FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #331.

“second and third level + processing unit interchanging socket to compose another central based chip socket with alternate sub levels of chip sockets. generally considered non central or additional solder and molded chips for example a replaceable second a copyright © 2017 chris g brown”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: second, socket, central, chip, third, level, processing, unit, interchanging, compose, another, based
• Key phrases: third level processing · alternate sub levels · molded chips · example replaceable second

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #331).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE