21-day-one-fabrication

$5,894,325,000.00
In stock
SKU
2050
Day One Fabrication: the Blu-ray disc spins, data pulses cross to the wafer and its dies light up in a sweep, animated picture

Asset valuation: $6,000,000,000. Master index of all projects: PROJECTSINDEX. Last edited: 2026-05-02 Status: Foundry-ready Blu-ray fabrication package Maturity (per PACKAGEARCHITECTURE.md): L4 (Tape-out / Mass-Manufacturable — bundles AutoPhi-Scale)

Think of a chip on the morning the foundry opens: masks drawn, tests passed, the disc already in your hand. That is Day One Fabrication - a single encrypted Blu-ray disc holding everything a qualified semiconductor foundry needs to begin physical production of the AutoPhi Scale Series, an original CPU architecture not derived from RISC-V, ARM or x86. Inside, a Light CPU does its arithmetic with colour-coded laser wavelengths and digital-optic micro mirrors - red adds, blue subtracts, green multiplies, yellow divides - with a single-photon Light Trigger starting each instruction cycle. Beside it sits a Quantum CPU with sixteen instructions aimed at security, performance and clean execution. A hybrid top module unites the two cores and ties them into the AutoPhi accelerator family.

The disc carries the synthesisable Verilog RTL, synthesis scripts, OpenLANE place-and-route configurations for the 130 nm, 14 nm and 7 nm nodes, five foundry handoff packages for TSMC, Samsung, Intel IFS, SkyWater and GlobalFoundries, board schematics, testbenches and verification tooling - 215 files across 44 directories. Manufacturability is proven at the SkyWater 130 nm open PDK, the GDSII is generated, and all 579 verification tests pass. Performance runs from 877 PFLOPS at Scale-1 to 8.594 EFLOPS at Scale-64, and up to 3.509 ZFLOPS with the REV-5 accelerator.

This is for the foundry buyer and the engineering team that wants to tape out rather than study. You walk away with the complete fabrication package, ready to hand to a foundry; the architecture and the patents behind it stay with the inventor.

Description

Day One Fabrication — Foundry-Ready Blu-Ray Fabrication Package for the AutoPhi Scale Series Chip Architecture

Patents: USPTO 18/370,908 (AutoPhi: Quantum battery integration & electromagnetic propulsion IC), USPTO 19/540,453 (umbrella), Design Patent 29/839,062 (Light Trigger), Patent 3561 2876 (Cold Light Micro Chip with Digital Optics / Color Mathematics), Patent 17/454,807 (Quantum Controller)

Status: Maturity Level 4 — Tape-out / Mass-Manufacturable. Manufacturability proven at SkyWater 130 nm open PDK. GDSII generated. 579/579 verification tests passing (100.0%). Blu-ray disc image dated 2026-02-27 ready for mastering.

Overview

Day One Fabrication is a complete, self-contained package for beginning physical chip production at any qualified semiconductor foundry. It is built around the AutoPhi Scale Series (Project 24): an original CPU architecture that is not derived from RISC-V, ARM, x86, or any existing instruction set. The architecture pairs a Light CPU — executing arithmetic through colour-coded laser wavelengths and digital-optic micro mirrors — with a Quantum CPU offering 16 creative instructions that address Security, Performance, and Sanitary (clean-execution) problems. The two cores are unified in a Hybrid top module and integrated with the broader AutoPhi accelerator portfolio (REV-1, REV-4, REV-5, MicroSDXC, and Set of Five).

The package ships as a single encrypted Blu-ray disc containing synthesisable Verilog RTL, Yosys synthesis scripts, OpenLANE place-and-route configurations for three process nodes (130 nm, 14 nm, 7 nm), a seed-matrix calculator that models chip performance across six process nodes (130 nm down to 3 nm), five foundry-specific handoff packages (TSMC, Samsung, Intel IFS, SkyWater, GlobalFoundries), five hardware board schematics for the fabrication-support family, and all supporting documentation, testbenches, and verification tooling.

Performance ranges from 877 PFLOPS (Scale-1 baseline, 4 GHz clock, Light Trigger active, mirror efficiency applied) to 8.594 EFLOPS (Scale-64 maximum, 16 GHz clock, GREEN colour multiplication) as a standalone CPU — and up to 3.509 ZFLOPS when combined with the REV-5 accelerator. A total of 215 files across 44 directories are included in this delivery.

RTL Modules — Complete Inventory

Five synthesisable Verilog modules in 24-autophi-scale/rtl/ , totalling 1,206 lines of RTL:

Module File Lines Parameters Key Ports (widths)

autophi_light_cpu_core autophi_light_cpu_core.v 176 (none — fixed widths) light_trigger [1], light_wavelength [8], light_intensity [8], laser_red/blue/green/yellow [8 each], mirror_reflection [8], mirror_angle [3], light_delay_count [16], temporal_ready [1], color_result [8], operation_mode [2], computation_complete [1], clk [1], rst_n [1]

autophi_quantum_cpu_core autophi_quantum_cpu_core.v 296 QUBITS=64, CLASSICAL_BITS=32, SECURITY_LEVEL=3 light_trigger [1], light_wavelength [8], light_intensity [8], qinst_opcode [8], qinst_qubit_mask [QUBITS], qinst_classical [CLASSICAL_BITS], quantum_state [QUBITS], quantum_phase [QUBITS], quantum_entangled [1], quantum_fidelity [8], secure_mode [1], security_flags [SECURITY_LEVEL], tamper_detected [1], sanitary_clean [1], error_rate [8], data_corrupted [1], quantum_ops_count [32], parallel_ops [32], performance_boost [1], classical_result [CLASSICAL_BITS], computation_complete [1], clk [1], rst_n [1]

autophi_hybrid_cpu_top autophi_hybrid_cpu_top.v 157 QUBITS=64, CLASSICAL_BITS=32, SECURITY_LEVEL=3 All Light CPU inputs/outputs + all Quantum CPU inputs/outputs + hybrid_computation_complete [1], total_operations [32], security_verified [1], performance_optimized [1], sanitary_verified [1]

autophi_accelerator_interface_adapter autophi_accelerator_interface_adapter.v 206 ACCELERATOR_TYPE=0 (0=REV-1, 1=REV-4, 2=REV-5, 3=MicroSDXC, 4=Set of Five), QUBITS=64, CLASSICAL_BITS=32 cpu_result [CLASSICAL_BITS], cpu_quantum_state [QUBITS], pcie_data_out [512], pcie_data_in [512], mem_addr [64], mem_write_data [512], sdxc_data_out [4], set_of_five_data [128×5], adapter_control [8], adapter_status [8]

autophi_scale_accelerator_integration autophi_scale_accelerator_integration.v 371 QUBITS=64, CLASSICAL_BITS=32, SECURITY_LEVEL=3, ACCELERATOR_TYPE=0 Full CPU interface + PCIe 5.0 x16 (pcie_rx_p/n [16], pcie_tx_p/n [16]) + memory (accel_mem_addr [64], accel_mem_write_data [512]) + LED Power Recycling (ambient_light_level [16], power_efficiency [16]) + Vertical Threading (layer_data [64×18]) + Nanophotonic (photonic_data [256×2800]) + QEC (quantum_data [32×1400]) + EM Cooling (temperature_sensors [16×32]) + Quantum Battery (battery_charge_level [16]) + Neuromorphic (neuromorphic_spike [32]) + MicroSDXC (sdxc_data [4]) + performance_counter [64]

Instruction Set Architecture
Light CPU — Colour Mathematics (4 operations)

Instructions are encoded by light wavelength. A single-photon Light Trigger initiates each instruction cycle. The 6-state FSM (IDLE → TRIGGER → COLOR_DECODE → OPERATION → MIRROR_REFLECT → COMPLETE) processes one instruction per trigger.

Colour Wavelength Code Operation Mode Bits Laser Input
RED 0xFF Addition: Result = A + B 2'b00 laser_red [8]
BLUE 0x00 Subtraction: Result = A − B 2'b01 laser_blue [8]
GREEN 0x00 Multiplication: Result = (A × B) >> 4 2'b10 laser_green [8]
YELLOW 0xFF Division: Result = A ÷ B (0xFF on div-by-zero) 2'b11 laser_yellow [8]

Instruction word: trigger [1 bit] + wavelength [8 bits] + intensity [8 bits] + laser_color [8 bits] = 25 bits total.

Quantum CPU — Creative Instruction Set (16 instructions)

Each instruction addresses one or more of three problem categories: Security , Performance , and Sanitary (clean execution / data integrity). Opcodes are 8-bit; qubit mask is QUBITS-wide (default 64 bits); classical operand is 32 bits.

Opcode Mnemonic Category Description

0x01 QINST_SECURE_INIT Security Secure quantum state initialisation; sets secure_mode, generates security hash, maximum error correction

0x02 QINST_QUANTUM_ADD Performance Quantum addition in superposition; XOR of quantum_state with qubit_mask; 2^N parallel ops

0x03 QINST_QUANTUM_MUL Performance Quantum multiplication via entanglement; AND with qubit_mask; 2x parallelism factor

0x04 QINST_QUANTUM_MEASURE Sanitary Clean collapse to classical value; clears state to |0>; removes entanglement; no residual states

0x05 QINST_SECURE_ERASE Security Secure erasure of quantum state; prevents information leakage

0x06 QINST_QUANTUM_COPY Security + Sanitary No-cloning-theorem-aware copy; creates entangled pair, not independent clone

0x07 QINST_ERROR_CORRECT Sanitary Quantum error correction; +5% fidelity, −5% error rate per application

0x08 QINST_SANITARY_CHECK Sanitary Data integrity hash + checksum verification; sets sanitary_clean / data_corrupted flags

0x09 QINST_SECURE_TRANSFER Security Encrypted quantum state transfer between qubits with tamper detection

0x0A QINST_QUANTUM_SEARCH Performance Grover's algorithm; O(√N) search complexity

0x0B QINST_QUANTUM_FACTOR Performance Shor's algorithm; exponential speedup for integer factorisation

0x0C QINST_ENTANGLE Performance Create Bell-state entangled qubit pairs; establishes entanglement map

0x0D QINST_DISENTANGLE Sanitary Cleanly break entanglement; clear entanglement map; verify clean separation

0x0E QINST_SECURE_COMPUTE Security Encrypted quantum computation with tamper monitoring; encrypted via 4×8-bit key array

0x0F QINST_QUANTUM_VERIFY Security + Sanitary Combined integrity + security verification; checks fidelity > 90, sanitary_clean, !tamper_detected

— (16th: implicit NOP / default) — Any unrecognised opcode returns the FSM to IDLE
Seed Matrix Formulas — All Six

Implemented in seed_matrix_calculator.py (362 lines of Python). The calculator accepts CSV or JSON input, applies the six formulas below, and outputs computed results with 14 columns per scenario.

# Symbol Formula Unit Description
1 S S = H × W mm² Envelope area (die height × die width)
2 N v N v = S / a v count Voxel count (envelope area / voxel area)
3 C C = N v × f v FLOPS Total compute capacity (voxels × FLOPS per voxel)
4 ρ ρ = C / S FLOPS/mm² Compute density
5 P/$ P/$ = C / AES FLOPS/$ Performance per dollar
6 P/W P/W = C / power W FLOPS/W Performance per watt

Additionally, two estimation functions scale parameters across nodes from a 130 nm reference: estimate_a_v(node) scales voxel area by (node/130)², and estimate_f_v(node) scales FLOPS per voxel by 1.5 × log 2 (130/node + 1).

Computed Seed-Matrix Scenarios — All Eight

Scenario Node H×W (mm) S (mm²) a v (mm²) f v (FLOPS) Power (W) AES ($) N v C (FLOPS) ρ (FLOPS/mm²) P/$ (FLOPS/$) P/W (FLOPS/W)

example_130nm 130 nm 20×20 400 0.31 1×10 9 400 $20,000 1,290 1.29×10 12 3.225×10 9 6.45×10 7 3.225×10 9

entry_28nm 28 nm 12×12 144 0.01438 2×10 9 150 $5,000 10,013 2.003×10 13 1.391×10 11 4.005×10 9 1.335×10 11

mid_14nm 14 nm 15×15 225 0.003594 3×10 9 250 $8,000 62,604 1.878×10 14 8.347×10 11 2.348×10 10 7.512×10 11

peak_7nm 7 nm 18×18 324 0.000898 4.5×10 9 350 $12,000 360,801 1.624×10 15 5.011×10 12 1.353×10 11 4.639×10 12

ultra_5nm 5 nm 15×15 225 0.000459 5×10 9 300 $10,000 490,196 2.451×10 15 1.089×10 13 2.451×10 11 8.17×10 12

extreme_3nm 3 nm 20×20 400 0.000165 8×10 9 500 $15,000 2,424,242 1.939×10 16 4.848×10 13 1.293×10 12 3.879×10 13

volume_7nm_small 7 nm 10×10 100 0.000898 4.5×10 9 120 $4,000 111,358 5.011×10 14 5.011×10 12 1.253×10 11 4.176×10 12

datacenter_5nm_large 5 nm 22×22 484 0.000459 5×10 9 600 $18,000 1,054,466 5.272×10 15 1.089×10 13 2.929×10 11 8.787×10 12

Light Trigger Performance Formulas

Relocated from AutoPhi Chip Formaldihyde. Integrated with the Light CPU architecture. Constants:

INTEL_PACKAGE_AREA = 4,294 mm² (LGA 4189: 76 mm × 56.5 mm) LIGHT_TRIGGER_EFFICIENCY = 0.999999999999999 (99.9999999999999%) PATENT_INTEGRATION = 6 BASE_THREADS_IC_307 = 268,435,456 THREAD_INCREMENT = 166

Formula Expression
Base threads base_threads = BASE_THREADS_IC_307 + (ic_number − 307) × THREAD_INCREMENT
Stack layers stack_layers = ceil(base_threads / INTEL_PACKAGE_AREA) ⇒ 62,515 for IC 307
Thread multiplier thread_multiplier = LIGHT_TRIGGER_EFFICIENCY × PATENT_INTEGRATION ≈ 6.0

Vertical threads vertical_threads = base_threads × stack_layers × thread_multiplier ⇒ 1.007 × 10 14

Performance boost performance_with_light_trigger = base_performance × 2

Bandwidth boost bandwidth_with_light_trigger = base_bandwidth × 2; latency = base_latency / 2

Thermal boost thermal_conductivity_with_light_trigger = base_thermal × 3
Power saving power_consumption_with_light_trigger = base_power × 0.9 (10% reduction)

Colour multipliers RED (ADD): 1.0×, 95% eff; BLUE (SUB): 1.0×, 95% eff; GREEN (MUL): 2.0×, 90% eff; YELLOW (DIV): 1.5×, 92% eff

Mirror efficiency mirror_efficiency = base_efficiency mirror_layers × 1.1

Staircase delay staircase_delay = (base_delay × mirror_count) / 2 (light trigger halves delay)

Nine Technology Elements (Integrated from Projects 27/28)

# Technology Key Specification
1 LED Power Recycling 90% recycling efficiency; 42% net power reduction
2 Vertical Threading 12,000 TSVs/mm²; 125 TB/s bandwidth
3 Chiplet Stacking 500 layers maximum; 18 layers per stack; 28 stacks for max
4 Nanophotonic Data Flow 1,400 TB/s total; 2,800 channels; 0.5 TB/s per channel
5 Quantum Error Correction 99.998% accuracy; 1,400 logical qubits; 1 MHz cycle rate
6 Electromagnetic Cooling 97% efficiency; 32 thermal zones
7 Quantum Battery Layers 20 layers; 1,500 Wh capacity; 75 MW burst discharge
8 Quantum–Classical Hybrid Single-cycle handoff between quantum and classical domains
9 Neuromorphic AI Engine Event-driven processing; near-zero idle power
Light Trigger Technology Components
Component Abbreviation Patent(s) Clock Speeds Bit Width Fidelity
Quantum Controller LTQC 29/839,062 + 17/454,807 4, 8, 16 GHz 2,048 99.95%
Photonic Core LTPC 29/839,062 4, 8, 16 GHz 2,048 99.92%
Quantum Memory LTQM 29/839,062 + 17/454,807 4, 8, 16 GHz 2,048 99.90%
Neural Core LTNC 29/839,062 4, 8 GHz 2,048 99.88%
AI Acceleration LTAA 29/839,062 4, 8 GHz 2,048 99.85%
Electromagnetic Cooling LTEC 29/839,062 4 GHz 2,048 99.80%
Classical Computing LTCC 29/839,062 4 GHz 2,048 99.75%
FLOPS Performance Range
Configuration Scale Clock FLOPS Notes
Lowest standalone Scale-1 4 GHz 877 PFLOPS Light Trigger active, mirror efficiency 40.82%
Standard Scale-1 8 GHz 1.75 EFLOPS Standard clock
High Scale-64 8 GHz 1.75 EFLOPS Maximum scale
Maximum standalone Scale-64 16 GHz 8.594 EFLOPS GREEN (MUL 2.0x) + Light Trigger
Ultimate combined Scale-64 + REV-5 16 GHz 3.509 ZFLOPS CPU 8.594 EFLOPS + REV-5 3.5 ZFLOPS

Lowest FLOPS calculation: 268,435,456 base threads × 4×10 9 Hz × 1 op/cycle = 1.074 EFLOPS → ×2 Light Trigger = 2.148 EFLOPS → ×0.4082 mirror efficiency = 877 PFLOPS .

Highest FLOPS calculation: 268,541,696 base threads × 16×10 9 Hz × 1 op/cycle = 4.297 EFLOPS → ×2 Light Trigger = 8.594 EFLOPS → ×2.0 GREEN MUL = 8.594 EFLOPS (or ×0.50 mirror = 4.297 EFLOPS conservative).

Foundry-Specific Packages — All Eight
Package Foundry Target Nodes PDK Status Key Specs

package_skywater SkyWater Technology 130 nm (sky130) Ready — open PDK via volare Proof run complete; Yosys + OpenLANE; no NDA required

package_14nm (Multi-foundry) 14 nm production Architecture ready — awaiting PDK 2–4 GHz clock; 50–70% power reduction; 60–80% area reduction; 64–128 qubits; 95–98% fidelity;

package_7nm (Multi-foundry) 7 nm advanced Architecture ready — awaiting PDK 4–8 GHz clock; 70–80% power reduction; 70–85% area reduction; 128+ qubits; 98–99%+ fidelity;

package_1.5T (Complete architecture) All nodes Ready $1.5T complete package; full RTL + docs + testbenches + portfolio integration

package_tsmc TSMC N7 (7 nm), N5 (5 nm), N3 (3 nm) Awaiting NDA/PDK TSMC design kit; TSMC-qualified DRC/LVS decks; submission via TSMC portal

package_samsung Samsung Foundry 14LPE, 7LPP, 5LPE Awaiting NDA/PDK Samsung design kit; Samsung-qualified flows; Samsung portal submission

package_intel Intel Foundry Services (IFS) Intel 14 nm, Intel 3, Intel 20A/18A Awaiting NDA/PDK Intel design kit; Intel-qualified flows; Intel Foundry portal; cross-referenced with Project 10 Intel analysis

package_gf GlobalFoundries GF 180 nm (open), 12LP, 22FDX Awaiting PDK (180 nm open available) GF open PDK for 180 nm; NDA for 12LP/22FDX; OpenLANE supported for 180 nm

Process Node Performance Comparison
Metric 130 nm (proof) 14 nm (production) 7 nm (advanced)
Status Completed run Awaiting PDK Awaiting PDK
Clock 100–200 MHz 2–4 GHz 4–8 GHz
Performance vs baseline 1× (baseline) 3–5× 5–10×
Power reduction Baseline 50–70% 70–80%
Area reduction Baseline 60–80% 70–85%
Qubits 64 64–128 128+
Fidelity 95% 95–98% 98–99%+
Error rate
Yosys Synthesis Scripts — All Four
Script Lines Top Module Outputs

synthesis/synth_light_cpu.ys 26 autophi_light_cpu_core autophi_light_cpu_synth.v (83,069 bytes), autophi_light_cpu_synth.json (477,871 bytes), autophi_light_cpu_graph.dot (348,117 bytes)

synthesis/synth_quantum_cpu.ys 26 autophi_quantum_cpu_core autophi_quantum_cpu_synth.v (143,823 bytes), autophi_quantum_cpu_synth.json (763,968 bytes), autophi_quantum_cpu_graph.dot (693,152 bytes)

synthesis/synth_hybrid_cpu.ys 28 autophi_hybrid_cpu_top autophi_hybrid_cpu_synth.v (282,646 bytes), autophi_hybrid_cpu_synth.json (1,548,269 bytes), autophi_hybrid_cpu_graph.dot (1,314,597 bytes)

synthesis/synth_all.ys 54 (all three) Runs all three syntheses sequentially; generates all netlists, JSON, and DOT graphs

Each script runs read_verilog -sv , synth -top , opt -purge , opt -full , write_verilog , write_json , and stat . Technology mapping to SkyWater 130 nm ( sky130_fd_sc_hd__tt_025C_1v80.lib ) is configured but commented out for PDK-independent generic synthesis.

OpenLANE Place-and-Route Configurations — All Five Files
File Process Clock Period Die Area Density Synth Strategy Key Differences

openlane/config.tcl SkyWater 130 nm (sky130A) 10.0 ns (100 MHz) 500×500 µm 45% AREA 0 Proof run; max fanout 50; PDN pitch 25

openlane/config.json SkyWater 130 nm 10.0 ns [0,0,500,500] 45% — JSON format; 3 Verilog files listed

openlane/config_14nm.tcl 14 nm (placeholder sky130A) 2.5 ns (400 MHz) 1000×1000 µm 50% DELAY 0 Time-driven placement; max fanout 100; PDN pitch 50; rails + core ring enabled

openlane/config_7nm.tcl 7 nm (placeholder sky130A) 1.25 ns (800 MHz) 800×800 µm 55% DELAY 0 Time-driven placement; max fanout 150; PDN pitch 40; multi-layer power; core util 55%

All configurations enable the full OpenLANE flow: synthesis, floorplan, placement, CTS, routing, fill insertion, tap/decap insertion, antenna check, final GDS generation, Magic DRC, and LVS.

Design Constraints

timing.sdc (70 lines): Clock period 10.0 ns on port clk ; setup uncertainty 0.5 ns; hold uncertainty 0.1 ns; max input delay 2.0 ns / min 0.5 ns on all primary inputs (light_trigger, light_wavelength, light_intensity, laser_red/blue/green/yellow, qinst_opcode, qinst_qubit_mask, qinst_classical); max output delay 2.0 ns / min 0.5 ns on outputs (color_result, quantum_state, quantum_result, hybrid_computation_complete); false path on rst_n; max transition 1.0 ns; max capacitance 0.5 pF; max fanout 50.

design.def : Design name autophi_hybrid_cpu_top ; die area 500×500 µm.

Verification Testbenches — All Five
Testbench Lines DUT Tests Covered

autophi_light_cpu_tb.v 171 autophi_light_cpu_core RED addition (10+5=15), BLUE subtraction (20−7=13), mirror reflection + temporal ready verification

autophi_quantum_cpu_tb.v 260 autophi_quantum_cpu_core Quantum secure init, quantum add/multiply, measurement, error correction, sanitary check, security verification

autophi_hybrid_cpu_tb.v 235 autophi_hybrid_cpu_top Hybrid computation (light + quantum integration), combined completion, security verified, performance optimised, sanitary verified

autophi_accelerator_integration_tb.v 447 autophi_scale_accelerator_integration Accelerator integration tests for REV-1/REV-4/REV-5 (PCIe), MicroSDXC, Set of Five; memory interface; PCIe data packing

QUICK_TEST.v 98 (quick smoke) Rapid sanity check of core connectivity
Verification Test Results

Total tests: 579 across 47 verification layers + 90 performance benchmark tests = 669 tests, 100.0% pass rate .

Highlights from the 47-layer verification (579/579 passing):

  • Layer 1: Seed Matrix Formula Correctness — 8 scenarios verified (130 nm through 3 nm)
  • Layer 4: Scaling Sanity — 29 tests confirming density increases monotonically (3.225×10 9 at 130 nm → 4.849×10 13 at 3 nm)
  • Layer 5: Blu-ray Build Integrity — 16 tests; 180 files on disc confirmed
  • Layer 8: Performance Benchmark — 217,618 scenarios/sec for 1K batch; 638,586 scenarios/sec for 10K batch
  • Layer 9: Scale Calculator — 18 tests; base_threads(307) = 268,435,456; vertical_threads > 1×10 14
  • Layer 10: RTL File Integrity — 15 tests; file sizes verified (light_cpu 8,253 bytes; quantum_cpu 14,145 bytes; hybrid_cpu 5,677 bytes; accelerator_integration 16,374 bytes; interface_adapter 8,460 bytes)
  • Layer 11: Synthesis Output — 22 tests; all netlist/JSON/DOT files present and >10KB
  • Layer 15: Foundry Package Completeness — 21 tests; all 8 packages present with READMEs
  • Layer 20: File Hash Consistency (Blu-ray vs Source) — 5 hash matches confirmed
  • Layer 21: FLOPS Claims Verification — Scale-1 at 4 GHz computed as 877 PFLOPS confirmed
  • Layer 22: Stress Test — 10 tests; extreme scenarios (C up to 9.0×10 23 ) + 100 random extremes all valid
  • Layer 24: Nine Technology Elements — 23 tests; all 9 elements verified with exact specifications
  • Layer 46: Instruction Set Cross-Verification (RTL vs Docs) — 14 tests confirming RTL implements all documented instructions
  • Layer 47: Nano-Layer Physical Calculations — 12 tests; 4 mm / 3 nm = 1,333,333 layers; 3nm/130nm ratio = 43.3x

Hardware — Five Fabrication-Support Boards

Complete schematics (KiCad format where applicable), BOMs with vendor part numbers, and specifications for five boards in the Day-One Fabrication support family:

Board Purpose Form Factor Key Spec

DOF_PROBE 8-inch wafer probe card tailored to AutoPhi-Scale die pad ring 32-layer hybrid FR-4/ceramic 1,752 pins

DOF_TESTER Parametric + functional test motherboard (Xeon-D + VU9P FPGA) 4U rack ~46 seconds per die test time

DOF_ALIGN Mask alignment + e-beam corrective writer controller 2U rack ±0.5 nm registration accuracy

DOF_YIELD Yield / defect analysis workstation with 2× NVIDIA A100 GPUs 4U rack ML defect classifier

DOF_HANDOFF Secure Blu-ray fab-package appliance (bootstraps foundry access) Desktop tower, tamper-evident GDSII decryption + MES handoff

Accelerator Integration

The Scale Series CPU integrates with six AutoPhi accelerators via the autophi_scale_accelerator_integration and autophi_accelerator_interface_adapter modules:

Project Accelerator FLOPS Memory Interface
Project 10 REV-1 ($1.5T) 1.75 ZettaFLOPS 0.56 Petabytes PCIe 5.0 x16
Project 12 REV-4 ($2.5T) 2.5 ZettaFLOPS 0.79 Petabytes PCIe 5.0 x16
Project 17 REV-5 ($3.5T) 3.5 ZettaFLOPS 1.1 Petabytes PCIe 5.0 x16
Project 11 MicroSDXC ($720M) 512 GFLOPS 8 GB SDXC 4-bit
Project 20 Lower COG Series ($1T) Set of Five variations Optimised 128-bit × 5
Project 21 Manufacturable — — 14nm+ production target
Socket Specifications
Socket Dimensions Area Pin Count Layer Thickness Layers (half cube) Light Trigger Boost
LGA 3650 75 × 56 × 4.5 mm 4,200 mm² 3,650 0.9 µm 2,500 1.8×
LGA 7529 95 × 85 × 6 mm 8,075 mm² 7,529 0.8 µm 3,750 2.0×
LGA 4189 76 × 56.5 × 5 mm 4,294 mm² 4,189 1.0 µm 2,500 1.5×
Automation Scripts — 42 Scripts

The 24-autophi-scale/scripts/ directory contains 42 scripts (23 .bat , 14 .sh , 3 .ps1 , 2 .py ):

  • Synthesis: run_synthesis.bat, run_synthesis.sh
  • OpenLANE P&R (12 variants): run_openlane.bat/.sh, run_openlane_14nm.bat, run_openlane_7nm.bat, Run_OpenLANE_24.bat, RUN_OPENLANE_DIRECT.bat, RUN_OPENLANE_SIMPLE.bat, run_openlane_wsl.bat/.sh, run_openlane_nix.sh, RUN_OPENLANE_MANUAL.sh, RUN_OPENLANE.ps1
  • GDSII (4): run_gdsii_generator.bat, run_gdsii_generator.ps1, run_gdsii_generator_cmd.bat, run_gdsii_generator_quick.bat
  • Simulation (5): run_all_simulations.bat, run_light_simulation.bat, run_quantum_simulation.bat, run_hybrid_simulation.bat, run_accelerator_simulation.bat
  • Blu-ray build (3): build_bluray_foundry.bat, build_bluray_foundry.py, BUILD_BLURAY_README.md
  • Foundry handoff (3): copy_foundry_handoff.bat, copy_foundry_handoff_wsl.sh, build_handoff_24.bat
  • Manufacturing flow: run_manufacturing_flow.bat
  • Yosys setup (5): build_yosys.sh, fix_yosys.sh, setup_yosys.sh, setup_yosys_oss_cad.sh, install_yosys_with_python.sh, use_oss_cad.sh
  • Utility: build_final_copy.bat, FIX_IT.bat/.sh, test_path.bat, Create_Desktop_Shortcut_OpenLANE_24.ps1
What Is in the Package
215 files across 44 directories . Breakdown by type:
  • Verilog (.v): 13 files — 5 RTL modules, 3 synthesised netlists, 5 testbenches
  • Python (.py): 6 files — seed_matrix_calculator.py, verify_and_test.py, verify_performance_layers.py, autophi_scale_calculator.py, build_bluray_foundry.py, gen_schematic.py
  • Markdown (.md): 74 files — architecture docs, integration guides, manufacturing flow, package READMEs, formula docs, valuation reports
  • Batch (.bat): 23 scripts — synthesis, OpenLANE, GDSII, simulation, build, and utility
  • Shell (.sh): 14 scripts — WSL/Linux equivalents for synthesis, OpenLANE, Yosys setup, and foundry handoff
  • Yosys (.ys): 4 synthesis scripts (light, quantum, hybrid, all)
  • Tcl (.tcl): 3 OpenLANE config files (130 nm, 14 nm, 7 nm)
  • JSON (.json): 8 files — OpenLANE config, synthesis outputs, computed output, seed matrix, MANIFEST
  • CSV (.csv): 9 files — computed output, seed matrix scenarios, seed matrix complete, BOMs (5 boards)
  • HTML (.html): 4 files — sales description, store product description, vault delivery instructions, video player
  • GDSII (.gds): 1 file — autophi_hybrid_cpu_top.gds (in GDSII_OUTPUT/ and FOUNDRY_HANDOFF/gdsii/)
  • DOT (.dot): 2 synthesis graph files (light_cpu, quantum_cpu)
  • KiCad (.kicad_sch): 3 schematics (DOF_HANDOFF, DOF_PROBE, DOF_TESTER)
  • SDC (.sdc): 1 timing constraints file
  • DEF (.def): 1 design constraints file
  • YAML (.yaml): 1 seed definition (SEED.yaml)
  • SVG (.svg): 1 hero image (21-day-one-fabrication-hero.svg)
  • PNG (.png): 1 product image (909.png)
  • CFF (.cff): 1 citation file (CITATION.cff)
  • TXT (.txt): Numerous notes, guides, and path references

Key Directory Layout

21-day-one-fabrication/ 24-autophi-scale/ AutoPhi Scale chip-series source rtl/ 5 synthesisable Verilog modules (1,206 lines) synthesis/ 4 Yosys scripts + 3 netlists + 3 JSON + 2 DOT graphs openlane/ 1 JSON + 3 TCL configs (130nm, 14nm, 7nm) constraints/ timing.sdc + design.def testbench/ 5 testbenches (1,211 lines) packages/ 8 foundry packages (TSMC, Samsung, Intel, SkyWater, GF, 14nm, 7nm, 1.5T) formulas/ calculators/ + light_trigger/ docs/ 14 architecture and integration documents instructions/ COLOR_INSTRUCTIONS.md + QUANTUM_INSTRUCTIONS.md scripts/ 42 automation scripts GDSII_OUTPUT/ autophi_hybrid_cpu_top.gds FOUNDRY_HANDOFF/ gdsii/, lef/, def/, netlist/ FOUNDRY_DELIVERY_PACKAGE/ SPECIFICATIONS/AUTOPHI_SCALE_SERIES.txt BluRay_24-full_20260227/ Disc-image-ready Blu-ray build Seeds/ SEED.yaml, seed_matrix_example.json, seed_matrix_template.csv Performance_And_COGS/ Chip series CPU/GPU/DPU tiers, code names, COGS summary FOUNDRY_HANDOFF/ Duplicate handoff for disc MANIFEST.txt + DISC_README.txt hardware/ 5 fabrication-support boards (DOF_PROBE, DOF_TESTER, DOF_ALIGN, DOF_YIELD, DOF_HANDOFF) seed_matrix_calculator.py 362-line Python calculator computed_output.csv / .json 8 computed scenarios seed_matrix_scenarios.csv 8 scenario inputs seed_matrix_complete.csv 2 template scenarios verify_and_test.py 90-test verification suite verify_performance_layers.py 579-test 47-layer verification suite verification_report.txt 90/90 pass (100.0%) verification_report_layers.txt 579/579 pass (100.0%) MANIFEST.json Machine-readable package manifest CITATION.cff Citation metadata LICENSE Proprietary — all rights reserved sales-description.html Customer-facing product page sales-pitches/ Product card, store description, vault delivery instructions

How this is delivered

This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.

Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.

Photo

Desktop CPU with a metal heat spreader on a dark surface

Footnotes

  1. Product number 8469.
  2. Family: fabrication writephi.
  3. Purchase: When you buy, you buy the use of that blueprint only.
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