Proposal to IBM, HPE, Texas Instruments, and Intel
This is the letter I mailed on March 21, 2026 to the Offices of Strategic Partnerships at IBM, Hewlett Packard Enterprise, Texas Instruments, and Intel. It was addressed to all four at once because the offer is non-exclusive, and because the entire portfolio is drawn to be built, not held. I am publishing it here, in full, so that anyone reading can see the terms as they stand.
The invitation is still open. Any of the four companies named below — or any other party reading this — may still take any of the four steps described in the letter. Nothing in it has been retracted. The portfolio has grown since March; the letter's terms have not changed.
Armonk, New York 10504
Spring, Texas 77389
Dallas, Texas 75243
Santa Clara, California 95054
To the respective Offices of Strategic Partnerships,
My name is Christopher Gabriel Brown. I am the sole inventor and owner of a portfolio of twenty-eight engineered projects spanning semiconductor fabrication, quantum computing, photonic architecture, neuromorphic processing, and advanced materials science.
I am writing to express my interest in doing business with each of your organizations.
I have built a complete technology catalog — from raw substrate to packaged IC to finished product — and I believe IBM, HPE, Texas Instruments, and Intel each bring capabilities that would benefit from and contribute to this work. This letter is addressed to all four companies because the offer is non-exclusive: any or all of you may participate, and no single party receives a monopoly.
Why these four companies
The Offer
I am proposing a non-exclusive license of my complete catalog — all twenty-eight projects — under a single acquisition valued at $10,000,000,000,000 (Ten Trillion USD).
This includes:
- A novel semiconductor substrate (designated AES) scoring 100/100 across 2,000 analyzed compounds, delivering 8x electron mobility and 2.7x thermal conductivity over silicon at $5/kg.
- A 32-layer, 10mm-tall, 8-trillion-transistor IC architecture achieving 100 YFlops on a standard PCIe half-height half-length card.
- Complete fabrication methodology from ingot to packaged device, including GDSII, SPICE models, PDK, and foundry handoff kit.
- Quantum processing (700,000 physical qubits, 100,000 logical), photonic interconnect, DNA molecular logic, and neuromorphic compute — all integrated at the voxel level.
- Twenty-four additional projects covering propulsion, communications, satellite systems, security, energy storage, brain supplementation, landfill recovery, and more.
Each recipient of this letter would receive the same complete package. No company receives exclusivity. What each company receives is everything needed to manufacture, test, and deploy these technologies independently. You compete on execution, not on access.
I do not engage in cold outreach. All of my communications are conducted through recorded channels. This letter is the beginning of that record.
I am not asking any of you to take my word for it. The acquisition path is structured in four steps — Deposition, Evaluation License, Production License, and Full Acquisition — so that your teams can validate at each stage before committing further. The technology speaks for itself when examined.
My math teacher once said that work only happens when algebra happens. She was right. But I have found an even simpler version: the definition of work is when you make it or move it. I have made it. Now I am proposing that we move it forward.
I welcome the opportunity to discuss this at each company's convenience, in person at a location of your choosing.
Thank you for your time and consideration.
— Christopher Gabriel Brown
Inventor and Owner, CRI-ONE Applied Sciences and Acquisitions
Patent Pending — Application #19/449,352
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