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The second embodiment in the consolidated patent application 19\/540,453 is a unified processor product\u2014internally referred to as AutoPhi Modern\u2014that consolidates CPU, GPU, and data processors into a single \u201cComplete Unit.\u201d Rather than shipping separate processor lineages, the product is one architecture with multiple form-factor projections: MicroSDXC, PCIe, and socket. The same unit can be delivered as a card, a board, or a socketed part.<\/p>\n
The Complete Unit provides a CPU domain and an accelerator domain in a single-chip (or equivalent) architecture. It incorporates nine technology elements and morphisms from prior branches (e.g., Scale 24\u201327, Quantum\/REV 02\/10\/12\/17, MicroSDXC 11). One handoff includes product documentation and a copy script that pulls all included projects into a single deliverable (e.g., an included_projects\/ structure), so licensees or partners get a coherent tree of design and documentation.<\/p>\n
Scale tiers allow the same design to target different performance and cost points. The accelerator domain is where GPU and data-processing workloads live alongside the CPU, enabling a single package to serve general computing, graphics, and specialized data tasks. For embedded, edge, and data-center use cases, one SKU can replace multiple discrete parts.<\/p>\n
This embodiment is fully described in the patent specification with reference to Figure 2 (isometric view of chip die, pin row, and exploded form-factor projections). The filing date of the overall portfolio is February 13, 2026; Application # 19\/540,453 and Patent Center # 74480330 identify the case in all USPTO and licensee correspondence.<\/p>\n
Source: US Patent Application 19\/540,453, Section 8.2 and Claims.<\/em><\/p>\n [\/lcus_masonry_article]<\/p>\n <\/p>\n