FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1185.

“blank chips for the software written multiple level chip assembly to print and stack construction chips in a link and exchange processing manner by cubit cell and cubit grid copyright (c) 2017 chris gabriel brown”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: chips, cubit, blank, software, written, multiple, level, chip, assembly, print, stack, construction
• Key phrases: blank chips · software written multiple · stack construction chips · exchange processing manner · cubit grid

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1185).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE