Power and Cooling in the Envelope
Written for publication Mar 9, 2026. Some details, such as prices, offers and links, may have changed since.
The envelope includes power and cooling. The seed matrix takes power_w; the outcome includes P_per_watt. ZettaFLOPS in real height and width inside a normal run of an IC wafer require the right ratio and the right envelope. Power and cooling are part of the specification.
The 7T seed delivers: any size chip (seed matrix + envelope), any kind of processing (classical, hybrid, photonic, quantum), and any zettaflop scale from the ratio. The rest is planned as a service—builds, harvests, foundry packages, Blu-ray, roadmap, and support.
Project 18 — AutoPhi Future. One vessel. 7T seed. Make way.