FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1284.

“stacked form of many cube processors in a insulated chip levels with a coherence of any insulation method of stacking horizontal or vertical chip organization to build a larger chip also said as to make a non conductive layer with small outer inner conductive measures while operation is possible with vertical threads and vertical processing and cube processors copyright © 2018 chris gabriel brown”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: chip, vertical, cube, processors, conductive, stacked, form, many, insulated, levels, coherence, insulation
• Key phrases: stacked form many · insulation method stacking · said make non · small outer inner · vertical threads · vertical processing · cube processors · abstract utility

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1284).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE