FIRST TO MARKETPublicly documented 2017 · Invent Deposition #1178

Invent Deposition #1178 — Chip Circuit Branching · book page 113 · © 2017 Christopher Gabriel Brown

Long before it became AutoPhi EM-IC Stacked Layers — 1000 Configurations (Peltier Cooled), this idea was written down and copyrighted in 2017 as Invent Deposition #1178 — “Chip Circuit Branching”:

“vertical chip branching and layers of conducting parts of chips in a fashion to layer other chip parts to conduct a pseudo balanced and compressed level of conductivity”— © 2017 Christopher Gabriel Brown

It has since graduated from a one-line idea into an engineered product.

→ See where it graduated: AutoPhi EM-IC Stacked Layers — 1000 Configurations (Peltier Cooled)

Provenance: published 2017 in the Invent Depositions collection; part of an intellectual-property portfolio with U.S. patent applications dating to 2012; independently timestamped by the Internet Archive. First to market — documented public offering, not a determination of patent priority.