FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1032.

“vertical and embedded chip stilts to branch layered under and over stacked layered blanks to add to a multiple layered processing chip or storage copyright (c) 2017 chris gabriel brown”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: layered, chip, vertical, embedded, stilts, branch, under, over, stacked, blanks, add, multiple
• Key phrases: embedded chip stilts · over stacked layered

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1032).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE