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PhantasmPhi CPU Phase II - PHC10b - one 7 nm QIC part, 3-chiplet stack - 4.19 E-OPS (guaranteed 3 P-OPS)

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phantasmphi-cpu-phase2-phc10b_pf3

Special Price $11,550,000,000.00 Regular Price $46,200,000,000.00

Why you'd want it

One 7 nm socket with a three-chiplet stack: the step that shows how stacking adds capacity.

Who it's for: US chip teams studying chiplet stacking inside a single 7 nm QIC-105 socket.
The problem it solves: shows a three-chiplet stack in one socket; listed 4.19 E-OPS (guaranteed 3 P-OPS), 280 W net.
What you get: non-exclusive PHC10b chip design-source licence with the 17-section licence, after NDA and wire payment.

One QIC-105 socket with a 3-chiplet stack (4,500 voxel-layers) — 4.19 exa probability-OPS, 1,395× its guaranteed 3 P-OPS floor; 4,200 logical qubits. 280 W net.

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For the curious

Think of three sheets of paper pinned at the corners so they read as one page. PHC10b is that stack in silicon: one QIC-105 socket in a single rack holding a 3-chiplet stack at 7 nm, each chiplet an 858 mm² full-reticle die of 1,500 CFET layers, 4,500 voxel-layers. It carries the three strands and has QBeam send and receive on the package. QBeam is a wireless send-and-receive chain, a Bell-measure transmit, two classical bits over the CoolBeam phased array and an I/X/Y/Z correction at the receiver; it moves bytes and never does the computing.

The computing is the credited chain: iverilog-verified RTL at 0.004625 depositions per clock, 4.9 ops per deposition, 786.7 MHz measured at 7 nm, the ×10 Color-ISA pin, three strands and a 99.998% QEC gate. The socket comes to 4.19 exa probability-OPS, 1,395 times the guaranteed floor of 3 P-OPS, with 4,200 logical qubits, at 280 W net after 42% LED power recycling. The floor is what is guaranteed; the credited chain is what is delivered. The native unit is probability-OPS; the 3 PFLOPS label is the equivalent framing. QBeam rates are design targets until tape-out, interconnect only.

This is for the engineering buyer or datacenter operator who wants more than one chiplet and still one rack. A US company walks away with the source-licensed RTL plus photonic-HDL zip, the 17-section LICENSE, the Licensed-IP schedule and the PHC01 SKY130 tape-out anchor evidence, delivered after a countersigned NDA and wire settlement. You buy the use of the blueprint; the invention stays with CRI-ONE.

Valuation

Pre-production blueprint usage right, patent pending, non-exclusive. The analog this product is closest to in the market is flagship AI/HPC CPUs — Nvidia Grace Hopper, AMD MI300A, Fujitsu A64FX, with photonic-interposer analogs in Lightmatter.

Patent landscape

Flagship CPU IP is one of the densest filing spaces in silicon; however, novel quantum/photonic interposer configurations (QIC-105 class) remain patentable and defensible.

Market opportunity

Data-center CPU market: $75B (2026) → $180B (2032).
AI training/inference silicon: $120B+ (2026), hyperscaler-dominated.

Comparable transactions

Nvidia → Mellanox (2019): $6.9B.
AMD → Xilinx (2022): $49B.
Intel → Habana Labs (2019): $2B for AI accelerator startup.

Estimated valuation range

Realistic clearing band for a non-exclusive blueprint usage right: $10M (research / single-buyer evaluation) → $150M (strategic non-exclusive with manufacturing / deployment rights).

Listed catalog price: $375,000,000,000 — public anchor for direct enquiry; actual clearing price negotiated inside the range above with the buyer, scope (non-exclusive, territory, field-of-use), and milestone structure.

Details

Description

Phase II of PhantasmPhi CPU — PhantasmPhi CPU Phase II - PHC10b - single-rack - 3 PFLOPS. Non-exclusive source-licensed RTL + photonic-HDL zip (full 17-section LICENSE, Licensed-IP schedule, PHC01 SKY130 tape-out anchor evidence). Delivered after countersigned NDA + wire settlement. USA companies only, USD only, email + postal mail only.

One QIC-105 socket with a 3-chiplet stack (4,500 voxel-layers) — 4.19 exa probability-OPS, 1,395× its guaranteed 3 P-OPS floor; 4,200 logical qubits. 280 W net.

The part is QIC-105: an 858 mm² full-reticle die in the real 40×40 mm BGA-1536 die-side package, 18-chiplet stack × 1,500 CFET layers = 27,000 voxel-layers, with QBeam SEND and RECEIVE integrated on-package (ExitPhi, USPTO App 19/722,805): Bell-measure transmit → 2 classical bits over the CoolBeam phased array → I/X/Y/Z receive correction; 4-lane chain + PipeBeam ordering + 48-channel nanophotonic transceive. QBeam carries bytes, never compute OPS.

Credited chain (unchanged receipts): 0.004625 depositions/clock (iverilog-verified RTL) × 4.9 ops/deposition × 786.7 MHz measured at 7 nm / 2.75 GHz at 2 nm (#5 EM Cooling, Pat 1096-1098) × ×10 Color-ISA pin (#8) × ×3 photon/electron/atomic strands × 99.998% QEC gate (#4); power net of #1 LED Power Recycling (42%).

The decade/3× figure is the guaranteed floor; the delivered figure is the credited chain on the QIC-105 part. Native unit is probability-OPS (bronze); FLOPS-equivalents are GOLD framing, labeled. QBeam rates are design targets until tape-out and are quoted as interconnect only. Settles by wire or online check.

Footnotes

Product number 10364.
Family: phantasmphi.
Purchase: When you buy, you buy the use of that blueprint only.

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