AutoPhi EM-IC Hybrid Combinations — 1000 Configurations (Peltier Cooled)

In stock
SKU
AUTOPHI-EMIC-HYBRID-1000
$25K

💳 Available Payment Options

Companies can pay via the structures below. Exact amounts and terms are set per item at agreement. Use the calculator to see approximate payments for a given total and term.

Leave blank to use the product price.
Full amount due upon agreement or by agreed date. Best for simpler deals.
Amount Due:

Sign the license agreement and complete payment via wire transfer.

Equal payments monthly (or quarterly for 24+ months).
Payment Amount:
Frequency:
Total Payments:

Sign the license agreement and complete payment via wire transfer.

Upfront fee (20-30%) + % of net revenue, with minimum annual royalty. Paid quarterly.
Upfront Fee:
Remaining (via royalty):

+ % of net revenue quarterly, with minimum annual royalty. Terms set at agreement.

Sign the license agreement and complete payment via wire transfer.

% of gross or net revenue, no/minimal upfront. Good when revenue is more predictable than milestones.
Structure: % of gross or net revenue

No or minimal upfront cost. Percentage and terms set at agreement based on projected revenue.

Sign the license agreement and complete payment via wire transfer.

Payments at key events: signing, delivery, first sale, regulatory approval, etc.
Typical Milestones:
  • Signing
  • Delivery
  • First Sale
  • Regulatory Approval

Amounts allocated per milestone at agreement. Total equals the agreed price.

Sign the license agreement and complete payment via wire transfer.

Fixed fee per year, renewable. Suits ongoing use, updates, or support. Multi-year discounts possible.
Annual Fee:
Discount:
Total over term:

Sign the license agreement and complete payment via wire transfer.

Lump sum due Net 30, Net 60, or Net 90 after agreement or delivery. Single payment, later date.
Amount Due:
Due Date:

Sign the license agreement and complete payment via wire transfer.

1000 hybrid combination electromagnetic IC configurations. 10 shape combos (ring+strip, ring+grid, grid+spiral, full-hybrid, etc.) on one plate ballast. Multi-mode motion. 16-256 ICs. Peltier cooled. Robotics, aerospace, medical. Real seed: 1.29 TFLOPS/IC.
First to market

Publicly online since 2010 · U.S. patent applications since 2012 · inventions offered since 2014. The work of Christopher Gabriel Brown, independently documented.

First posted: · Last updated:
Links

What This Is

Mixed array shapes on one plate for multi-mode motion. Combine rotation + linear, positioning + thrust, or any combination for complex actuation.

1000

Hybrid Configs

10

Shape Combos

330.24

Max TFLOPS

2+

Motion Modes

Specifications

Parameter

Range / Options

Shape Combos

Ring+Strip, Ring+Grid, Strip+Grid, Grid+Spiral, Full-Hybrid, etc.

IC Count

16 to 256

Motion Modes

Primary + secondary (e.g., rotation + tilt)

Plate Ballast

Silicon, Ceramic, Aluminum, Copper, Cu-W, Diamond

All configurations include:

  • On-die Peltier electromagnetic cooling (Bi2Te3, 97% efficiency)
  • Photon chromosome control (wavelength=opcode, polarization=operand, path=address, intensity=magnitude)
  • Real seed data: 130nm, 20x20mm die, 1290 voxels, 1.29 TFLOPS/IC, $20K AES COGS
  • All 6 chip tiers: Entry, Mid, Pro, Peak, Unified, Volume
  • 8 voxel types: LIGHT, MAGNETIC, ELECTRIC, HYBRID, QUANTUM, INTERCONNECT, IO, MEMORY + PELTIER

Peltier Electromagnetic Cooling

On-die Bi2Te3 thermoelectric junctions pump heat from computation to plate ballast. 97% efficiency. Adaptive per-zone cooling controlled by photon chromosome (COOL opcode, far-IR 1550nm band). No external cooling system needed.

Photon Chromosome Encoding

Photon Property

IC Meaning

Example

Wavelength

Opcode

Red=ADD, Blue=SUB, Green=MUL, Yellow=DIV

Polarization

Operand

H=reg A, V=reg B

Path

Address

Waveguide route to target voxel

Intensity

Magnitude

Photon count = operand value

Seed Specifications (Real)

Parameter

130nm Seed

Die Size

20mm x 20mm (400 mm²)

Voxels per IC

1,290 at 0.31 mm² each

FLOPS per Voxel

1 GFLOPS

Compute per IC

1.29 TFLOPS

Density

3.225 GFLOPS/mm²

Power per IC

400W

AES COGS per IC

$20,000

Applications

Drone propulsion + gimbal, robotic multi-joint, aerospace multi-mode, medical compound actuators.

Note: The intellectual property portfolio (3,500+ inventions, 13+ USPTO patent applications) is not for sale. Only patterns and ICs are sold under license. IP remains the exclusive property of Christopher Gabriel Brown.

Christopher Gabriel Brown

1341 Wellington Cove, Lawrenceville, GA 30043-5255, USA

Email:: christopher@cri-one.com • Email: crioneaka@outlook.com

Copyright 2017-2026 Christopher Gabriel Brown. All rights reserved. Patent applications pending at USPTO.

United States sales only · USD only · Phone +1 770-776-7023, email & postal mail · Email: crioneaka@outlook.com · 1341 Wellington Cove, Lawrenceville, GA 30043-5255, USA