FIRST TO MARKET · Publicly documented in the 2017 Invent Depositions corpus · Deposition #1189.

“additional socket and secondary level chips of a software written multiple level chip assembly to print and stack construction chips in a link and exchange processing manner by cubit cell and cubit grid copyright (c) 2017 chris gabriel brown”
— Christopher Gabriel Brown

Recognized properties

• Sector: Computing & Semiconductors
• Keywords: level, chips, cubit, additional, socket, secondary, software, written, multiple, chip, assembly, print
• Key phrases: additional socket · secondary level chips · stack construction chips · exchange processing manner · cubit grid

Provenance: original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed Invent Depositions book scan (Deposition #1189).

© Christopher Gabriel Brown · Patent Pending · IP retained by CRI-ONE