{"id":908770,"date":"2026-06-22T03:32:51","date_gmt":"2026-06-22T03:32:51","guid":{"rendered":"http:\/\/cri-one-archive-dep-331"},"modified":"2026-06-22T03:32:51","modified_gmt":"2026-06-22T03:32:51","slug":"the-origin-of-archive-invent-deposition-331-2","status":"publish","type":"post","link":"https:\/\/cri-one.com\/blog\/2026\/06\/22\/the-origin-of-archive-invent-deposition-331-2\/","title":{"rendered":"The Origin of Second Third Level Processing Unit &#8212; Computing &#038; Semiconductors Series &#8212; Invent Deposition #331"},"content":{"rendered":"<p><strong>FIRST TO MARKET<\/strong> &middot; Publicly documented in the 2017 <em>Invent Depositions<\/em> corpus &middot; Deposition #331.<\/p>\n<blockquote>\n<p>&ldquo;second and third level + processing unit interchanging socket to compose another central based chip socket with alternate sub levels of chip sockets. generally considered non central or additional solder and molded chips for example a replaceable second a copyright \u00a9 2017 chris g brown&rdquo;<br \/>&mdash; Christopher Gabriel Brown<\/p>\n<\/blockquote>\n<h3>Recognized properties<\/h3>\n<ul>\n<li><strong>Sector:<\/strong> Computing &amp; Semiconductors<\/li>\n<li><strong>Keywords:<\/strong> second,  socket,  central,  chip,  third,  level,  processing,  unit,  interchanging,  compose,  another,  based<\/li>\n<li><strong>Key phrases:<\/strong> third level processing  &middot;  alternate sub levels  &middot;  molded chips  &middot;  example replaceable second<\/li>\n<\/ul>\n<p><em>Provenance:<\/em> original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed <em>Invent Depositions<\/em> book scan (Deposition #331).<\/p>\n<hr>\n<p>&copy; Christopher Gabriel Brown &middot; Patent Pending &middot; IP retained by CRI-ONE<\/p>\n","protected":false},"excerpt":{"rendered":"<p>FIRST TO MARKET &middot; Publicly documented in the 2017 Invent Depositions corpus &middot; Deposition #331. &ldquo;second and third level + processing unit interchanging socket to compose another central based chip socket with alternate sub levels of chip sockets. generally considered non central or additional solder and molded chips for example a replaceable second a copyright [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[627],"tags":[],"class_list":["post-908770","post","type-post","status-publish","format-standard","hentry","category-gallery"],"_links":{"self":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts\/908770","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/comments?post=908770"}],"version-history":[{"count":1,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts\/908770\/revisions"}],"predecessor-version":[{"id":911067,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts\/908770\/revisions\/911067"}],"wp:attachment":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/media?parent=908770"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/categories?post=908770"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/tags?post=908770"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}