28-new-path-heights

AES wafer preparation follows a seven-step sequence: (1) Czochralski ingot growth from a controlled 88:12 Cu:Sn melt at 960 °C, pulling at 1–2 mm/hour with a [100]-oriented seed crystal to produce a 310 mm-diameter × 600 mm boule; (2) X-ray diffraction verification of single-crystal alpha-phase uniformity; (3) diamond wire saw slicing into 300 mm, 775 μm-thick wafers (~700 wafers per boule); (4) double-sided lapping to 5 μm TTV; (5) CMP with Cu-Sn-specific colloidal silica slurry to <0.2 nm RMS surface roughness; (6) modified RCA cleaning (SC-1 + citric acid rinse + SC-2 + megasonic DI water); (7) automated surface inspection rejecting wafers with >0.1 particles/cm² at ≥90 nm or crystal defects >1 μm.

Every compound in the 2,000-entry database is evaluated on a 0–100 point scale, composed of four weighted categories:

Outcome Per Element is calculated separately by aggregating performance points — electron mobility contribution (0–30), thermal conductivity contribution (0–20), breakdown voltage contribution (0–20), technology maturity contribution (0–15), scalability contribution (0–15) — for a total outcome score of 0–100, then dividing by the number of elements in the compound. Materials are ranked by semiconductor score (primary) and outcome per element (secondary).

The full 2,000-compound database is available in both CSV and JSON formats with a RAG (Retrieval-Augmented Generation) assembly providing structured metadata, searchable text representations, semantic tags, and fast lookup indices (by name, element, cost category, function, score range, and tag). The RAG assembly supports exact match queries, range queries, semantic queries, and natural language queries, and is formatted for vector database integration.

Database cost distribution: Medium-High: 557 compounds; High: 395; Low: 357; Very High: 271; Medium: 233; Very Low: 187.

The material-discovery methodology, scoring algorithm, and RAG assembly system are covered by a non-provisional utility patent application filed with the United States Patent and Trademark Office.

Key claim areas across the 50 claims: (1) Material discovery module generating a database of semiconductor compounds with cost, function, and electrical-property analysis; (2) Scoring module calculating a 0–100 semiconductor score with four weighted categories plus outcome-per-element calculation and material ranking; (3) RAG assembly module creating structured metadata, searchable text, semantic tags, fast lookup indices, and vector database formatting; (4) Integrated system combining all three components; (5) Method claims covering the step-by-step discovery, scoring, and indexing process; (6) Computer-readable medium storing instructions to perform the method; (7) Output in JSON, CSV, and RAG-ready formats for AI integration.

Project 15 provides manufacturing instructions and specifications for a 10 mm-tall, 32-layer, 8-trillion-transistor, 100 YFLOPS integrated circuit using AES as the primary semiconductor substrate, integrating the AutoPhi V19-Pinnacle architecture. The final deliverable is a PCIe Half-Height Half-Length (HHHL) card — 167.65 mm × 68.90 mm — that plugs into any standard server or workstation.

The complete fabrication method is classified as a trade secret. The buyer receives the full, unredacted manufacturing instructions upon licensing. The description below outlines the scope of what is included without revealing the proprietary process details.

The method documents cover the entire path from raw AES ingot to finished PCIe card:

The complete 28-new-path-heights/ source tree includes:

Total files: 62. Categories: .md (34), .html (7), .py (5), .svg (5), .pdf (4), .docx (2), .gz (1), .enc (1), .csv (1), .json (1), LICENSE (1).

Patent posture: USPTO application 19/449,352 (50 claims, filed January 14, 2026) covers the semiconductor material discovery, scoring, and RAG assembly system. The method-discovery work (Project 15) may be the subject of a future filing or extension. All intellectual property rights remain with Christopher Gabriel Brown / CRI-ONE. No IP transfer is implied by any purchase tier. Commercial use requires a separate licensing agreement.

Inventor: Christopher Gabriel Brown, 1341 Wellington Cove, Lawrenceville, GA 30043-5255, USA. Contact: crioneaka@outlook.com | 770-776-7023.

Project maturity: L1 (Research).

This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.

Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.