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40-autophi-bga256
This is the technical specification. The deliverable it describes is the full 40-autophi-bga256 blueprint package.
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Buy the whole description for $36.10Inventor / Licensor: Christopher Gabriel Brown, Lawrenceville, GA, USA. Patent posture: patent pending; method-claim filing in preparation covering the AutoPhi BGA package family, the two-phase interposer escape router, the dog-bone blind-via relocation technique, and the beat-grid via-collision mitigation. Coverage scope to be confirmed prior to engagement. All rights to seek additional patent protection are expressly reserved by the inventor. Underlying inventor corpus © 2017–2026 Christopher Gabriel Brown is referenced for provenance only and is not part of the distribution. Status: Release v1 frozen — canonical pinmap completion 256/256 (100%) on AUTOPHI_BGA256 and 1,536/1,536 (100%) on AUTOPHI_BGA1536, with the intermediate ladder (AUTOPHI_BGA576, AUTOPHI_BGA900, AUTOPHI_BGA1156) assigned and validating (0 TBD,
BGA_LIBRARY_VALIDATE: PASS). Board projects 35-autophi-quantum-pcie5 and 39-autophi-pcie5 consume these artifacts with schematic sync and KiCad CLI netlist export both reporting exit_code=0.Product 40 (
40-autophi-bga256) is the dedicated source-of-truth project for AutoPhi BGA component definitions. It is the single upstream from which every board project in the AutoPhi portfolio pulls its custom ball-grid-array symbols, footprints, and pinmaps. It owns the AutoPhi BGA library end-to-end: the KiCad footprint files (libs/footprints/AutoPhi.pretty/), the KiCad schematic symbols (libs/symbols/), the pinmap CSV tables (pinmaps/), the Python pipeline that regenerates each of those from the others (scripts/), the governance rules that stop board projects from forking them (docs/LIBRARY_GOVERNANCE.md), and a full interposer PCB (interposer/) that proves the largest package in the family (BGA-1536, 95 × 90 mm, 2.0 mm pitch) is actually routable on real HDI stackup with real vendor rules.The deliverable spans the full 92 mm mechanical envelope of the AutoPhi package family — from the 20 × 20 mm BGA-256 seed footprint on the small end, through the 32 mm-body BGA-576 / BGA-900 and 38 mm-body BGA-1156 mid-range, up to the 95 × 90 mm BGA-1536 flagship. The library is not a paper specification: every symbol was generated by script from its pinmap, every pinmap was walked back to its footprint's pad geometry, and every geometry step is reproducible from a single PowerShell one-liner (
Read section 3 for $1.90rebuild_provisional_seed.ps1) and validated by validate_bga_library.py. When the buyer wants to add a new AutoPhi BGA, the change control rule in LIBRARY_GOVERNANCE.md says all five artifacts (footprint, template pinmap, working pinmap, symbol, catalog row) land in the same commit — and the scripts here are what generate four of the five.What separates this package from a generic KiCad BGA library is the interposer escape work. The
Read section 4 for $1.90interposer/ directory carries a complete KiCad 8 PCB (autophi-1536-interposer.kicad_pcb, 5.3 MB) that fans out the BGA-1536 flagship at 2.0 mm board-side pitch to a 0.8 mm die-side pad grid across a 12-copper HDI stackup. Every via geometry, every clearance, every routing failure, and every one of the nine errors-worth-not-repeating is recorded in ESCAPE-THEORY.md with the measurements that produced them, the wrong predictions that preceded them, and the two-phase router (escape_router_v3.py, 30 kB) that resolves them. The result is a 956-of-960 signal balls given a legal via layer with dog-bone blind-via relocation applied on 92 of 96 colliding sites — the four unroutable balls are called out by name.Ratio invariance across the family (assigned). Every AutoPhi BGA in the catalog uses the same 25.0% / 12.5% / 62.5% ball-role split for GND / POWER / signal, and every power ball has an adjacent GND return (measured 112/112 on the BGA-900). Differential pairs sit on horizontally adjacent balls in the same row, HSIO is placed on the outer rings for short escape routes, and MGMT is in the middle band with POWER / GND on a checkerboard through the core. The ratios were read off the BGA-256 and BGA-1536 assignments rather than chosen freely, so the whole ladder is dimensionally self-consistent.
Read section 5 for $1.90The BGA-256 pinmap is the seed for the entire family and uses a 16 × 16 grid across rows A–T (I, O, Q, S skipped per JEDEC BGA convention) and columns 1–16. Every one of the sixteen rows is seeded with the same domain template so that any board project can route it without surprises:
Read section 6 for $1.90Rows seeded: A, B, C, D, E, F, G, H, J, K, L, M, N, P, R, T (16 rows, 256 balls total). Seed tag:
Read section 7 for $1.90domain-seed-v1. Name-promotion tag: canonical-name-seed-v1. Power-rail finalization tag: power-rail-seed-v1 / power-domain-normalize-v1. Post-promotion completion is 100% assigned across the whole 256-ball array in the frozen v1 release.The BGA library is treated as a strict source-of-truth pipeline. Every symbol is regenerated from a pinmap that was in turn generated from footprint pads, so drift between the three is measurable and refused by the validator:
Read section 8 for $1.90One-command reproducible rebuild: the entire seed-to-symbol path is scripted in
Read section 9 for $1.90scripts/rebuild_provisional_seed.ps1 with -Rows "A,B,C,D,E,F,G,H,J,K,L,M,N,P,R,T" and -SeedTag "domain-seed-v1". It normalizes, seeds, promotes provisional names, regenerates the symbol, prints the completion report, and drops a timestamped checkpoint into pinmaps/checkpoints/.The
Read section 10 for $1.90interposer/ directory carries a fully-populated KiCad PCB (autophi-1536-interposer.kicad_pcb) that fans out the flagship BGA-1536 across a 12-copper HDI stackup. Every number in the accompanying ESCAPE-THEORY.md was measured on the board file or derived from its geometry, including the wrong predictions that preceded each measurement:A ball landing on signal layer k needs two vias: a microvia spanning TOP→k (crossing k signal layers) and a blind via spanning k→BOTTOM (crossing N−k+1). The sum is N+1 for every k — the layer choice cancels:
Read section 11 for $1.90960 balls × 7 = 6,720 barrel-layer crossings ÷ 6 = 1,120 via keepouts per signal layer, invariant under any assignment. Measured layer load on the full run came out 160 / 159 / 159 / 160 / 159 / 159 — exactly 960 ÷ 6. Doubling stackup from 6 to 12 signal layers buys 7% because the load scales as (N+1)/N. Layer balancing is still worth doing because it balances trace congestion (measured: failures fell from 56 to 37 on a 250-ball sample when layer choice went from shallow-first to least-loaded-first) — but not via congestion.
Read section 12 for $1.90Identical. Trace pitch is not what is choking the escape; via placement is.
Read section 13 for $1.900.8 mm die and 2.0 mm board on a shared origin, ratio 2.5 — not an integer. The grids drift in and out of phase. 240 board pads land within 0.50 mm of a die pad; closest pair 0.283 mm. At that distance a 0.20 mm microvia pad and a 0.40 mm blind via pad physically overlap — no clearance rule reaches it. All 36 tested translations of the BGA grid (0 to 1.0 mm in 0.2 mm steps, both axes) were worse than or equal to the design as drawn. The board is already at the optimum offset. The collision is an ordering constraint, not a wall: microvia (TOP→L) and blind via (L′→BOTTOM) miss whenever L is shallower than L′.
Read section 14 for $1.90Stop putting the via in the pad. Offset it, and join the two with a short neck on BOTTOM. Applied to the board: 92 of 96 colliding blind vias relocated, 89 of them needing only 0.25 mm, max 0.60 mm. Four had nowhere legal to go. DRC unchanged — no new violations.
Read section 15 for $1.90Board projects consume artifacts from this package rather than defining BGA data ad hoc. Change control refuses forks: the
Read section 16 for $1.90LIBRARY_GOVERNANCE.md rule states any new AutoPhi BGA requires all five artifacts (footprint, template pinmap, working pinmap, symbol, catalog row) landing in the same change set. Commodity components (R, C, L, FB, standard connectors, stable vendor IC footprints) remain reused from standard KiCad libraries — the "own AutoPhi, borrow commodity" rule.The
Read section 17 for $1.9040-autophi-bga256 package inherits the LED Power Recycling element from the nine-tech AutoPhi architecture. Three third-party patents represent the most relevant prior art in that specific slice and are documented in PRIOR_ART_LED_RECYCLING.md for research completeness — not as licensor-owned IP:Defensible angle: the BGA-256 package + the integrated nine-tech AutoPhi stack is the patentable target, not the LED-recycle slice taken in isolation.
Read section 18 for $1.90This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.
Read section 19 for $1.90Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.
Read section 20 for $1.90© 2026 Christopher Gabriel Brown. All rights reserved.
Read section 21 for $1.90