FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1281.

“in a insulated chip levels with a coherence of any insulation method of stacking horizontal or vertical chip organization to build a larger chip also said as to make a non conductive layer with small outer inner conductive measures while operation is possible with vertical threads and vertical processing and cube processors copyright (c) 2018 chris gabriel brown patent abstract utility”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: chip, vertical, conductive, insulated, levels, coherence, insulation, method, stacking, horizontal, organization, build
• Key phrases: insulated chip levels · insulation method stacking · said make non · small outer inner · vertical threads · vertical processing · cube processors · abstract utility

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1281).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE