AutoPhi V18-Achievement -- Peak Series #630

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APV18-PEA-0630-7NM
$8.5M

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AutoPhi V18 Peak 630 - Peta-class quantum-classical hybrid processor. 5.02 PFLOPS peak | 56.23 TOPS | 68338 qubits | 7nm | 5.3 W net power (self-sufficient) | 7/9 technologies. Patent Pending. COGS: $2.54M. IP Valuation: $897.04M. Foundry: TSMC N7 / Samsung 7LPP.
First to market

Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.

First posted: · Last updated:
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Instant download

Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility using password CRIONE99KEY. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.

AutoPhi V18-Seed Voxel Processor -- Peak Series #3c3c3c

AutoPhi V18 Peak 630: 5.02 PFLOPS Peta-class | 7nm | 68338 Qubits | Maximum single-die performance

Overview

The AutoPhi V18 Peak 630 is a peta-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 7nm process technology. It delivers 5.02 PFLOPS peak performance with 56.23 TOPS AI acceleration across a 632x632 voxel grid (399,424 total voxels) stacked 90 layers deep (5 stack units of 18). Quantum subsystem: 68,338 qubits at 98.833% fidelity (error rate <1.167%) with 16,325 QEC-protected logical qubits. Clocked at 6.222 GHz with 103.98 TB/s memory bandwidth over 111 nanophotonic channels. Neuromorphic engine: 342.1K spiking neurons for event-driven AI processing. Power envelope: 779.3 W with 78% reduction vs 130nm baseline. Integrates 7/9 AutoPhi core technologies. Three-chromosome DNA encoding: 110-bit electron strand, 14 quantum instructions (atomic strand), 12 photon opcodes (light strand). Light-trigger initiated.

Key Specifications

Performance5.02 PFLOPS (Peta-class)
Process Node7nm
Clock Speed6.222 GHz
AI Acceleration56.23 TOPS
Quantum Subsystem68,338 qubits at 98.833% fidelity (error rate <1.167%)
QEC Logical Qubits16,325
Memory Bandwidth103.98 TB/s
Nanophotonic Channels111
Neuromorphic Engine342.1K spiking neurons
Power Envelope779.3 W
Power Reduction vs 130nm78%
Voxel Grid632x632 (399424 voxels, 90 layers, 5 stack units of 18)
Compute TypeCPU + full-GPU + DPU
Form FactorHPC node
LED Power Recycling90%
EM Cooling Efficiency85.4% (zero moving parts)
Quantum Battery Layers8
DNA Encoding110-bit electron strand, 14 quantum instructions, 12 photon opcodes
Instruction SetRed=ADD, Blue=SUB, Green=MUL, Yellow=DIV, Cyan=LOAD, Magenta=STORE, White=BRANCH, UV=QGATE, IR=SYNC, Orange=MEASURE, Violet=ENTANGLE, Lime=NEURON

Target Markets

  • High-performance computing nodes
  • large-scale AI inference
  • climate modeling

Applications

  • Full AI model training
  • protein folding
  • nuclear simulation
  • real-time fraud detection at scale

Manufacturing & Fabrication

FoundryTSMC N7 / Samsung 7LPP
PDK7nm PDK (NDA)
EDA FlowCommercial (Synopsys/Cadence)
ReadinessArchitecture Ready -- Awaiting 7nm NDA/PDK

Manufacturing Steps

  1. Obtain TSMC N7 or Samsung 7LPP PDK under NDA
  2. Run synthesis with 7nm stdcells
  3. P&R -> TSMC/Samsung DRC/LVS decks
  4. Package GDSII, LEF, DEF, netlist per FOUNDRY_STANDARDS.md
  5. Submit via TSMC design portal or Samsung foundry portal

Deliverables

  • GDSII (mask layout)
  • LEF (library exchange)
  • DEF (design exchange)
  • Gate-level netlist (Verilog)
  • DRC report
  • LVS report
  • FOUNDRY_HANDOFF_SIMPLE.txt
  • RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
  • Synthesis scripts
  • P&R configurations
  • Manufacturing documentation
  • Performance projections

RTL Design Files

  • autophi_light_cpu_core.v
  • autophi_quantum_cpu_core.v
  • autophi_hybrid_cpu_top.v

Acquisition Path

This product is available through CGB's 4-step acquisition path. The current price is shown in your cart and on the live storefront page.

  • Step 1 — Proof of Function: public, $1.69 each.
  • Step 2 — Mathematical Deposition: reading material under mutual NDA.
  • Step 3 — Evaluation License: hands-on evaluation under NDA; fee credits toward Step 4.
  • Step 4 — Full Acquisition:

See the acquisition path overview →

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