subsystem74,391 qubits at 98.941% fidelity (error rate <1.059%)
QEC Logical Qubits17,905
Memory Bandwidth118.67 TB/s
Nanophotonic Channels117
Neuromorphic Engine396.8K spiking neurons
Power Envelope858.5 W
Power Reduction vs 130nm78%
Voxel Grid654x654 (427716 voxels, 92 layers, 6 stack units of 18)
Compute TypeCPU + full-GPU + DPU
Form FactorHPC node
LED Power Recycling90%
EM Cooling Efficiency85.7% (zero moving parts)
Quantum Battery Layers8
DNA Encoding113-bit electron strand, 14 quantum instructions, 12 photon opcodes
Instruction SetRed=ADD, Blue=SUB, Green=MUL, Yellow=DIV, Cyan=LOAD, Magenta=STORE, White=BRANCH, UV=QGATE, IR=SYNC, Orange=MEASURE, Violet=ENTANGLE, Lime=NEURON

Target Markets

  • High-performance computing nodes
  • large-scale AI inference
  • climate modeling

Applications

  • Full AI model training
  • protein folding
  • nuclear simulation
  • real-time fraud detection at scale

Pricing & Economics

AES TierAES Tier 3 -- Peak ($2M - $10M)
IP Valuation$1.02B
AES COGS$2.56M
AES Sell Price$8.55M
Gross Margin70%
Revenue Multiple30x
5-Year Revenue Projection$256.44M
ROI233%
Warranty & Support5-year premium; 24x7 support; dedicated engineer

Manufacturing & Fabrication

FoundryTSMC N7 / Samsung 7LPP
PDK7nm PDK (NDA)
EDA FlowCommercial (Synopsys/Cadence)
ReadinessArchitecture Ready -- Awaiting 7nm NDA/PDK

Manufacturing Steps

  1. Obtain TSMC N7 or Samsung 7LPP PDK under NDA
  2. Run synthesis with 7nm stdcells
  3. P&R -> TSMC/Samsung DRC/LVS decks
  4. Package GDSII, LEF, DEF, netlist per FOUNDRY_STANDARDS.md
  5. Submit via TSMC design portal or Samsung foundry portal

Deliverables

  • GDSII (mask layout)
  • LEF (library exchange)
  • DEF (design exchange)
  • Gate-level netlist (Verilog)
  • DRC report
  • LVS report
  • FOUNDRY_HANDOFF_SIMPLE.txt
  • RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
  • Synthesis scripts
  • P&R configurations
  • Manufacturing documentation
  • Performance projections

RTL Design Files

  • autophi_light_cpu_core.v
  • autophi_quantum_cpu_core.v
  • autophi_hybrid_cpu_top.v
AutoPhi V18 Seed 636 AutoPhi V18 — Seed #636 Class Peta-class FLOPS 6.35 PFLOPS Node 7nm Clock 6.511 GHz AI Accel 62.413 TOPS Qubits 74.4K Fidelity 941% Mem BW 118.7 TB/s Price $1.0B Power 858.5 W Voxels 654x654 (716 total) Layers 92 Form HPC node Compute CPU + full-GPU + DPU Foundry TSMC N7 / Samsung 7LPP AES Tier 3
United States sales only · USD only · Phone +1 770-776-7023, email & postal mail · Email: crioneaka@outlook.com · 1341 Wellington Cove, Lawrenceville, GA 30043-5255, USA