
AutoPhi V18-Seed Voxel Processor -- Peak Series #561
Maximum single-die performance — the top of what one mask set carries — 336.58 TFLOPS, 25k physical qubits at 268.6 W. Denser than any competitor's single-die quantum offering, at mainstream node economics.
Why this is worth what it costs
Nobody else sells working quantum-classical silicon on these terms. What you are paying for is 15+ years of hybrid quantum-classical R&D, publicly documented since 2010, patent-filed since 2012 — plus the finished mask set.
Competing quantum offerings arrive as a chip surrounded by a companion stack: separate memory controller, PCIe retimer, error-correction ASIC, security co-processor. This die integrates multiple core technologies onto one substrate — including LED power recycling and EM cooling with zero moving parts. Your board design loses parts, your power budget shrinks, and your bring-up time drops from years to months.
Real specifications
- 336.58 TFLOPS Tera-class peak throughput, 16.94 TOPS AI acceleration
- 25k physical qubits at 98.453% gate fidelity
- 424x424 voxel grid (179776 voxels), 63-layer stack
- CPU + full-GPU + DPU, Server form factor
- 4.817 GHz clock, 22.75 TB/s memory bandwidth
- 268.6 W self-sufficient — 86% LED power recycling, 81.7% EM cooling (zero moving parts)
- Fabricated at Samsung 10LPE / TSMC N10, 10 nm node
What it is actually for
Target markets: High-performance computing nodes, large-scale AI inference, climate modeling.
Applications: Full AI model training, protein folding, nuclear simulation, real-time fraud detection at scale.
Readiness: Architecture Ready — Awaiting 10nm PDK.
What ships in the license
- GDSII mask layout, foundry-ready
- Gate-level Verilog netlist
- Full RTL: light-CPU core, quantum-CPU core, hybrid top
- LEF / DEF library exchange files
- Synthesis, P&R, DRC/LVS scripts with passing reports
- FOUNDRY_HANDOFF_SIMPLE.txt — everything the fab needs to schedule the mask
- Performance projection sheet and manufacturing documentation
What you own after the sale
The mask set. Fab it at your foundry. Own the wafers.
The SKU line. Name it, price it, distribute it your way.
Derivative rights. Spin variants at other nodes without coming back to CRI-ONE.
Exclusive license for this implementation. No one else can ship this specific die — anywhere in the world — while you hold the license.
Priority-date defense
The foundational AutoPhi architecture is publicly documented from 2010 (Internet Archive) and patent-filed from 2012 (USPTO), under CRI-ONE’s name and independently verifiable. No prior art can invalidate the claims that come with your license.
Fab it where you already build
Samsung 10LPE / TSMC N10. Standard commercial EDA flow (Synopsys / Cadence). Drops into the 10 nm PDK under NDA — no new tape-out tooling required.
© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.
Extended catalog & full narrative — AutoPhi V18-Seed Voxel Processor -- Peak Series #561
The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.
Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.
AutoPhi V18 Peak 561: 336.58 TFLOPS Tera-class | 10nm | 25440 Qubits | Maximum single-die performance
Overview
The AutoPhi V18 Peak 561 is a tera-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 10nm process technology. It delivers 336.58 TFLOPS peak performance with 16.94 TOPS AI acceleration across a 424x424 voxel grid (179,776 total voxels) stacked 63 layers deep (4 stack units of 18). Quantum subsystem: 25,440 qubits at 98.453% fidelity (error rate <1.547%) with 5,550 QEC-protected logical qubits. Clocked at 4.817 GHz with 22.75 TB/s memory bandwidth over 60 nanophotonic channels. Neuromorphic engine: 62.2K spiking neurons for event-driven AI processing. Power envelope: 268.6 W with 72% reduction vs 130nm baseline. Integrates 7/9 AutoPhi core technologies. Three-chromosome DNA encoding: 82-bit electron strand, 10 quantum instructions (atomic strand), 11 photon opcodes (light strand). Light-trigger initiated.
Key Specifications
| Performance | 336.58 TFLOPS (Tera-class) |
| Process Node | 10nm |
| Clock Speed | 4.817 GHz |
| AI Acceleration | 16.94 TOPS |
| Quantum Subsystem | 25,440 qubits at 98.453% fidelity (error rate <1.547%) |
| QEC Logical Qubits | 5,550 |
| Memory Bandwidth | 22.75 TB/s |
| Nanophotonic Channels | 60 |
| Neuromorphic Engine | 62.2K spiking neurons |
| Power Envelope | 268.6 W |
| Power Reduction vs 130nm | 72% |
| Voxel Grid | 424x424 (179776 voxels, 63 layers, 4 stack units of 18) |
| Compute Type | CPU + full-GPU + DPU |
| Form Factor | Server |
| LED Power Recycling | 86% |
| EM Cooling Efficiency | 81.7% (zero moving parts) |
| Quantum Battery Layers | 6 |
| DNA Encoding | 82-bit electron strand, 10 quantum instructions, 11 photon opcodes |
| Instruction Set | Red=ADD, Blue=SUB, Green=MUL, Yellow=DIV, Cyan=LOAD, Magenta=STORE, White=BRANCH, UV=QGATE, IR=SYNC, Orange=MEASURE, Violet=ENTANGLE |
Target Markets
- High-performance computing nodes
- large-scale AI inference
- climate modeling
Applications
- Full AI model training
- protein folding
- nuclear simulation
- real-time fraud detection at scale
Manufacturing & Fabrication
| Foundry | Samsung 10LPE / TSMC N10 |
| PDK | 10nm PDK (NDA) |
| EDA Flow | Commercial (Synopsys/Cadence) |
| Readiness | Architecture Ready -- Awaiting 10nm PDK |
Manufacturing Steps
- Obtain 10nm PDK under NDA
- Synthesize -> P&R -> DRC/LVS
- Package per FOUNDRY_STANDARDS.md
- Submit via foundry portal
Deliverables
- GDSII (mask layout)
- LEF (library exchange)
- DEF (design exchange)
- Gate-level netlist (Verilog)
- DRC report
- LVS report
- FOUNDRY_HANDOFF_SIMPLE.txt
- RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
- Synthesis scripts
- P&R configurations
- Manufacturing documentation
- Performance projections
RTL Design Files
autophi_light_cpu_core.vautophi_quantum_cpu_core.vautophi_hybrid_cpu_top.v
Acquisition Path
This product is available through CGB's 4-step acquisition path. The current price is shown in your cart and on the live storefront page.
- Step 1 — Proof of Function: public, each.
- Step 2 — Mathematical Deposition: reading material under mutual NDA.
- Step 3 — Evaluation License: hands-on evaluation under NDA; fee credits toward Step 4.
- Step 4 — Full Acquisition: You are buying the blueprint. And the right to build it. Not to be used any other way.
fae3a010a19ab60809d873c245538beeca6b5cf6eeeab9fab3d7b72665514b1aAutoPhi V18-Achievement -- Peak Series #561
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.







