FIRST TO MARKET · Publicly documented 2019 · Invent Deposition #1609

Among the 1,739 entries in the Invent Depositions corpus, #1609 is the seed of the entire AutoPhi compute line — the idea of building a processor not on a flat plane but in three dimensions, voxel by voxel, from purpose-chosen elemental compounds.

“pico nano voxel and elemental compounds for chip processing printing” — Christopher Gabriel Brown, 2019 (companion entries #1610–#1611 add “conductive and positive” and “non-conductive and negative … in three dimensions”)

From one line to an engineered product

The 2019 deposition states the whole architecture in a phrase: compute built from three-dimensional voxels of elemental compounds rather than etched into 2-D silicon. Years later that line is the AutoPhi V18 → V19 → V20 line — voxel-compute arrays stacked 50 to 600 layers tall on the AES substrate, scaling by volume instead of area, up to a design-target 100 YFLOPS. The founding claim never changed: compute in three dimensions.

Provenance

• Source: Invent Depositions corpus, Deposition #1609 (2019), companion #1610–#1611
• Original catalog image: Firefly_1609_pico_nano_voxel_and_elemental_compounds_for_chip_processing_printing.jpg (buyinvent.com)
• Architecture diagram: 2026 rendering of the engineered AutoPhi voxel/AES stack (not a 2019 scan)
• Live: AutoPhi On-Demand IC Catalog
• Patent linkage: U.S. Application 18/370,908 (AutoPhi) and 19/449,352 (semiconductor method)

Cite this

• AP — Brown, C. G. (2019). Invent Depositions, Deposition #1609. CreateSpace.
• APA — Brown, C. G. (2019). Invent depositions (Deposition No. 1609). CreateSpace Independent Publishing Platform.
• MLA — Brown, Christopher Gabriel. Invent Depositions, Deposition #1609. CreateSpace, 2019.

© 2019 Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE