FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1266.

“insulated chip levels made from of with a coherence of any insulation method of stacking horizontal or vertical chip organization to build a larger chip also said as to make a non conductive layer with small outer and inner conductive measures while operation is possible copyright (c) 2018 chris gabriel brown patent abstract utility”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: chip, conductive, insulated, levels, made, coherence, insulation, method, stacking, horizontal, vertical, organization
• Key phrases: insulated chip levels · insulation method stacking · said make non · small outer · inner conductive measures · abstract utility

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1266).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE