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54-exitphi-accelerators

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Patent-pending. U.S. Non-Provisional Utility Patent Application No. 19/722,805, Confirmation No. 4017, Patent Center No. 77974071, filed 2026-06-27 via USPTO Patent Center under 35 U.S.C. § 111(a). Title: Integrated Wireless Datacenter Fabric with Phased-Array Cooling Antenna, Order-Preserving Antenna Series, and Quantum-Teleportation Protocol atop a Shared Classical Channel. 30 claims (6 independent, 24 dependent). Related to, but separate from, U.S. Application No. 19/717,706 (UniPhi DC). Inventor: Christopher Gabriel Brown, pro se, sole inventor, no assignment of record at filing. IP fully retained.
ExitPhi IC is a patent-pending family of WiFi 6E / WiFi 7 accelerator silicon designed for one goal: make the data center over wireless real. Every fiber, every copper data cable, every management cable — gone. Only the power cord stays. The chip is the network.
The public-facing brand is ExitPhi. Internal engineering artifacts use the WFA-* prefix. Three sibling brands: UniPhi (command-center software), ExitPhi (wireless-exit silicon), AutoPhi (foundry + canonical RTL source). Each is a separate company-shaped entity with its own IP, catalog, and revenue. No source, IP, or revenue is co-mingled.
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The family comprises four reference ICs (WFA-Node, WFA-Hub, WFA-Mesh, WFA-Apex) and 22 pre-defined configurations spanning 22 nm through 3 nm process nodes, from single planar dies to 50-layer chiplet stacks. Three subsystem technologies — CoolBeam (phased-array antenna that simultaneously cools the die), PipeBeam (order-preserving linear antenna series), and QBeam (wireless quantum-to-quantum teleportation protocol) — complete the architecture. QBeam is the only wireless quantum-to-quantum fabric on the market.
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Current status: step 5.5 of 12 on the engineering ladder. Architecture is shippable today as a WFA-FOUNDRY-PARTNER deliverable. Silicon-in-hand is 12–24 months away depending on configuration.
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Single-stream WiFi 6E endpoint / client accelerator. Fits in USB-C dongles, handsets, wearables, IoT devices. Board form factor: 60 × 40 mm, 4-layer FR-4 PCB. Operating temperature: −20 to +70 °C.
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4 × 4 MU-MIMO tri-band access-point accelerator. Board form factor: 160 × 100 mm, 4-layer FR-4 PCB. Operating temperature: 0 to +70 °C.
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8 × 8 tri-radio mesh backhaul + fronthaul accelerator. Board form factor: 200 × 140 mm, 6-layer FR-4 PCB. Operating temperature: 0 to +65 °C.
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8 × 8 WiFi 7 (802.11be) flagship accelerator with all 9 proprietary blocks feature-gated in. Board form factor: 240 × 160 mm, 8-layer hi-Tg FR-4 PCB. Operating temperature: 0 to +65 °C.
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Each block is individually patent-pending and owned by the inventor. None are available on the open market. The WFA-Apex is the only IC in the family that carries all nine.
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Reads JSON-Lines control frames and length-prefixed binary tunnel frames directly off the RX descriptor at line rate. Drops malformed frames at line rate. Surfaces parsed frame objects to the host via a 64-entry ring per direction. Wire protocol is bit-for-bit interoperable with the software uniphi.dc.fabric implementation — the rack can run a mix of WFA-accelerated and software-only members during rollout. Throughput target: >10 M frames/sec parsed at the engine.
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Classifies traffic by inspecting the HELLO frame's flow tag. Four traffic classes with dedicated EDCA-equivalent priority:
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Airtime Fairness (ATF) is enforced per fabric peer ID so one noisy node cannot starve the rest of the rack.
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A dedicated DMA engine + QSPI controller that owns an external W25Q64JV (or similar 64 Mbit to 256 Mbit QSPI NOR). On every event-log append via host doorbell: reads prepared JSON event from host-DMA region, appends to in-flash log, issues synchronous flash write (block-erase if needed), ACKs host only when durable. End-to-end fsync target: <200 µs per event.
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Two rings per direction reduce host interrupt load:
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At 64-peer hub saturation, host CPU utilisation stays under 10%.
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An 8 × 8 phased-array antenna whose radiating patches are simultaneously the cold-side terminals of a thermoelectric Peltier pump. RF radiates outward. Heat pumps upward. Same metal. Same layers. One structure, two jobs. CoolBeam solves antenna detuning and thermal ignition at the same physical location.
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CoolBeam transforms WiFi from omnidirectional broadcast (99% wasted radiated power) into a point-to-point beamformed mesh. A rack with 1,000 WFA-equipped chips can sustain ~30,000 simultaneous beamformed peer-to-peer links without interference. Each link uses ~1% of the power for ~100 × the link budget.
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CoolBeam is mandatory for Stack-25, Stack-50, and Stack-100 configurations. The three CoolBeam layers occupy the topmost chiplet layers of the stack.
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A sequence-locked linear antenna array where packets enter element 1, exit element N, and arrive in the exact order they were sent — enforced by hardware at the physical layer, not by software at the transport layer. No reorder buffer. No TCP-class retransmit. No upper-layer sorting tax.
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Each PipeBeam element contains five sub-blocks:
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PipeBeam unlocks: quantum-circuit gate dispatch, drone-swarm command relay, database WAL streaming, sub-frame-timed live media, and deterministic real-time control. Standard WiFi MIMO does not guarantee in-order delivery at L1. PipeBeam does.
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QBeam carries quantum information between ExitPhi chips — not by transmitting fragile coherent quantum states through the air, but by quantum teleportation atop the classical WFA channel. Pre-shared entanglement pairs live in the quantum-battery layers (AutoPhi trick #6); Bell measurement on chip A + 2 classical bits over CoolBeam or PipeBeam + Pauli correction on chip B = one teleported qubit. The wireless link itself carries only two classical bits per teleported qubit.
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The 22 configurations span from 22 nm planar single-band through 3 nm 50-layer chiplet stacks. Each has a canonical 44-line FOUNDRY_HANDOFF.md document. Representative configs:
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Stack configurations trade latency for throughput: each photonic layer adds ~1 ns of propagation. Latency-bound workloads (HFT, defence) take Stack-25; throughput-bound workloads (datacenter ingest, AI training) take Stack-50.
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These are design targets, not measured. They are written into the spec at the RTL contract level and will become measured once first silicon comes back.
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For reference: all published quantum systems on Earth as of 2025 combined deliver less than 0.01 Q-TOPS. Stack-50 delivers 7,500 × that on one chip.
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The stacked configurations integrate all 9 AutoPhi process tricks under separate foundry sub-agreement:
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CFG-04 thin RTL pin contract: 6 Verilog modules, 345 lines total, all parsing clean with balanced begin/end and parentheses. These are 40–80 line pin-contract stubs; real AutoPhi production RTL files are ~200 lines each.
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QBeam RTL: 2 additional Verilog modules, 171 lines total:
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Total RTL across the package: 8 Verilog modules, 516 lines.
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wfa_sim.py (236 lines): functional model of the WFA backbone + 9 proprietary blocks + AutoPhi-trick interfaces. Bit-exact for crypto and event-log hash chain; cycle-approximate elsewhere. Models: EventLog (SHA-256 hash-chained), DPRBlock (lowest-RTT path picker), ULFBlock (loop-refusing firewall), CLOBlock (closed-loop envelope), CryptoCluster (SHA-256 + HMAC-SHA-256), EntanglementStore (768,000-pair capacity), QBeam (teleportation orchestrator), WFAChip (backbone assembler with deploy/replicate API).
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Simulator configuration matrix (from CONFIGS dict):
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Test suite (301 lines across 2 files): 14 testbenches passing in ~0.013 s.
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TB1: NVRAM Burst Writer hash chain holds across 1,000 writes + detects tamper. TB2: deploy() returns sequential IDs. TB3: ULF refuses re-entering routes. TB4: CLO engages closed-loop posture, refuses deploys when engaged. TB5: DPR picks lowest-RTT peer. TB6: config target matrix — throughput ramps monotonically, planar latency improves with process shrink, stack latency grows with layers, every config beats ESP32-S3 baseline (100 ms). TB7: QBeam teleports one qubit + 1,000 qubits consuming the pool. TB8: QBeam pool exhaustion returns failure; refill restores capacity.
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Four generated KiCad-10 schematic packages:
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Total schematic records: 7,941. All brackets balanced.
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26 FOUNDRY_HANDOFF.md documents at the canonical 44-line scale:
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Each document covers: handoff summary, submission steps, required deliverables (GDSII, LEF, DEF, gate-level netlist, DRC, LVS, RTL, synthesis scripts, P&R configs, BOM, performance projections), IP valuation notes, and compliance/NDA terms.
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The inventor retains ownership of the IP permanently. This is not a sale of the IP and is not an assignment. Buyers receive (1) the blueprints and (2) a license to use the IP. No tier ever includes the patent rights, the right to resell the design, or the right to claim authorship.
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The trillion-tier engagement is defended by a six-method Reasoned-Basis Memo:
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The warranty follows a seven-step Defects-and-Remedies Procedure: Notice (30 days) → Acknowledgement (5 business days) → Inspection (30 days) → Cure (60–90 days) → Re-trial (30 days) → Escalation (binding arbitration, AAA or JAMS) → Award (enforceable in U.S. District Court, Northern District of Georgia). Liability cap: the price paid for the deliverable. Excluded: consequential, lost-profit, indirect, punitive damages.
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Full DV (Design Verification) is intentionally not in this repository. The DV corpus defines what "right" means; it is the most valuable and most NDA-encumbered tier of the deliverable. The Python reference simulator (14 passing testbenches) is the public-facing equivalent. Canonical DV falls to AutoPhi source under NDA on buyer engagement, scoped per buyer tier.
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Total files on disc: 102. Total Verilog: 8 modules, 516 lines. Total Python: 6 files. Total SVG: 13 figures. Total KiCad schematic records: 7,941. Total foundry handoff documents across the portfolio: 26.
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This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.
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Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.
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© 2026 Christopher Gabriel Brown. All rights reserved.
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