AutoPhi Scale Ultimate — Full Stack, 24+25+26, $3T Valuation
First published Feb 6, 2026 on christophergabrielbrown.com. Some details, such as prices, offers and links, have changed since it first went online.
The ceiling of the AutoPhi CPU line: a single amended design that re-makes Scale Plus (25) and Scale Pro (26) inside one chip and carries forward Scale Series (24) full technology stack. Project 27 delivers all nine Ultimate Technology Integration interfaces, a 10 mm × 10 mm die sized for a traditional CPU socket, 3.508 EFLOPS per CPU (Scale Pro core), 1.07B+ threads, 256 qubits, and zettaflops-scale performance (1.75–3.5 ZettaFLOPS with accelerators).
Project 27: Scale Ultimate. Single amended design: 24 (full tech stack) + 25 (Scale Plus tier) + 26 (Scale Pro core). Nine technologies: LED Power Recycling, Vertical Threading, Chiplet Stacking, Nanophotonic, QEC, Electromagnetic Cooling, Quantum Battery Layers, Quantum–Classical Hybrid, Neuromorphic AI. 10 mm × 10 mm traditional CPU form factor. $3T (full) valuation. Twelve product types (low COGS, high mfg probability). RTL, synthesis, OpenLANE flow ready. Segment GDSII and LEF in-repo. Available at AutoPhi Scale Ultimate 12[dead link] (christophergabrielbrown.com)
Overview
AutoPhi Scale Ultimate re-makes 25 and 26 inside 27 as amended; 25 and 26 remain unchanged. From 24 it takes Ultimate Technology Integration (all nine interfaces). From 25 it takes Scale Plus (2× fractional, 128 qubits, 536M+ threads) — documented and spec. From 26 it takes the Scale Pro core (4× fractional, 256 qubits, 1.07B+ threads) — the RTL in 27.
Key Features
- Full stack: All nine Ultimate Technology Integration interfaces in one design
- Scale Pro core in 27: 4× fractional, 3.508 EFLOPS per CPU, 1.07B+ threads, 256 qubits
- Traditional CPU form factor: 10 mm × 10 mm (100 mm²) die; socket-compatible
- Zettaflops-scale with accelerators: 1.75–3.5 ZettaFLOPS with AutoPhi REV-1, REV-4, REV-5
- Segments and multiply: Build small unit dies (1 mm or 2 mm); multiply N×M in the plane; vertical chiplet stacking (Z)
- Voxel die building: Die as grid of voxels; multiply and add horizontally, vertically, diagonally, cross-wise, and stack vertical chiplets
Ultimate Technology Integration — Nine Technologies
- LED Power Recycling — 90% efficiency; 42% net power reduction
- Vertical Threading — 12K TSVs/mm²; 125 TB/s bandwidth
- Chiplet Stacking — 500 layers; 18 layers per stack
- Nanophotonic Data Flow — 1,400 TB/s; 2,800 channels
- Quantum Error Correction — 99.998% accuracy; 1,400 logical qubits
- Electromagnetic Cooling — 97% efficiency; 32 thermal zones
- Quantum Battery Layers — 20 layers; 1,500 Wh; 75 MW burst
- Quantum–Classical Hybrid — Seamless integration
- Neuromorphic AI Engine — Event-driven processing
Status
RTL complete (hybrid, tiled N×M, voxel grid). Synthesis (Yosys) and OpenLANE (full 10 mm, segment 1 mm/2 mm) in place. Segment GDSII and LEF in deliverables/segment_run/. Twelve product types and COGS/mfg table documented.
Contact: Christopher Gabriel Brown — [redacted] —Email: christopher@cri-one.com — christopher@cri-one.com