{"id":50997,"date":"2026-06-20T06:37:05","date_gmt":"2026-06-20T06:37:05","guid":{"rendered":"http:\/\/cri-one-archive-dep-1177"},"modified":"2026-06-20T06:37:05","modified_gmt":"2026-06-20T06:37:05","slug":"the-origin-of-archive-invent-deposition-1177","status":"publish","type":"post","link":"https:\/\/cri-one.com\/blog\/2026\/06\/20\/the-origin-of-archive-invent-deposition-1177\/","title":{"rendered":"The Origin of Soft Silica Chip Insulator Film &#8212; Computing &#038; Semiconductors Series &#8212; Invent Deposition #1177"},"content":{"rendered":"<p><strong>FIRST TO MARKET<\/strong> &middot; Publicly documented in the 2017 <em>Invent Depositions<\/em> corpus &middot; Deposition #1177.<\/p>\n<blockquote>\n<p>&ldquo;soft silica chip insulator film that would enable vertical chip branching and layers of no conducting parts of chips in a fashion to layer other chip parts to conduct a pseudo balanced and compressed level of conductivity copyright (c) 2017 chris gabriel brown&rdquo;<br \/>&mdash; Christopher Gabriel Brown<\/p>\n<\/blockquote>\n<h3>Recognized properties<\/h3>\n<ul>\n<li><strong>Sector:<\/strong> Computing &amp; Semiconductors<\/li>\n<li><strong>Keywords:<\/strong> chip,  parts,  soft,  silica,  insulator,  film,  enable,  vertical,  branching,  layers,  conducting,  chips<\/li>\n<li><strong>Key phrases:<\/strong> soft silica chip  &middot;  enable vertical chip  &middot;  layers conducting parts  &middot;  chip parts conduct  &middot;  compressed level conductivity<\/li>\n<\/ul>\n<p><em>Provenance:<\/em> original 2017 catalog artwork recovered from buyinvent.com via the Internet Archive Wayback Machine; OCR text from the printed <em>Invent Depositions<\/em> book scan (Deposition #1177).<\/p>\n<hr>\n<p>&copy; Christopher Gabriel Brown &middot; Patent Pending &middot; IP retained by CRI-ONE<\/p>\n","protected":false},"excerpt":{"rendered":"<p>FIRST TO MARKET &middot; Publicly documented in the 2017 Invent Depositions corpus &middot; Deposition #1177. &ldquo;soft silica chip insulator film that would enable vertical chip branching and layers of no conducting parts of chips in a fashion to layer other chip parts to conduct a pseudo balanced and compressed level of conductivity copyright (c) 2017 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[627],"tags":[],"class_list":["post-50997","post","type-post","status-publish","format-standard","hentry","category-gallery"],"_links":{"self":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts\/50997","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/comments?post=50997"}],"version-history":[{"count":1,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts\/50997\/revisions"}],"predecessor-version":[{"id":907420,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/posts\/50997\/revisions\/907420"}],"wp:attachment":[{"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/media?parent=50997"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/categories?post=50997"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/cri-one.com\/blog\/wp-json\/wp\/v2\/tags?post=50997"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}