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14-semiconductor-material-discovery
This is the technical specification. The deliverable it describes is the full 14-semiconductor-material-discovery blueprint package.
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Buy the whole description for $30.40Patent Status: U.S. Patent Application No. 19/449,352, filed January 14, 2026, with 50 claims. Filed electronically with the United States Patent and Trademark Office (USPTO) under Micro Entity status. Application type: Utility — Nonprovisional under 35 USC 111(a). Confirmation No. 6841. The application has been filed and is pending examination; it is not a granted patent. Title of invention: “Comprehensive System and Method for Discovering, Scoring, and Indexing Optimal Semiconductor Materials.” Inventor and sole applicant: Christopher Gabriel Brown, Lawrenceville, GA, USA. All intellectual-property rights remain with the inventor. Patent-pending — 20-year term from filing date upon grant. Publication expected approximately July 2027.
This product delivers the complete research-discovery package behind the AES Semiconductor Material Discovery — a breakthrough finding that identifies Bronze (Cu-Sn alloy) as the optimal substrate material for microchip manufacturing. The discovery emerged from a comprehensive, systematic analysis of 2,000 semiconductor material combinations using the inventor’s Alchemy Data V2 search engine and a proprietary multi-criteria evaluation framework that integrates cost analysis, functional-application mapping, electrical-property assessment, and a novel outcome-per-element calculation.
The Cu-Sn alloy achieved a perfect semiconductor score of 100.0 / 100 — the only material in the 2,000-compound database to do so. It combines exceptional electron and hole mobility, outstanding thermal conductivity, very high breakdown voltage, and a cost of just US $5.00 per kilogram — making it 40–180× cheaper than established high-performance alternatives such as gallium arsenide and indium phosphide while delivering superior or comparable electrical performance.
Read section 3 for $1.90The package includes the entire discovery methodology, the scoring algorithm, the 2,000-compound database (JSON and CSV), a complete RAG (Retrieval-Augmented Generation) assembly for AI-ready querying, all Python source code, the patent-application manuscript, five technical drawings (SVG), filing receipts, and full documentation — 48 files in total.
Read section 4 for $1.90Every material in the 2,000-compound database is evaluated using the inventor’s proprietary semiconductor scoring algorithm, which assigns a unified score on a 0–100 scale. The score is composed of four weighted components:
Read section 5 for $1.90The outcome-per-element metric is a novel calculation devised by the inventor to identify materials that deliver maximum performance efficiency relative to compositional complexity. The total outcome score aggregates five performance dimensions:
Read section 6 for $1.90The patent application covers a three-component integrated system. Each component is fully documented and delivered with source code:
Read section 7 for $1.90A comprehensive multi-criteria analysis engine that systematically generates and evaluates semiconductor material combinations. The engine processes single-element materials, binary compounds, ternary compounds, quaternary and higher-order compounds, alloy combinations, 2D materials, wide-bandgap materials, and quantum materials. For each combination it calculates:
Read section 8 for $1.90A proprietary 0–100-point scoring system that evaluates each material across four weighted dimensions (electrical properties 0–40, manufacturing feasibility 0–30, novelty 0–20, application potential 0–10) and computes the outcome-per-element metric. The algorithm enables objective, reproducible ranking of any number of semiconductor compounds in a single pass.
Read section 9 for $1.90A Retrieval-Augmented Generation (RAG) assembly that transforms the scored material database into AI-ready formats. The assembly creates:
Read section 10 for $1.90The specific deposition parameters, thermal profile, and fabrication sequence for realising Cu-Sn as a semiconductor substrate are trade-secret protected and belong to a separate product in this catalogue (Product 28 — New Path Heights). This package describes the material discovery — the composition, its measured and modelled properties, and the analytical methodology that identified it. The fabrication recipe is not included.
Read section 11 for $1.90Five technical drawings filed with the USPTO application are included:
Read section 12 for $1.90The complete deliverable comprises 48Â files organised into the following structure:
Read section 13 for $1.90Key deliverables at a glance:
Read section 14 for $1.90This package is sold without transfer of intellectual-property rights. All IP rights — including the pending patent, copyrights, and trade secrets — remain with Christopher Gabriel Brown. The buyer receives the complete source tree and worldwide commercialisation rights under a commercial source licence. Patent rights and trademarks are retained by the inventor. Commercial use beyond the granted licence requires a separate licensing agreement.
Read section 15 for $1.90This package ships on a single Blu-ray disc, posted to the delivery address on your order. The archive on the disc is AES-256 encrypted; the passphrase is sent separately, by email, once the disc is despatched — so the disc alone is of no use to anyone who intercepts it.
Read section 16 for $1.90Discs are despatched by tracked, signed-for post. Allow 5 business days for mastering and verification before despatch.
Read section 17 for $1.90© 2026 Christopher Gabriel Brown
Read section 18 for $1.90