FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1177.

“soft silica chip insulator film that would enable vertical chip branching and layers of no conducting parts of chips in a fashion to layer other chip parts to conduct a pseudo balanced and compressed level of conductivity copyright (c) 2017 chris gabriel brown”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: chip, parts, soft, silica, insulator, film, enable, vertical, branching, layers, conducting, chips
• Key phrases: soft silica chip · enable vertical chip · layers conducting parts · chip parts conduct · compressed level conductivity

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1177).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE