AutoPhi V18-Achievement -- Micro Series #97
Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.
AutoPhi V18-Seed Voxel Processor -- Micro Series #97
Small form, real quantum power — the smallest self-sufficient quantum-classical die you can buy — 12 physical qubits at 217.7 mW, drops into an IoT sensor without a heat sink.
Why this is worth what it costs
Nobody else sells working quantum-classical silicon on these terms. What you are paying for is 15+ years of hybrid quantum-classical R&D, publicly documented since 2010, patent-filed since 2012 — plus the finished mask set.
Competing quantum offerings arrive as a chip surrounded by a companion stack: separate memory controller, PCIe retimer, error-correction ASIC, security co-processor. This die integrates multiple core technologies onto one substrate — including LED power recycling and EM cooling with zero moving parts. Your board design loses parts, your power budget shrinks, and your bring-up time drops from years to months.
Real specifications
- 4.30 MFLOPS Mega-class peak throughput, 0.005 TOPS AI acceleration
- 12 physical qubits at 94.306% gate fidelity
- 10x10 voxel grid (100 voxels), 3-layer stack
- CPU-only, Edge / IoT form factor
- 0.231 GHz clock, 828.6 MB/s memory bandwidth
- 217.7 mW self-sufficient
- Fabricated at GlobalFoundries, 90 nm node
What it is actually for
Target markets: IoT edge devices, embedded quantum sensing, low-power smart devices.
Applications: Quantum-enhanced sensing, edge AI inference, smart sensor fusion, lightweight encryption.
Readiness: Architecture Ready — Awaiting GF 90nm PDK.
What ships in the license
- GDSII mask layout, foundry-ready
- Gate-level Verilog netlist
- Full RTL: light-CPU core, quantum-CPU core, hybrid top
- LEF / DEF library exchange files
- Synthesis, P&R, DRC/LVS scripts with passing reports
- FOUNDRY_HANDOFF_SIMPLE.txt — everything the fab needs to schedule the mask
- Performance projection sheet and manufacturing documentation
What you own after the sale
The mask set. Fab it at your foundry. Own the wafers.
The SKU line. Name it, price it, distribute it your way.
Derivative rights. Spin variants at other nodes without coming back to CRI-ONE.
Exclusive license for this implementation. No one else can ship this specific die — anywhere in the world — while you hold the license.
Priority-date defense
The foundational AutoPhi architecture is publicly documented from 2010 (Internet Archive) and patent-filed from 2012 (USPTO), under CRI-ONE’s name and independently verifiable. No prior art can invalidate the claims that come with your license.
Fab it where you already build
GlobalFoundries. Standard commercial EDA flow (Synopsys / Cadence). Drops into the 90 nm PDK under NDA — no new tape-out tooling required.
© CRI-ONE. All rights reserved. Patents issued and pending. Unauthorized reproduction of the underlying designs is prohibited.
Extended catalog & full narrative — AutoPhi V18-Seed Voxel Processor -- Micro Series #97
The extended dossier appended from the 2026-08-05 catalog snapshot. Prices in the body copy have been stripped; the live-store price on this page is the authoritative figure. Images have been omitted.
Downloads immediately on checkout — the CD GDSII Generator (AES-256 encrypted). Open with 7-Zip, WinRAR, or macOS Archive Utility using password CRIONE99KEY. Founder Access Pass credit (code FAP99CREDIT) applies at checkout.
AutoPhi V18 Micro 97: 4.30 MFLOPS Mega-class | 90nm | 12 Qubits | Small form, real quantum power
Overview
The AutoPhi V18 Micro 97 is a mega-class quantum-classical hybrid processor built on the 18-seed voxel DNA architecture at 90nm process technology. It delivers 4.30 MFLOPS peak performance with 0.005 TOPS AI acceleration across a 10x10 voxel grid (100 total voxels) stacked 3 layers deep (1 stack units of 18). Quantum subsystem: 12 qubits at 94.306% fidelity (error rate <5.694%). Clocked at 0.231 GHz with 828.6 MB/s memory bandwidth. Power envelope: 217.7 mW with 15% reduction vs 130nm baseline. Integrates 2/9 AutoPhi core technologies. Three-chromosome DNA encoding: 12-bit electron strand, 1 quantum instructions (atomic strand), 3 photon opcodes (light strand). Light-trigger initiated.
Key Specifications
| Performance | 4.30 MFLOPS (Mega-class) |
| Process Node | 90nm |
| Clock Speed | 0.231 GHz |
| AI Acceleration | 0.005 TOPS |
| Quantum Subsystem | 12 qubits at 94.306% fidelity (error rate <5.694%) |
| Memory Bandwidth | 828.6 MB/s |
| Power Envelope | 217.7 mW |
| Power Reduction vs 130nm | 15% |
| Voxel Grid | 10x10 (100 voxels, 3 layers, 1 stack units of 18) |
| Compute Type | CPU-only |
| Form Factor | Edge / IoT |
| LED Power Recycling | 55.1% |
| DNA Encoding | 12-bit electron strand, 1 quantum instructions, 3 photon opcodes |
| Instruction Set | Red=ADD, Blue=SUB, Green=MUL |
Target Markets
- IoT edge devices
- embedded quantum sensing
- low-power smart devices
Applications
- Quantum-enhanced sensing
- edge AI inference
- smart sensor fusion
- lightweight encryption
Manufacturing & Fabrication
| Foundry | GlobalFoundries |
| PDK | GF 90nm (NDA) |
| EDA Flow | Commercial (Synopsys/Cadence) |
| Readiness | Architecture Ready -- Awaiting GF 90nm PDK |
Manufacturing Steps
- Obtain GF 90nm PDK under NDA
- Synthesize -> P&R -> DRC/LVS
- Package per FOUNDRY_STANDARDS.md
- Submit via GF design portal
Deliverables
- GDSII (mask layout)
- LEF (library exchange)
- DEF (design exchange)
- Gate-level netlist (Verilog)
- DRC report
- LVS report
- FOUNDRY_HANDOFF_SIMPLE.txt
- RTL (autophi_light_cpu_core.v + autophi_quantum_cpu_core.v + autophi_hybrid_cpu_top.v)
- Synthesis scripts
- P&R configurations
- Manufacturing documentation
- Performance projections
RTL Design Files
autophi_light_cpu_core.vautophi_quantum_cpu_core.vautophi_hybrid_cpu_top.v
Acquisition Path
This product is available through CGB's 4-step acquisition path. The current price is shown in your cart and on the live storefront page.
- Step 1 — Proof of Function: public, each.
- Step 2 — Mathematical Deposition: reading material under mutual NDA.
- Step 3 — Evaluation License: hands-on evaluation under NDA.
- Step 4 — Full Acquisition: full transfer of the design package at the price listed above.