AutoPhi On-Demand IC Catalog

The Seed — one definition, many harvests

The seed is the minimal, canonical specification from which every build is grown. It is the canonical set — one definition, thousands of harvests.

The nine elements — AutoPhi's tricks of the trade

1. LED Power Recycling
2. Vertical Threading (TSVs)
3. Nanophotonic Data Flow
4. Quantum Error Correction
5. Electromagnetic Cooling
6. Quantum Battery Layers
7. Quantum-Classical Hybrid
8. Neuromorphic AI Engine
9. Chiplet Stacking

From base to pinnacle (design targets, V20 Epiphany generation)

Yotta-class. The line's flagship — the AutoPhi V19 Pinnacle top configuration (APV19-AQC-0100-1.5NM) — reaches a design-target 100 YFLOPS (one hundred yottaFLOPS) on a single chip. Below it the V20 Epiphany generation runs 300 EFLOPS to 40.38 ZFLOPS per chip and aggregates to ~12 YFLOPS across its 1,000 configurations. Every figure is a design target on the patent-pending AES substrate — not a measured guarantee.

Worth the pennies. The entry tier starts at a few hundred dollars for a single chip designed to out-compute a datacenter — about 300 EFLOPS, on the order of 877× an NVIDIA H100 — and the line scales all the way to the 100-YFLOPS yotta-class flagship. Measured against what they are built to do — a national-scale compute facility from a single chip — every tier on this page is priced at pennies on the dollar of its real worth.

How they're built — the $5 substrate

Every configuration above is fabricated by a single method — Semiconductor Method Discovery: AES YFlops IC Fabrication (patent-pending #19/449,352). The chips are not built on silicon. They are grown on AES, a commodity material at $5/kg that moves electrons 8× faster than silicon, conducts heat ~3× better, and carries a direct bandgap — fabricated on the same 1.5 nm EUV lithography the world's most advanced fabs use, adapted for AES. The substrate is five dollars. The capability is unlimited.