FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1183.

“multiple level chip assembly to print and stack construction chips in a link and exchange processing manner copyright (c) 2017 chris gabriel brown”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: multiple, level, chip, assembly, print, stack, construction, chips, link, exchange, processing, manner
• Key phrases: multiple level chip · stack construction chips · exchange processing manner

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1183).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE